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1.
Faced with multiple electronic devices, service providers, and ISPs, tomorrow's mobile users might find it challenging to identify available services and acquire the rights to use them. The authors tackle this problem, combining the acquisition of role-based credentials with servicediscovery.  相似文献   
2.
Wafer-level Cu–Sn intermetallic bonding is an interesting process for advanced applications in the area of MEMS and 3D interconnects. The existence of two intermetallic phases for Cu–Sn system makes the wafer bonding process challenging. The impact of process parameters on final bonding layer quality have been investigated for transient liquid phase wafer-level bonding based on the Cu–Sn system. Subjects of this investigation were bonding temperature profile, bonding time and contact pressure as well as the choice of metal deposition method and the ratio of deposited metal layer thicknesses. Typical failure modes in intermetallic compound growth for the mentioned process and design parameters have been identified and were subjected to qualitative and quantitative analysis. The possibilities to avoid abovementioned failures are indicated based on experimental results.  相似文献   
3.
A model (consisting of rv-systems), a core programming language (for developing rv-programs), several specification and analysis techniques appropriate for modeling, programming and reasoning about interactive computing systems have been recently introduced by Stefanescu using register machines and space-time duality, see [Stefanescu, G. Interactive systems with registers and voices. Fundamenta Informaticae 73 (2006), 285–306. (Early draft, School of Computing, National University of Singapore, July 2004.)]. After that, Dragoi and Stefanescu have developed structured programming techniques for rv-systems and their verification, see, e.g., [Dragoi, C., and G. Stefanescu. Structured programming for interactive rv-systems. Institute of Mathematics of the Romanian Academy, IMAR Preprint 9/2006, Bucharest 2006. Dragoi, C., and G. Stefanescu. Towards a Hoare-like logic for structured rv-programs. Institute of Mathematics of the Romanian Academy, IMAR Preprint 10/2006, Bucharest, 2006. Dragoi, C., and G. Stefanescu. Implementation and verification of ring termination detection protocols using structured rv-programs. Annals of University of Bucharest, Mathematics-Informatics Series, 55 (2006), 129–138. Dragoi, C., and G. Stefanescu. Structured interactive programs with registers and voices and their verification. Draft, Bucharest, January 2007. Dragoi, C., and G. Stefanescu. On compiling structured interactive programs with registers and voices. In: “Proc. SOFSEM 2008,” 259–270. LNCS 4910, Springer, 2008.].In the present paper a kernel programming language AGAPIA v0.1 for interactive systems is introduced. The language contains definitions for complex spatial and temporal data, arithmetic and boolean expressions, modules, and while-programming statements with their temporal, spatial, and spatio-temporal versions. In AGAPIA v0.1 one can write programs for open processes located at various sites and having their temporal windows of adequate reaction to the environment. The main technical part of the paper describes a typing system for AGAPIA v0.1 programs.  相似文献   
4.
Although apparently simple, the polycondensation reaction leading to polyazomethine is difficult to control because of its equilibrium character, the conversion degree being influenced by a series of parameters. The reaction between a siloxanediamine, 1,3‐bis(3‐aminopropyl)tetramethyldisiloxane, and terephthalaldehyde was performed here in solution (in tetrahydrofuran) without by‐products removal and in absence of any catalyst or pH modifier. Different conditions (co‐monomers ratio, dilution, and temperature), considered as input parameters for the process modeling, were varied according to a pre‐established experimental program. The viscosity of the reaction mixture was chosen as output parameter, being monitored with a Haake Viscotester 7 Plus‐L. The process modeling was performed using a hybrid combination of artificial neural networks and differential evolution algorithm, the last one having the role of developing the neural model in an optimal form. The simulation results showed that the methodology provides accurate results, the model predictions being in close correlation with the experimental data. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42552.  相似文献   
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6.
Existing models of operant learning are relatively insensitive to historical properties of behavior and applicable to only limited data sets. This article proposes a minimal set of principles based on short-term and long-term memory mechanisms that can explain the major static and dynamic properties of operant behavior in both single-choice and multiresponse situations. The critical features of the theory are as follows: (a) The key property of conditioning is assessment of the degree of association between responses and reinforcement and between stimuli and reinforcement; (b) the contingent reinforcement is represented by learning expectancy, which is the combined prediction of response–reinforcement and stimulus–reinforcement associations; (c) the operant response is controlled by the interplay between facilitatory and suppressive variables that integrate differences between expected (long-term) and experienced (short-term) events; and (d) very-long-term effects are encoded by a consolidated memory that is sensitive to the entire reinforcement history. The model predicts the major qualitative features of operant phenomena and then suggests an experimental test of theoretical predictions about the joint effects of reinforcement probability and amount of training on operant choice. We hypothesize that the set of elementary principles that we propose may help resolve the long-standing debate about the fundamental variables controlling operant conditioning. (PsycINFO Database Record (c) 2011 APA, all rights reserved)  相似文献   
7.
0.89(Na0.5Bi0.5)TiO3–0.11BaTiO3, (BNT-BT0.11) thin film was fabricated by sol–gel/spin coating process, on platinized silicon wafer. Perovskite structure with random orientation of crystallites has been obtained at 700 °C. Piezoelectric activity of BNT-BT0.11 thin film was detected using piezoresponse force microscopy (PFM). Effective piezoelectric coefficient d 33eff of such film, recorded at 5 V applied dc voltage, was ~29 pm/V, which is similar to other BNT-BT x thin films. The complex refractive index and dielectric function of BNT-BT0.11 thin films were also investigated. The high leakage current density significantly influences the dielectric, ferroelectric, and piezoelectric properties of the BNT-BT0.11 films.  相似文献   
8.
The mixing efficiency in a split-cylinder gas-lift bioreactor has been analyzed for Yarrowia lipolytica cells suspensions. Based on the experimental results, three different approaches for modeling have been applied to predict the mixing time depending on yeast concentration, aeration rate, as well as position on the riser or downcomer regions height. These approaches are represented by: an algorithm mixing differential evolution (DE) with artificial neural networks (ANNs), named hSADE-NN, regression, and the Multilayer Perceptron module from IBM SPSS. In the hSADE-NN, ANN models the process, while DE simultaneously optimizes the topology and the internal parameters of the ANN, so that an optimal model is obtained. It was found from simulations that ANNs are able to model the targeted process with a high degree of efficiency (average absolute relative error less than 8.5%), a small difference among the two ANN-based approaches being observed. Additionally, a sensitivity analysis was performed for determining the model inputs influence on the mixing time.  相似文献   
9.
随着微电子机械系统新应用的不断推出,使得特殊制造工艺技术得到空前的发展。在过去的10年里,汽车是微电子机械系统产品商业化的推动力。如今,我们进入了以消费品和信息技术的产品占很高份额的微电子机械系统生产制造的新时代,如微射流器件,微光电子机械系统,射频微电子机械系统,非汽车应用加速度器和陀螺等。阐述用于商业化的如上所述器件的新制造工艺技术,即用全自动轨道传送光刻系统来实现低成本的紫外线光刻工艺,以及用于加速度器和陀螺等消费品的高真空键合制造工艺技术。  相似文献   
10.
CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration   总被引:1,自引:0,他引:1  
Wafer bonding became during past decade an important technology for MEMS manufacturing and wafer-level 3D integration applications. The increased complexity of the MEMS devices brings new challenges to the processing techniques. In MEMS manufacturing wafer bonding can be used for integration of the electronic components (e.g. CMOS circuitries) with the mechanical (e.g. resonators) or optical components (e.g. waveguides, mirrors) in a single, wafer-level process step. However, wafer bonding with CMOS wafers brings additional challenges due to very strict requirements in terms of process temperature and contamination. These challenges were identified and wafer bonding process solutions will be presented illustrated with examples.  相似文献   
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