Development of Stretch Solder Interconnections for Wafer Level Packaging

A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.     

Swelling properties of chemically modified oil palm empty fruit bunch based polyurethane composites

In this study, the diffusion of various types of solvent in oil palm empty fruit bunch/polyurethane composites, produced from chemically modified empty fruit bunches, was investigated. The solubility parameters and polymer–solvent interaction parameters of the produced composites were determined. The void contents of the composites were also determined before swelling tests to eliminate the free solvent present in the system. From the results obtained, we found that the diffusion of the solvents was dependent on the compatible group available and the voids present in the system. The solubility parameters of the empty fruit bunch/polyurethane composites with different degrees of chemical modification were 11.6 and 11.7 (cal/cm^?3)^1/2. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

A common genetic variation in the 3'-untranslated region of the prothrombin gene is associated with elevated plasma prothrombin levels and an increase in venous thrombosis

We have examined the prothrombin gene as a candidate gene for venous thrombosis in selected patients with a documented familial history of venous thrombophilia. All the exons and the 5'- and 3'-UT region of the prothrombin gene were analyzed by polymerase chain reaction and direct sequencing in 28 probands. Except for known polymorphic sites, no deviations were found in the coding regions and the 5'-UT region. Only one nucleotide change (a G to A transition) at position 20210 was identified in the sequence of the 3'-UT region. Eighteen percent of the patients had the 20210 AG genotype, as compared with 1% of a group of healthy controls (100 subjects). In a population-based case-control study, the 20210 A allele was identified as a common allele (allele frequency, 1.2%; 95% confidence interval, 0.5% to 1.8%), which increased the risk of venous thrombosis almost threefold {odds ratio, 2.8; 95% confidence interval, 1.4 to 5.6}. The risk of thrombosis increased for all ages and both sexes. An association was found between the presence of the 20210 A allele and elevated prothrombin levels. Most individuals (87%) with the 20210 A allele are in the highest quartile of plasma prothrombin levels (> 1.15 U/mL). Elevated prothrombin itself also was found to be a risk factor for venous thrombosis.     

Failure of Ixodes ticks to inherit Borrelia afzelii infection

To define conditions promoting inherited infection by Lyme disease spirochetes in Ixodes ticks, we variously infected ticks with Borrelia afzelii and examined their progenies by dark-field microscopy, immunofluorescence, PCR, and serial passage. No episode of inherited infection was evident, regardless of instar or gender infected or frequency of exposure. We suggest that these spirochetes rarely, if ever, are inherited by vector ticks.     

测试与最后工序之融合

目前,半导体工业正以飞快速度不断发展变化。面对成本压力和新封装技术,制造业和设备供货商们在设备能力、工艺和自动控制方面持续不断地加以更新和改进。在测试与最后工序领域中,成功的自动化解决方案是使测试与最后工序相结合,即从根本上转变它的设计形式而大幅度提高效率。它不仅包括大量已封装好的独立组件及高平行性的测试系统,也包括合并高速的最后工序系统。     

Interface Reaction Between Electroless Ni–Sn–P Metallization and Lead-Free Sn–3.5Ag Solder with Suppressed Ni3P Formation

The voids formed in the Ni₃P layer during reaction between Sn-based solders and electroless Ni–P metallization is an important cause of rapid degradation of solder joint reliability. In this study, to suppress formation of the Ni₃P phase, an electrolessly plated Ni–Sn–P alloy (6–7 wt.% P and 19–21 wt.% Sn) was developed to replace Ni–P. The interfacial microstructure of electroless Ni–Sn–P/Sn–3.5Ag solder joints was investigated after reflow and solid-state aging. For comparison, the interfacial reaction in electroless Ni–P/Sn–3.5Ag solder joints under the same reflow and aging conditions was studied. It was found that the Ni–Sn–P metallization is consumed much more slowly than the Ni–P metallization during soldering. After prolonged reaction, no Ni₃P or voids are observed under SEM at the Ni–Sn–P/Sn–3.5Ag interface. Two main intermetallic compounds, Ni₃Sn₄ and Ni₁₃Sn₈P₃, are formed during the soldering reaction. The reason for Ni₃P phase suppression and the overall mechanisms of reaction at the Ni–Sn–P/Sn–3.5Ag interface are discussed.     

Analytical design of 3-D wavelet filter banks using themultivariate Bernstein polynomial

The design of 3-D multirate filter banks where the downsampling/upsampling is on the FCO (face centred orthorhombic) lattice is addressed. With such a sampling lattice, the ideal 3-D sub-band of the low-pass filter is of the TRO (truncated octahedron) shape. The transformation of variables has been shown previously to be an effective technique for designing M-D (multidimensional) filter banks. A design technique is presented for the transformation function using the multivariate Bernstein polynomial which provides a good approximation to the TRO sub-band shape. The method is analytically based and does not require any optimisation procedure. Closed form expressions are obtained for the filters of any order. Another advantage of this technique is that it yields filters with a flat frequency response at the aliasing frequency (ω₁, ω₂ , ω₃)=(π, π, π). This flatness is important for giving regular discrete wavelet transform systems     

Regulation and Reconstruction of Cell Phenotype Gradients Along the Tendon-Bone Interface

Tendon–bone interface is prevalent in the human body. It is divided into four zones: tendon (soft tissue), unmineralized fibrocartilage, mineralized fibrocartilage, and bone (hard tissue). Tendon–bone interface is characterized by a cell phenotype gradient that appears in the different zones. The cell phenotype gradients at the tendon–bone interface are orchestrated by specific intracellular molecular mechanisms, extracellular factors, immune signals, and neurovascular factors. These features have inspired scientists to design systems that mimic natural cell phenotype gradients. These biomimetic systems include the construction of cell sheets, regulation of cellular microenvironments, and the design of gradient functional scaffolds. Exploration of methods to mimic cell phenotype gradients is instructional for future clinical applications in reconstituting the tendon–bone interface. The present review elucidates the gradient composition of the tendon–bone interface. The associated regulatory mechanisms and applications are discussed, with the anticipation of creating a mise en scène for future research in interface tissue engineering.     

A model for calculating channel share of 802.11 access points with overlapping wireless cells

Consider a collection of 802.11 access points. Each serves as the gateway to the Internet for clients in its WiFi cell. These cells have an arbitrary interference pattern, and reception at a client may be corrupted by transmissions nearby. The popularity of WiFi has made such dense deployment increasingly common. As interference can seriously degrade performance, there is much interest in optimizing the configuration of these cells. One factor to consider in optimization is channel share, defined as the useful fraction of channel bandwidth that an access point gets when there is downlink traffic saturation. Interference affects channel share on the sender side through carrier sensing and transmission deferral, and on the receiver side through collisions, which result in exponential backoff and retransmission. There exists a simple, “back-of-the-envelope” (BoE) technique to model the impact of pairwise sender-side interference. This paper tackles the harder task of determining the impact of receiver-side and non-pairwise sender-side interference. It proposes a technique for modeling the channel share of wireless links, and the accuracy is demonstrated with Qualnet simulation.     

First Harmonic (2f) Characterisation of Resonant Frequency and Q-Factor of Micromechanical Transducers

In this paper, the response to the first harmonic component (2f) of the electrostatic force in single terminal driven electrostatic comb-drive and parallel-plate drive was used as a signal to extract device parameters, namely, the Q-factor and resonant frequency instead of the fundamental (1f) resonance response. It is shown that the difficulty in motional measurement due to electrical cross-talk (parasitics) using 1f measurement can be overcome with a higher signal-to-noise ratio of the 2f signal. Both atmospheric (low-Q) and reduced pressure environment were investigated using off-chip electronics and lock-in amplifier. The measurements were done on the electrostatic comb-drive and capacitive parallel plate sensing plates that form the two core modules of a yaw rate sensor (dual-axis resonator). The effects of AC and DC bias voltages on the measured response have been investigated. Experimental amplitude and phase response data have been analysed using the Lorentzian curve-fit, Resonance Curve Area (RCA) method, the half-power bandwidth method (3 dB) and the Nyquist plot for data fitting and determination of the Q-factor and resonance frequency.