首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   2篇
  免费   0篇
金属工艺   1篇
冶金工业   1篇
  1999年   1篇
  1998年   1篇
排序方式: 共有2条查询结果,搜索用时 0 毫秒
1
1.
2.
The effects of Cu infiltration on the monotonic fracture resistance and fatigue crack growth behavior of a powder metallurgy (P/M) processed, porous plain carbon steel were examined after systematically changing the matrix strength via heat treatment. After austenitization and quenching, three tempering temperatures were chosen (177 °C, 428 °C, and 704 °C) to vary the strength level and steel microstructure. The reductions in strength which occurred after tempering at the highest temperature were accompanied by the coarsening of carbides in the tempered martensitic steel matrix, as confirmed by optical microscopy and by microhardness measurements of the steel. Each steel-Cu composite, containing approximately 10 vol pct infiltrated Cu, had superior fracture toughness and fatigue properties compared to the porous matrix material given the same heat treatment. Although the heat treatments given did not significantly change the fatigue behavior of the porous steel specimens, the fatigue curves (da/dN vs ΔK) and fracture properties were distinctly different for the steel-Cu composites given the same three heat treatments. The fracture toughness (K IC and J IC ), tearing modulus, and ΔK TH values for the composites were highest after tempering at 704 °C and lowest after tempering at 177 °C. In addition, the fracture morphology of both the fracture and fatigue specimens was affected by changes in strength level, toughness, and ΔK. These fractographic features in fatigue and overload are rationalized by comparing the size of the plastic zone to the microstructural scale in the composite. This article is based on a presentation made in the symposium “Fatigue and Creep of Composite Materials” presented at the TMS Fall Meeting in Indianapolis, Indiana, September 14–18, 1997, under the auspices of the TMS/ASM Composite Materials Committee.  相似文献   
1
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号