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Kazuto Nishida Kazumichi Shimizu Michiro Yoshino Hideo Koguchi Nipon Taweejun 《Microelectronics Reliability》2003,43(12):3389-2075
A high-density packaging technology has been developed that uses new flip-chip bonding technology with a thin IC and a thin substrate. Numerical analysis with the finite element method as well experiments clearly showed that deflection of the IC and reliability were affected by the IC thickness. Consequently, reliability could be improved by reducing IC thickness. The dependency of the life in single-sided chip-size packages (CSPs) could be expressed using a normal stress value in thickness, which is computed by the IC thickness and substrate type and thickness. The dependency of the life in double-sided CSPs could be expressed using a shear stress value in the vertical cross section, which is computed in IC thickness and substrate type and thickness, respectively.Moreover, a double-sided flip-chip approach solved the problem of warpage. A high-capacity memory card of 512 MB was put to practical use by applying these results. This increased the Si density by four times over that of a conventional CSP. 相似文献
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Taweejun Nipon Poapongsakorn Piyamon Kanchanomai Chaosuan 《Metallurgical and Materials Transactions B》2017,48(2):1174-1187
Metallurgical and Materials Transactions B - Carbonitrided low-carbon steels are resistance welded in various engineering components. However, there are no reports on the microstructure and... 相似文献
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