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排序方式: 共有464条查询结果,搜索用时 15 毫秒
1.
Zushu Li Kenneth C. Mills Malcolm McLean Kusuhiro Mukai 《Metallurgical and Materials Transactions B》2005,36(2):247-254
The densities of three Ni-based superalloys have been measured in both liquid and mushy states by both a modified sessile
drop method (MSDM) and a modified pycnometric method (MPM) for alloys CMSX-4 and CM186LC, and for CMSX-10 alloy by MSDM only.
The surface tensions of liquid CMSX-4, CM186LC, and CMSX-10 superalloys were measured using the sessile drop method. All measurements
were carried out in a highly purified argon atmosphere with the oxygen partial pressure of less than 10−19 MPa in the gas outlet. The densities of all superalloys in both liquid and mushy states were found to decrease with increasing
temperature. The volume thermal expansion of each superalloy in the mushy state was found to be higher than that in the liquid
state. The densities determined by different methods have been critically assessed and recommended values in both liquid and
mushy states are given as a linear function of temperature for the three Ni-based superalloys. The surface tension of liquid
CMSX-4 superalloy was found to decrease with increasing temperature, while that of liquid CMSX-10 superalloy increases with
increasing temperature. The wetting behavior of liquid CM186LC on the alumina substrate was found (1) to differ significantly
from that of CMSX-4 and CMSX-10 and (2) to vary with time. A HfO2-rich layer was found in the contact area of CM186LC with the alumina substrate, which could lead to some uncertainty in the
value obtained for the surface tension determined for CM186LC. 相似文献
2.
FANGLiang XIAOFeng TAOZainan KusuhiroMukai 《武汉理工大学学报(材料科学英文版)》2005,20(2):67-70
The density of liquid Ni- Ta alloys was measured by using a modified sessile drop method. It is found that the density of the liquid Ni- Ta alloys decreases with the increasing temperature, but increases with the increase of tantalum concentration in the alloys. The molar volume of liquid Ni- Ta binary alloys increases with the increase of temperature ancl tantalum concentration. 相似文献
3.
Takeshi Takeda Kazuhiko Kunitomi Minoru Ohkubo Toshiji Saito 《Nuclear Engineering and Design》1998,185(2-3)
Experimental study was made to confirm the validity of new designs of the auxiliary cooling system for the high temperature engineering test reactor (HTTR). First, it is necessary to vent residence air in outlet side of water chamber of the auxiliary heat exchanger for the HTTR. Accordingly, we have proposed to mount a proper bend duct in the outlet side of the water chamber. Air vent is done by difference between pressures at both ends of the bend duct caused by the forced water circulation using the water pumps. From flow tests, it was confirmed that it is capable of venting the air through the bend duct by circulating the water in maximum capacity of the water pumps. Second, it is essential to prevent seizure and excessive wear of the liner slides of the auxiliary concentric hot gas duct for the HTTR at a service temperature of 950°C. Therefore, we have put forward to coat titanium nitride (TiN) on the surface of the liner slides made of nickel-based superalloy Hastelloy XR using the thermochemical vapor deposition method. As a result of seizure and wear tests, it was confirmed that the TiN coating film of 3 μm on the surface of Hastelloy XR is sufficient. 相似文献
4.
Tests and theoretical analysis on the maximum strength of high strength bolted tension flanges joining square hollow section members have been carried out. Yield line theory has been applied in a similar way to that presented in a previous paper. Correlation between test results and theoretical predictions is quite satisfactory. Based on this study, a simple design formula has been proposed. 相似文献
5.
Watanabe Y. Hing Wong Kirihata T. Kato D. DeBrosse J.K. Hara T. Yoshida M. Mukai H. Quader K.N. Nagai T. Poechmueller P. Pfefferl P. Wordeman M.R. Fujii S. 《Solid-State Circuits, IEEE Journal of》1996,31(4):567-574
This paper describes a 256 Mb DRAM chip architecture which provides up to ×32 wide organization. In order to minimize the die size, three new techniques: an exchangeable hierarchical data line structure, an irregular sense amp layout, and a split address bus with local redrive scheme in the both-ends DQ were introduced. A chip has been developed based on the architecture with 0.25 μm CMOS technology. The chip measures 13.25 mm×21.55 mm, which is the smallest 256 Mb DRAM ever reported. A row address strobe (RAS) access time of 26 ns was obtained under 2.8 V power supply and 85°C. In addition, a 100 MHz×32 page mode operation, namely 400 M byte/s data rate, in the standard extended data output (EDO) cycle has been successfully demonstrated 相似文献
6.
Toshiji Mukai Koichi Ishikawa Kenji Higashi 《Metallurgical and Materials Transactions A》1995,26(10):2521-2526
Three IN905XL aluminum alloys with fine grain (1 μm), intermediate grain (3 μm), and coarse grain (5 μm) have been developed
by a combination of mechanical alloying (MA) and conventional extrusion in order to investigate their mechanical properties
at dynamic strain rates of 1 × 103 and 2 × 103 s−1 and a quasi-static strain rate of 10-3 s−1. Flow stresses are found to increase with decreasing grain size for all the strain rates tested. Negative strain-rate sensitivity
of flow stress is observed up to 1 × 103 s−1 in both intermediate- and coarse-grained IN905XL. At the highest strain rate of 2 × 103 s−1 however, all samples showed a positive strain-rate sensitivity of strength. Total elongation at high strain rates is generally
larger than that at low strain rates. Total elongation also decreases with grain size for all the strain rates. This decrease
in elongation results from an initiation of microcracks at interfaces between the matrix and particles finely dispersed near
grain boundary regions, introduced during MA processing; then, this initiation leads elongation of alloys to small limited
values.
Formerly with the Department of Mechanical Systems Engineering, University of Osaka Prefecture.
This article is based on a presentation made in the symposium “Dynamic Behavior of Materials,” presented at the 1994 Fall
Meeting of TMS/ASM in Rosemont, Illinois, October 3-5, 1994, under the auspices of the TMS-SMD Mechanical Metallurgy Committee
and the ASM-MSD Flow and Fracture Committee. 相似文献
7.
Gain saturation dependence on signal wavelength in a 1.5 ?m InGaAsP travelling-wave semiconductor laser amplifier is experimentally studied. Saturation output powers were 6.9dBm, 8.3dBm and 10.6dBm for signal wavelengths of 1490 nm, 1510 nm and 1540 nm, respectively. This saturation dependence on wavelength, i.e. higher saturation output power for longer signal wavelength, results from signal gain peak shift towards longer wavelength with increasing input power. 相似文献
8.
The diploid-like chromosome pairing in polyploid wheat is controlled by the Ph1 (pairing homoeologous) gene that is located on chromosome arm 5BL. By using a combination of cytogenetic and molecular techniques, we report the physical location of the Ph1 gene to a submicroscopic chromosome region (Ph1 gene region) that is flanked by the breakpoints of two deletions (5BL-1 and ph1c) and is marked by a DNA probe (XksuS1). The Ph1 gene region is present distal to the breakpoint of deletion 5BL-1 but proximal to the C-band 5BL2.1. Two other DNA probes (Xpsr128 and Xksu75) flank the region-Xpsr128 being proximal and Xksu75 being distal. The estimated size of the region is less than 3 Mb. The chromosome region around the Ph1 gene is high in recombination as the genetic distance of the region between 5BL-1 breakpoint and C-band 5BL2.1 (not resolved by the microscope) is at least 9.3 cM. 相似文献
9.
With the advancement of high‐frequency switching devices, electromagnetic interferences (EMI) have become problems in power electronic converter designs. It is necessary for an electromagnetic compatibility (EMC) design to prospect and consider its possible EMI levels. This paper describes how to compute effects from a power converter to an object point to reduce conduction EMI noises effectively by an appropriate design. Modeling techniques for converter elements are discussed for a model in the conduction emission frequency band by the parameter tuning method and for line constants by an analytical derivation. Then a derived model is simulated for harmonic distributions of loop currents and their magnetic fields. © 2002 Scripta Technica, Electr Eng Jpn, 139(1): 44–50, 2002: DOI 10.1002/eej.1145 相似文献
10.
M. Kobayashi M. Mukai H. Takahashi N. Ohno T. Kawakami T. Ishikawa 《International journal for numerical methods in engineering》2003,58(10):1523-1543
This paper describes the implicit integration and consistent tangent modulus of an inelastic constitutive model with transient and steady strain rates, both of which are time‐ and temperature‐dependent; the transient rate is influenced by the evolution of back stress decomposed into parts, while the steady rate depends only on applied stress and temperature. Such a non‐unified model is useful for high‐temperature structural analysis and is practical owing to the ease in determining material constants. The implicit integration is shown to result in two scalar‐valued coupled equations, and the consistent tangent modulus is derived in a quite versatile form by introducing a set of fourth‐rank constitutive parameters into the discretized evolution rule of back stress. The constitutive model is, then, implemented in a finite element program and applied to a lead‐free solder joint analysis. It is demonstrated that the implicit integration is very accurate if the multilinear kinematic hardening model of Ohno and Wang is employed, and that the consistent tangent modulus certainly affords quadratic convergence to the Newton–Raphson iteration in solving nodal force equilibrium equations. Copyright © 2003 John Wiley & Sons, Ltd. 相似文献