Investigation of thermal residual stresses during laser ablation of tantalum carbide coated graphite substrates using micro-Raman spectroscopy and COMSOL multiphysics

Laser ablation of high-temperature ceramic coatings results in thermal residual stresses due to which the coatings fail by cracking and debonding. Hence, the measurement of such residual stresses during laser ablation process holds utmost importance from the view of performance of coatings in extreme conditions. The present research aims at investigating the effect of laser parameters such as laser pulse energy, scanning speed and line spacing on thermal residual stresses induced in tantalum carbide-coated graphite substrates. Residual stresses were measured using micro-Raman spectroscopy and correlated with Raman peak shifts. Transient thermal analysis was performed using COMSOL Multiphysics to model the single ablated track and residual stresses were reported at low, moderate and high pulse energy regimes. The results showed that the initial laser conditions caused higher tensile residual stresses. Moderate pulse energy regime comprised higher compressive residual stresses due to off centre overlapping of the laser pulses. Higher pulse energy (250 μJ), higher scanning speed (1000 mm/s) and moderate line spacing (20 μm) caused accumulation of tensile residual stresses during the final stage of laser ablation. The deviation of experimental residual stresses from COMSOL numerical model was attributed to unaccounted additional stresses induced during thermal spraying process and deformation potentials in the numerical model.     

Effect of prior oxidation on the creep behavior of NiAl-hardened austenitic steel

The effect of prior oxidation at 1473 K on the creep behavior of an Fe-Ni-Cr-Al alloy, hardened by ordered NiAl precipitates, has been investigated at 873 K over a stress range of 275 to 450 MPa. The alloy in the as-electroslag remelted (ESR) as well as the ESR-plus-hot-worked conditions was considered. Prior oxidation causes creep strengthening in the Fe-Ni-Cr-Al alloy, resulting in a decrease in minimum creep rate and increase in time to rupture, in contrast to the observations reported on nickel-based superalloys. Creep strengthening is, however, accompanied by a significant reduction in creep ductility. Oxidation-induced creep strengthening in the current alloy can be attributed to the improved adherence of surface oxide caused by the presence of yttrium. An effective stress that incorporates the contributions of load transfer as well as substructural strengthening is used to account for the observed oxidation-induced creep strengthening. While creep strengthening is more pronounced in the ESR cast alloy, the loss in creep ductility is more intense in the ESR wrought alloy. Increasing the oxidation time beyond 1 hour has a minimal effect on creep strengthening of both the alloys, though it lowers significantly the creep ductility of the wrought alloy. The observed differences in creep behavior of the alloy in the two different conditions could be attributed to the differences in grain size as well as morphology and related oxidation-induced damage.     

Accelerated ageing tests on polymeric cables using water-filledtanks - a critical review

Accelerated ageing tests in water-filled tanks are gaining more attention because of their capability to provide information on cable life in addition to cable breakdown strength relative to ageing. This paper describes a statistically meaningful test that will meet these two main objectives of ageing     

Techniques for estimating test length under random test

When a circuit is tested using random or pseudorandom patterns, it is essential to determine the amount of time (test length) required to test it adequately. We present a methodology for predicting different statistics of random pattern test length. While earlier methods allowed estimation only of upper bounds of test length and only for exhaustive fault coverage, the technique presented here is capable of providing estimates of all statistics of interest (including expected value and variance) for all coverage specifications.Our methodology is based on sampling models developed for fault coverage estimation [1]. Test length is viewed as awaiting time on fault coverage. Based on this relation we derive the distribution of test length as a function of fault coverage. Methods of approximating expected value and variance of test length are presented. Accuracy of these approximations can be controlled by the user. A practical technique for predicting expected test length is developed. This technique is based on clustering faults into equal detectability subsets. A simple and effective algorithm for fault clustering is also presented. The sampling model is applied to each cluster independently and the results are then aggregated to yield test lengths for the whole circuit. Results of experiments with several circuits (both ISCAS '85 benchmarks and other practical circuits) are also provided.This work was done while the author was with the Department of Electrical Engineering, Southern Illinois University, Carbondale, IL 62901.     

Reference free part encapsulation: Materials,machines and methods

Reference Free Part Encapsulation (RFPE) is an automatic, universal workholding process developed by researchers at the Massachusetts Institute of Technology and the University of California-Berkeley. The process encapsulates the stock by freezing it in a low melting point material during machining and transfers datums from one setup to another by refilling and restoring the encapsulation to a known shape after each setup. This paper describes the encapsulator materials and machines developed to test and demonstrate RFPE. The encapsulation material must satisfy stringent thermal properties, and a process is described that concludes that the tin–bismuth eutectic is ideal. The similarities of the encapsulation process to manufacturing processes such as die casting and injection molding are considered; however, it is shown that many intrinsic differences exist between the encapsulation process and injection molding or die casting. Two encapsulation machines are presented. The first is a larger encapsulation machine capable of forming encapsulations with a 6 in. by 6 in. footprint. The second, a much smaller portable machine capable of forming encapsulations with a 2 in. by 2 in. footprint, is also presented. Special features of each encapsulation machine are highlighted and various design decisions are discussed.