Novel method for simultaneous formation of wires and vias of a printed circuit board using nanoporous body

A new type of a flexible printed circuit board with landless vias is developed using a novel method called interconnection via nanoporous structure (INPS). This method can make wires and vias of the printed circuit board simultaneously by a single photo-exposure process. A new photo-induced selective plating method was used to impregnate a nanoporous substrate with copper, and a new photomask was designed, which constitutes of a completely vacant large hole for via and aggregation patterns of very fine holes for wire. Because of the simple process, the INPS board is characterized by landless vias and very fine circuit. Owing to the structure, it is also characterized by flexibility and detachable wires.     

Laser Induced Periodic Structures on Polymer Surfaces

Subhalf micron (0.2 nm) space and amplitude linear periodic structures and an array of dot images are obtained with the Nd:YAG laser irradiation on Kapton polyimide films, poly(ethylene terephthalate) films, spin-coated polyimide films and others. Different from the excimer laser irradiation, which requires a polarizer, our solid state Nd:YAG laser source provides polarized beams without a polarizer with advantage over excimer laser irradiation. AFM and SEM studies have been carried out. XPS studies of laser exposed areas indicate no significant chemical reactions took place on exposed areas.     

Time-dependent deformation in an enhanced SiC/SiC composite

Time-dependent deformation in an enhanced SiC/SiC composite has been studied under constant load at high temperatures of 1200 °C, 1300 °C, and 1400 °C. Creep damage evolution was evaluated by a Young’s-modulus change of partial unloading and microscopic observation. The addition of the glassy phase in the matrix is very effective for protecting the composite from oxidation. The transient creep is dominant in creep life at all the temperatures. An empirical equation is proposed to describe creep behavior of the composite. It is found that creep activation energy increases with creep time at stresses lower than matrix cracking stress, but the activation energy remains constant at stresses higher than the matrix cracking stress. The creep strain rate of the composite is considered to be controlled by creep of fibers based on examining the time, strain, stress, and temperature dependencies of creep strain rates.     

Radiation tolerance for the SMASH-series front-end chips for a silicon micro-strip detector

The radiation tolerance for prototype front-end chips designed for a silicon micro-strip detector was examined with a ⁶⁰Co irradiation source to establish an allowable range of the radiation dose. The irradiated front-end chips were SMA²SH-64A, a 64-channel preamplifier array; SMA²SH-1, a single-channel preamplifier circuit with a comparator; and Control-C, a digital-control chip for the preamplifiers.     

Effective thermal conductivity of compressed woods

Compression is one solution to improve the strength of softwoods. The effective thermal conductivities of compressed Japanese cedars (cryptomeria japonica), which were compressed in the radial direction of the wood, were measured. Both the effective thermal conductivities in the tangential and fiber directions increase proportionally to the density increment due to the compression. However, the thermal conductivity in the radial direction (compression direction) increases slightly with the density increment. Numerical computations were conducted to explain the characteristics of thermal conductivity in the radial direction by using a microscopic heat conduction model for the compressed wood. The numerical results were compared with the measured values. And the physical mechanism of the heat conduction in the compressed woods is discussed.     

Development of a single loop EPR test method and its relation to grain boundary microchemistry for alloy 600

A single loop electrochemical potentiokinetic reactivation test method has been developed for alloy 600 that produces good passivation on all the surfaces, good etching during the reactivation scan and no appreciable pitting. It is able to quantify and discriminate between samples with a wide range of degree of sensitization. The Pa value correlates well with the minimum level of chromium in the depletion regions at the grain boundaries. It has been shown that the width of the attacked regions is much larger than the width of chromium depletion regions and it does not show any direct correlation with either depth or width or with a volume parameter of chromium depletion regions. It has been shown that the chromium carbides are not attacked during the test and that the intragranular regions attacked during the test are the sites of chromium carbides in the grain matrix. A modified Pa parameter is shown to be sensitive down to 7.5 wt% chromium in the depletion regions and indicates that the intragranular carbides have shallower depletion profiles than those at grain boundaries. Comparison of the results of the single loop and the double loop tests showed a good correlation.     

Recovery retardation in equal channel angular pressed Al–Zr alloy during friction stir welding

The effect of Zr on reduction of hardness and microstructure in an FS weld of equal channel angular-pressed Al alloy was investigated. Zr addition to Al suppressed dynamic recovery in the thermomechanically affected zone and enabled retention of the high hardness of the ECA-pressed material throughout the weld.     

The heat transfer and pressure drop characteristics of finned tube banks in forced convection (effects of fin height on pressure drop characteristics)

In recent years the requirement for the reduction of energy consumption has been increasing to solve the problems of global warming and the shortage of petroleum resources. For example, in the power generation field, as thermal power generation occupied 60% of the power generation demand, considerable improvement of the thermal efficiency is required. This paper describes the pressure drop characteristics of finned tube banks used for heat exchangers in thermal power generation that were clarified by testing serrated finned tube banks with different fin heights for improved heat transfer and conventional spiral finned tube banks with different fin heights, and an equation to predict pressure drop which is necessary for the heat exchanger design is proposed. © 2006 Wiley Periodicals, Inc. Heat Trans Asian Res, 35(3): 179–193, 2006; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/htj.20112     

The blocking barrier effect on aluminum electromigration due totitanium layers in multilayered interconnects of LSI's

Experimental evidence of an increase in the resistance of a cathode-side metal line without any void generation is presented for a multilayered metal structure terminated by via-holes during electromigration tests. This resistance increase is reversed to the initial value by high temperature storage after electromigration testing. The increase in the resistance of multilayered metal structures is attributed to the vacancy accumulation in the cathode side due to the blocking barrier effect of the refractory metal layer in the via-hole     

A 3-V, 2%-mW multibit current-mode ΣΔ DAC with 100 dBdynamic range

The area ratio of analog to digital for mixed-mode chip has been inversely proportional to the process design rule for a given dynamic range objective, in contradiction to the LSI trend. This paper presents a design approach to realize a high degree of size reduction with process design rules for analog circuitry and a signal processing architecture for digital circuitry. A five-level current-mode ΣΔ digital-to-analog converter (DAC) system reveals full scale total harmonic: distortion plus noise (THD+N) of -90 dB and dynamic-range of 100 dB at 3 V (low power of 22 mW). Analog-area down-scaling can be accomplished by this architecture to be 1.09 mm², using 0.6-μm double-poly double-metal (DPDM) CMOS. For the digital filter, a pipeline instruction sequence with multiplierless architecture also gives small area of 1.98 mm²