The influence of iodide on glass transition temperature of high-pressure nuclear waste glasses

The glass transition temperature (T_g) is a key parameter to investigate for application in nuclear waste immobilization in borosilicate glasses. T_g for several glasses containing iodine (I) has been measured in order to determine the I effect on T_g. Two series of glass composition (ISG and NH) containing up to 2.5 mol% I and synthesized under high pressure (0.5 to 1.5 GPa) have been investigated using differential scanning calorimetry (DSC). The I local environment in glasses has been determined using X-ray photoelectron spectroscopy and revealed that I is dissolved under its iodide form (I⁻). Results show that T_g is decreased with the I addition in the glass in agreement with previous results. We also observed that this T_g decrease is a strong function of glass composition. For NH, 2.5 mol% I induces a decrease of 24°C in T_g, whereas for ISG, 1.2 mol% decreases the T_g by 64°C. We interpret this difference as the result of the I dissolution mechanism and its effect on the polymerization of the boron network. The I dissolution in ISG is accompanied by a depolymerization of the boron network, whereas it is the opposite in NH. Although ISG corresponds to a standardized glass, for the particular case of I immobilization it appears less adequate than NH considering that the decrease in T_g for NH is small in comparison to ISG.     

光纤数字环路载波系统的发展

ＯＤＬＣ是当今用户接入网的新型设备，它一方面可取代端局，解决通信线路紧张和远距离大容量放号问题，另一方面也可满足日益增多的增值业务的需求。本文ＯＤＬＣ技术的基本原理，结合目前国内外常见ＯＤＬＣ系统，总结和对比了其基本特点，优势，并指明ＯＤＬＣ的技术发展方向和中国应用的前景。     

Dielectric and Piezoelectric Properties of Pb(Co1/3Nb2/3)O3-PbTiO3-PbZrO3 Solid Solution Ceramics

Ceramic and piezoelectric properties of the Pb(Co_1/3Nb_2/3)O₃-PbTiO₃-PbZrO₃ system were investigated. The system contains rhombohedral, tetragonal, and pseudocubic phases at room temperature. The triple point is at 0.07Pb(Co_1/3Nb_2/3)O₃-0.43PbTiO₃-0.50PbZrO₃. High dielectric constants (750 to 1500) and radial coupling coefficients (40 to 45%) and low average temperature coefficients of resonant frequency (of the order of 10^-6°C) were obtained for compositions near the morphotropic phase boundary.     

Development of Reference Shunt for Short‐Time Alternating High Current Tests and Study of Measuring System

Short‐circuit tests for power circuit breakers and others require alternative short‐time current measurement, from a few kA to over several tens kA. However, the reference measurement system as a national standard or a specified secondary standard instrument to directly perform comparative test as a complete calibration test in high current class has not yet been established globally. The Japan Short‐Circuit Testing Committee (hereinafter referred to as “JSTC”) has therefore developed a shunt resistor that can be used as a standard instrument for high current measurement. Reference system using this shunt resistor is also considered by JSTC. The performance of the newly developed shunt resistor has been checked through several methods, such as resistance measurement, high power current test, high frequency current test, temperature rise test, and interference test. The results of the tests proved satisfactory performance. Resistance of the shunt resistor before and after the tests was invariant and stable. This makes the shunt resistor adequate for a reference in practical use. In addition, evaluation of uncertainty of the whole reference system including this shunt resistor satisfactorily fulfills the requirements of IEC 62475 edition 1.0, 2010.     

Effects of Solvents in the Polyethylene Glycol Series on the Bonding of Copper Joints Using Ag2O Paste

The effects of reducing solvents on the bonding process using silver oxide paste in a copper joint were investigated. Three solvent types were tested: diethylene glycol (DEG), triethylene glycol (TEG), and polyethylene glycol (PEG). The strength of the joints was assessed by fracturing, which occurred at the interface of the copper oxide layer and the copper substrate in DEG and TEG samples and at the bonded interface in the PEG sample. Analysis of the samples revealed that, in the DEG and TEG samples, the copper substrate was oxidized during the bonding process, which compromised the shear strength of the joints. In contrast, the PEG sample exhibited nonuniform sintering of the silver layer while retaining good shear strength. It was found that the combination of DEG and PEG produced optimum shear strength in the copper joint, as PEG suppressed the growth of copper oxide and DEG promoted the formation of a dense sintered silver layer. The bonding strength achieved was higher than that of the gold-to-gold joint made using standard Pb-5Sn solder.     

Delamination growth mechanisms in woven glass fiber reinforced polymer composites under Mode II fatigue loading at cryogenic temperatures

The purpose of this research is to characterize the cryogenic delamination growth behavior in woven glass fiber reinforced polymer (GFRP) composite laminates subjected to Mode II fatigue loading. Mode II fatigue delamination tests were performed at room temperature, liquid nitrogen temperature (77 K) and liquid helium temperature (4 K) using the four-point bend end-notched flexure (4ENF) test method, and the delamination growth rate data for the woven GFRP laminates were obtained. The energy release rate range was determined by the finite element method. Microscopic examinations of the specimen sections and fracture surfaces were also carried out. The present results are discussed to obtain an understanding of the fatigue delamination growth mechanisms in the woven GFRP laminates under Mode II loading at cryogenic temperatures.     

Dietary CLA and DHA modify skin properties in mice

This study investigated the influence of PUFA on the properties of mouse skin. Mice (3 wk old) were given free access to oils high in linoleic acid, CLA, or DHA for 4 wk. At the end of the experiment, their skins were compared by both biochemical and histological methods. No significant differences in lipid and collagen contents were detected among treatments, although the FA composition in the skin was altered depending upon the FA composition of the supplemented oils. Electron microscopy revealed that the subcutaneous tissue layers in the CLA and DHA groups were significantly thinner than that in the high linoleic acid group, whereas no differences in the thickness of dermis layers were observed among the three groups. These results suggest that skin properties in mice are readily modified by dietary FA sources within 4 wk of dietary oil supplementation.     

定向反射管束对辐照均匀性的影响

为使多孔陶瓷板燃气辐射器加热物体能量定向集中，减少向周围环境散失的热量，在辐射器的前方，设计了定向反射管束，并进行了被加热物体表面辐照度分布特性数值计算研究。利用蒙特卡罗法中的辐射分配因子计算并分析了相关参数，例如管束布置(顺排、叉排及节距)、加热距离、管间距及管长与半径比等对被加热物体表面辐照度均匀性的影响。通过计算得出定向反射管间距是影响均匀加热面积大小的主要因素，管束布置方式对辐照度均匀性影响较小；随管长与半径比增加，物体表面辐照度均匀时，对应的加热距离增加。计算结果为实际装置的优化设计提供了理论依据。     

Conjugated‐Polymer‐Based Lateral Heterostructures Defined by High‐Resolution Photolithography

Solution processing of polymer semiconductors provides a new paradigm for large‐area electronics manufacturing on flexible substrates, but it also severely restricts the realization of interesting advanced device architectures, such as lateral heterostructures with defined interfaces, which are easily accessible with inorganic materials using photolithography. This is because polymer semiconductors degrade, swell, or dissolve during conventional photoresist processing. Here a versatile, high‐resolution photolithographic method is demonstrated for patterning of polymer semiconductors and exemplify this with high‐performance p‐type and n‐type field‐effect transistors (FETs) in both bottom‐ and top‐gate architectures, as well as ambipolar light‐emitting field‐effect transistors (LEFETs), in which the recombination zone can be pinned at a photolithographically defined lateral heterojunction between two semiconducting polymers. The technique therefore enables the realization of a broad range of novel device architectures while retaining optimum materials performance.