硅基双介质集成同轴传输结构

针对硅基系统级封装技术的发展需求,以及硅基板上传统的信号传输结构传输损耗大、抗串扰能力差等问题,提出一种新型的硅基双介质集成同轴传输结构。 该结构基于体硅微加工工艺设计而成,具有全封闭式的外导体以及单晶硅和空气两种介质。由于结构的复杂性,提出等效矩形同轴传输结构设计方法来简化设计流程,并用有限元仿真验证了此设计方法的有效性。 将双介质集成同轴传输结构与硅基板上的若干传统传输结构的性能进行仿真对比,结果表明该新型传输结构具有更低的插入损耗及更好的抗串扰性能。最后,制备了双介质集成同轴结构和相应的硅基带状线实物样品并进行了测试对比,测试结果与仿真结果保持一致并较好地验证了仿真分析的结论。     

In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip

Our investigation of in situ observations on electronic and mechanical properties of nano materials using a scanning electron microscope （SEM） and a transmission electron microscope （TEM） with the help of tradi- tional micro-electro-mechanical system （MEMS） technology has been reviewed. Thanks to the stability, continuity and controllability of the loading force from the electrostatic actuator and the sensitivity of the sensor beam, a MEMS tensile testing chip for accurate tensile testing in the nano scale is obtained. Based on the MEMS chips, the scale effect of Young＇s modulus in silicon has been studied and confirmed directly in a tensile experiment using a transmission electron microscope. Employing the nanomanipulation technology and FIB technology, Cu and SiC nanowires have been integrated into the tensile testing device and their mechanical, electronic properties under different stress have been achieved, simultaneously. All these will aid in better understanding the nano effects and contribute to the designation and application in nano devices.     

热隔离式MEMS气体质量流量传感器设计

研制了一种热隔离式微机电系统（ MEMS）气体质量流量传感器。加热电阻器和上下游测温电阻器采用热隔离悬梁式结构,间隔240μm。对恒温差电路的设计要点进行了分析并制作了系统电路。测试拟合了传感器输出电压随气体流量的关系曲线,并对传感器进行了标定。测试结果表明：在0～20 L/min的流量范围内,传感器响应速度快,灵敏度高,输出信号平滑,适合于工业及医疗等领域。