Nonlinear viscoelastic modeling of soft polymers

A one‐dimensional phenomenological constitutive model, representing the nonlinear viscoelastic behavior of polymers is developed in this study. The proposed model is based on a modification of the well‐known three element standard solid model. The linear dashpot is replaced by an Eyring type one, while the nonlinearity is enhanced by a nonlinear, strain dependent spring constant. The new constitutive model was proved to be capable of capturing the main aspects of nonlinear viscoelastic response, namely, monotonic and cyclic loading, creep and stress relaxation, with the same parameter values. Model validation was tested on the experimental results at various modes of deformation for two elastomeric type materials, performed elsewhere. A very good agreement between model simulations and experimental data was obtained in all cases. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42141.     

Deep submicron CMOS based on silicon germanium technology

The advantages to be gained by using SiGe in CMOS technology are examined, Conventional MOSFETs are compared with SiGe heterojunction MOSFETs suitable for CMOS technology and having channel lengths between 0.5 and 0.1 μm. Two-dimensional computer simulation demonstrates that the improved mobility in the SiGe devices, due to higher bulk mobility and the elimination of Si/SiO₂ interface scattering by the inclusion of a capping layer, results in significant velocity overshoot close to the source-end of the channel. The cut-off frequency, f_t , is found to increase by around 50% for n-channel devices while more than doubling for p-channel devices for typical estimates of mobility. The results offer the prospect of a more balanced CMOS and improved circuit speed especially when using dynamic logic     

A Composite Index of Compliance for Chronic In‐Center Hemodialysis Patients

We developed a composite compliance index as the sum of the compliance scores for interdialytic weight gain (IDWG), pre‐dialysis serum potassium and phosphorus concentrations (each scored from zero to 3, with 3 indicating the poorest compliance), and skipping hemodialysis sessions (scored from zero to 9, with 9 indicating the poorest compliance). We used this composite score to prospectively evaluate compliance in 25 prevalent hemodialysis patients over a period of 1 year. We then followed these patients for another 3.5 years. The patients studied were divided into two groups: group A (poor compliance) consisted of 9 subjects with composite score ≥ 9 (13.2 ± 3.2); group B (better compliance) consisted of 16 subjects with composite score < 9 (4.7 ± 1.8). Age, duration of hemodialysis, and frequency of diabetes mellitus did not differ between the groups. Group A contained higher fractions of subjects with history of alcoholism (66.7% vs 12.5%, p = 0.010), other substance addiction (44.4% vs 0%, p = 0.010), and severe psychosocial problems (88.9% vs 18.8%, p = 0.002). Mean survival from the beginning of observation, estimated by actuarial life‐table survival analysis, was 1.19 years in group A and 2.60 years in group B (p = 0.0265). A composite compliance index incorporating domains indicating adherence to diet, medications, and dialysis schedule identified other behavioral problems in poorly compliant patients. Hemodialysis patients characterized by this composite index as poorly compliant had shortened survival.     

Measurement and modeling of self-heating in SOI nMOSFET's

Self-heating in SOI nMOSFET's is measured and modeled. Temperature rises in excess of 100 K are observed for SOI devices under static operating conditions. The measured temperature rise agrees well with the predictions of an analytical model and is a function of the silicon thickness, buried oxide thickness, and channel-metal contact separation. Under dynamic circuit conditions, the channel temperatures are much lower than predicted from the static power dissipation. This work provides the foundation for the extraction of device modeling parameters for dynamic operation (at constant temperature) from static device characterization data (where temperature varies widely). Self-heating does not greatly reduce the electromigration reliability of SOI circuits, but might influence SOI device design, e.g., requiring a thinner buried oxide layer for particular applications and scaled geometries     

R-CURVE MODEL OF CERTAIN CERAMIC COMPOSITES

Abstract— The influence of crack-bridging on the R -curve for certain types of ceramic composites is modeled. Small scale bridging conditions are assumed. A recurrence procedure is used to solve the governing coupled integral equations, resulting in R -curves (stress intensity factor versus crack growth) that depend on well defined microstructural parameters. In addition, the bridging stresses and the crack opening diplacements were computed for all stages of the R -curve development. The numerical scheme is quite general and can be used for a variety of bridging laws. The convergence of the solution method is uniform, and the accuracy is a priori controlled. The results are normalized so that they can be applied for a large variety of composites with different micromechanical parameters. R -curves were computed for different bridiging laws, and were found to be sensitive to the specific bridging law used each time. Some strength-toughness relations are also discussed. The results are particularly suitable for slow crack growth analysis.     

Synergism of Toughening Mechanisms in Whisker-Reinforced Ceramic-Matrix Composites

The improved fracture resistance of whisker-reinforced ceramic-matrix composites involves more than one energy-absorbing mechanism. The possible mechanisms are reviewed and a micromechanical model evaluating the relative contributions to the overall toughness is presented. The mechanisms involve microcracking, load transfer, bridging, and crack deflection. The synergism of these mechanisms is examined using an energy release rate balance equation. The basic assumption of the proposed model is that the load transfer between the matrix and the whiskers is due to Coulomb friction. The model has been applied to an Al₂O₃/SiC whisker composite and shows reasonable agreement with reported experimental results. The role of the thermal residual stresses is also examined in light of the frictional load transfer assumption.     

The Association of Human Herpesviruses with Malignant Brain Tumor Pathology and Therapy: Two Sides of a Coin

The role of certain viruses in malignant brain tumor development remains controversial. Experimental data demonstrate that human herpesviruses (HHVs), particularly cytomegalovirus (CMV), Epstein–Barr virus (EBV) and human herpes virus 6 (HHV-6), are implicated in brain tumor pathology, although their direct role has not yet been proven. CMV is present in most gliomas and medulloblastomas and is known to facilitate oncomodulation and/or immunomodulation, thus promoting cancer cell proliferation, invasion, apoptosis, angiogenesis, and immunosuppression. EBV and HHV-6 have also been detected in brain tumors and high-grade gliomas, showing high rates of expression and an inflammatory potential. On the other hand, due to the neurotropic nature of HHVs, novel studies have highlighted the engagement of such viruses in the development of new immunotherapeutic approaches in the context of oncolytic viral treatment and vaccine-based strategies against brain tumors. This review provides a comprehensive evaluation of recent scientific data concerning the emerging dual role of HHVs in malignant brain pathology, either as potential causative agents or as immunotherapeutic tools in the fight against these devastating diseases.     

Comparison of various modeling methods for analysis of powder compaction in roller press

Recently used models relating basic properties of the feed material, roller press design and its operating parameters are reviewed. In particular, we discuss the rolling theory for granular solids proposed by J.R. Johanson in the 1960s, later trials utilizing slab method and newly developed final element models. These methods are compared in terms of efficiency and accuracy of predicting the course of basic process variables like nip angle, pressure distribution in roll nip region, neutral angle, roll torque and roll force.

The finite element method offers the most versatile approach because it incorporates adequate information about powder behavior, geometry and frictional conditions. This enables to perform realistic computer experiments minimizing costs, time and resources needed for process and equipment optimization.     

Application of the digital signal processing methodology (DSPM) for the design of time integration formulae

Although the existence of a close relationship between the areas of digital processing and time integration methodology has been established long ago, only recently a systematic application of the concepts and methods of the first area to the second has been attempted. The resulting Digital Signal Processing Methodology is applied in this paper to demostrate that time integration methods can be designed, displaying advanced performance in the computational analysis of large complex systems, with respect to accuracy, spurious oscillations damping, overshooting and asymptotic behavior for singular cases.