Acoustic emission characterization of damage in short hemp‐fiber‐reinforced polypropylene composites

This article aims at investigating the effects of hygrothermal aging on the damage mechanisms of short white Hemp Fiber Reinforced Polypropylene (HFRP) composites with various fiber contents (10, 20, 30, and 40 wt%). Injected molded specimens were subjected to hygrothermal aging with a relative humidity of 80% and two temperatures, 25 and 50°C. The water absorption and its effect on tensile properties of HFRP composites were investigated. The Acoustic Emission (AE) technique combined with scanning electron microscopy observations was used to identify microstructural damage events leading to overall failure of the HFRP composites. This identification according to hemp‐fiber content and hygrothermal aging was made with an unsupervised method based on a statistical multi‐variable analysis (k‐means algorithm). The AE results indicate that the quality of fiber‐matrix interface plays a major role in the damage process of HFRP composites, shown by the number of AE signals induced by the interface failure and their amplitude ranges. POLYM. COMPOS. 37:1101–1112, 2016. © 2014 Society of Plastics Engineers     

Using microchannels to cool microprocessors: a transmission-line-matrix study

As microprocessors components density and clock frequency increase, so do heat dissipation. The heat results from Joule effect due to leakage currents in the components area or active region. This region is only few microns thick and can quickly reach destructing temperatures if heat is not quickly removed. On this critical issue depends the system reliability. The active region is separated from the ventilated heat sink by a silicon substrate and a metal integrated heat spreader, both hundreds of microns thick. This interface region is the microprocessor's heat transfer plate where heat exchange is achieved by conduction. Because of the localized heat source, the thermal spreading resistance of the interface region can be high. A novel way of spreading heat in that region is the use of microchannel arrays where an appropriate thermal compound or a phase change liquid can be trapped to increase heat transfer by conduction or to create micro-heat-pipes. Traditional cooling methods, with conventional and well optimised heat sinks, can then be used with less burden.In this paper, the Transmission-Line-Matrix (TLM) technique is used to simulate the effect of microchannels on the temperature distribution in the active region. To minimize the interface heat resistance various microchannel and patterns are examined. In this part of the work, the microchannels are filled with the heat spreader material copper or aluminium. The results show an improved thermal transient behaviour and a reduced active region temperature in steady state.     

Thermal behavior Spice study of 6H-SiC NMOS transistors

Silicon carbide is a material that is undergoing major advances associated with a broad scope in the field of electronics. The main properties of silicon carbide such as its high thermal conductivity and high band gap make it a material suitable for use in high-temperature and high-power applications. In this Spice study, the thermal behavior of 6H-SiC NMOS transistors is analyzed through their conductance and transconductance changes with temperature in the range −200 to 700 °C. The performances in two basic applications, current mirrors and differential amplifiers, are compared to similar circuits with silicon transistors. The results show that the 6H-SiC NMOS transistors can be used up to 700 °C, while those based on silicon transistors are limited to around 160 °C.     

TLM simulation of microwave sintering of ceramics using SiC stimulus.

Microwave heating technology is becoming a successful technique used for sintering ceramic materials. However, various aspects of sintering experiments, such as the use of process stimulus and the preparation of sample arrangements, depend mainly on human expertise. The Transmission Line Matrix (TLM) method is first used to solve the combined electromagnetic and thermal equations modeling microwave heating of dielectric materials. It is then used to simulate microwave sintering of a low-loss ceramic material in a multimode microwave cavity. To enhance the microwave sintering process, Silicon Carbid (SiC) was first used as a susceptor and in a picket fence arrangement. As multiple samples may be processed in a microwave oven, the TLM was used to model such a process, and the introduction of SiC as a stimulus was also examined. Results show the importance of the stimulus thickness and configuration on the uniformity and density of the electromagnetic field distribution and, therefore, on the power dissipation within the ceramic load.     

Transmission-line-matrix (TLM) modeling of self-heating in AlGaN/GaN transistor structures

Self-heating in AlGaN/GaN (GaN—gallium nitride) heterostructures is an important issue for a large use of these devices in high-density power telecommunication applications. The equation of heat associated with this type of problem does not admit an analytical solution. Hence, we propose a numerical solution based on the use of a transmission line matrix (TLM). The method is easy to program and gives insights on temperature distribution throughout the device. It allows a better understanding of heat behavior and management at each layer that forms the structure. Some TLM simulation results have been compared with those obtained experimentally using integrated micro-Raman/infrared (IR) thermography methods, and have been found to agree within the bounds set by the resolution of the meshes used. The TLM has also the advantage upon other numerical methods of being unconditionally stable, one step and can adapt to complex geometries such as devices with several fingers.     

Unit commitment-based load uncertainties based on improved particle swarm optimisation

This paper presents an intelligent method based on Improved Particle Swarm Optimisation to solve a unit commitment problem that takes into account the uncertainty in the demand. This uncertainty is included in the optimisation problem as a joint chance constraint that bounds the minimum value of the probability to jointly meet the deterministic power balance constraints. The demand is modelled as a multivariate, normally distributed, random variable and the correlation among different time periods is also considered. To demonstrate the effectiveness and robustness of the proposed algorithm, a system with 10 thermal and wind units with various conditions is simulated. The results and numerical experiments are compared with other methods to provide valuable information for both operational and planning problems.     

On the performance of the base-stock inventory system under a compound Erlang demand distribution

In this paper, we propose a new method for determining the optimal base-stock level in a single echelon inventory system where the demand is a compound Erlang process and the lead-time is constant. The demand inter-arrival follows an Erlang distribution and the demand size follows a Gamma distribution. The stock is controlled according to a continuous review base-stock policy where unfilled demands are backordered. The optimal base-stock level is derived based on a minimization of the total expected inventory cost. A numerical investigation is conducted to analyze the performance of the inventory system with respect to the different system parameters and also to show the outperformance of the approach that is based on the compound Erlang demand assumption as compared to the classical Newsboy approach. This work allows insights to be gained on stock control related issues for both slow and fast moving stock keeping units.