压电式传感器在辐射冲击波测量中的应用

为了准确测量复合材料中的辐射冲击波,特别研制了一种大尺寸的石英保护环式压电冲击波测量传感器;利用冲击波在材料界面处的透射、反射原理,给出了正确的界面应力换算方法;应用该自行研制的冲击波测试系统,在“闪光二号”电子束加速器上成功地测量了一种碳纤维编织复合材料中的辐射冲击波,测量波形完整、信号信噪比高,测量结果表明该测量系统完全可以胜任强干扰环境中的辐射冲击波测量。     

Modeling and analysis of touch on flexible ultra-thin touch sensor panels for AMOLED displays employing finite element methods

The work employs the finite element method (FEM) to model the touch on the flexible ultra-thin touch sensor panel for analyzing touch characteristics and signals. Touch sensor panel readout circuits typically depend on touch signals to determine whether the touch sensor panel is touched or not. However, the ultra-thin touch sensor panel encountered a problem which cannot correctly recognize touch points on this type of touch sensor panel (TSP) on active-matrix organic light emitting diodes (AMOLED) displays since its electrical characteristics are different from the one of the conventional TSP. The modeling techniques for the flexible ultra-thin touch sensor panel on an AMOLED display is used to analyze touch signals from the influence of the thickness of top over layer of the flexible ultra-thin TSP and to observe the variations of mutual capacitance from touch on the flexible ultra-thin TSP. When the flexible ultra-thin touch sensor panel with the thickness of the top over layer less than the threshold thickness of the top over layer is on multi-touch, the phenomenon of the ghost points are generated. The simulation to find the threshold thickness of the top over layer based on the FEM model is conducted, and the simulation results show the top layer thickness should be larger than 107 µm to eliminate the ghost points. Furthermore, a new solution that is an optimization of the electrode pattern of transmitters and receivers in the ultra-thin touch sensor panel to further minimize the threshold thickness of the top over layer of TSP without changing the physical structure of TSP is proposed. The results conducted by using this proposed solution show that TSP top over layer threshold thickness can be reduced to 65 µm without appearance of the ghost points.