High aspect ratio fabrication method using O2 RIE and electroplating

A polyimide-based process for the fabrication of vertical structures with high aspect ratio has been developed. O₂ reactive ion etching (O₂ RIE) has been employed in the polyimide processing. Achieved etching characteristics of the O₂ RIE system are: 4.0 m/min etching rate, 15 aspect ratio, 75 m etching depth. Polyimide has excellent chemical and thermal properties which makes it a good building material for micromachines. Polyimide could be also used as molds for electroplating. Electroplated copper structures were formed in the polyimide molds and metal gears were fabricated by these fabrication technologies. New possibilities for micromachining were opened by the use of O₂ RIE and electroplating.This work was supported by Japanese ministry of Education Science and Culture under a grant-in-Aid No. 03102001.     

Magnetically coupled oscillators applicable to high-sensitivity mass detection

Microsystem Technologies - In this paper, a system of magnetically coupled oscillators consisting of a Π-shaped horizontal cantilever and a rectangular vertical cantilever with a frequency...     

用体硅微加工工艺实现的微纳电械系统

1　Ｉｎｔｒｏｄｕｃｔｉｏｎ　　ＭＥＭＳ (ＭｉｃｒｏＥｌｅｃｔｒｏＭｅｃｈａｎｉｃａｌＳｙｓｔｅｍ )ｂａｓｅｄｏｎｓｅｍｉｃｏｎｄｕｃｔｏｒｍｉｃｒｏｆａｂｒｉｃａｔｉｏｎｐｌａｙｓｉｍ ｐｏｒｔａｎｔｒｏｌｅｓｆｏｒｅｘａｍｐｌｅｉｎｔｈｅ ｐｅｒｉｐｈｅｒｙｏｆＩＴｓｙｓｔｅｍｓ.ＮＥＭＳ (ＮａｎｏＥｌｅｃｔｒｏＭｅｃｈａｎｉｃａｌＳｙｓ ｔｅｍ)ｃｏｎｔａｉｎｓｎａｎｏ＿ｓｃａｌｅｓｔｒｕｃｔｕｒｅｓ.Ｓｏｐｈｉｓｔｉｃａｔｅｄａｎｄｈｉｇｈｐｅｒｆｏｒｍａｎｃｅｓｙｓｔｅｍｓｂａｓｅｄｏｎｔｈ…     

Trench filling characteristics of low stress TEOS/ozone oxide deposited by PECVD and SACVD

In this paper low stress silicon oxide was deposited with tetraethylorthosilicate (TEOS, Si(OC₂H₅)₄)/ozone by plasma enhanced chemical vapor deposition (PECVD) and sub-atmospheric chemical vapor deposition (SACVD) for deep trench filling. Two kinds of PECVD oxide were fabricated: Coil antenna inductively coupled plasma (ICP) oxide and parallel plates capacitive coupled plasma (CCP) oxide. Adding ozone into the deposition process enhances the trench filling capability. Oxide filling in a deep trench (5 m wide, 52 m deep) was carried out using the SACVD process, which gave excellent conformal step coverage. However, the coil antenna ICP oxide was suitable as a sealing material. The effects of argon ion sputtering and magnetic field in the PECVD for the trench filling are discussed in this paper. Because the low temperature processes of PECVD and SACVD, the thermal residual stress was reduced and a low stress film of 85 MPa compression is available.This work is supported by a Grant-in-Aid (No. 13305010) from Japanese Ministry of Education, Culture, Sports, Science and Technology. A part of this work has been performed in Venture Business Laboratory, Tohoku University.     

PZT-Polymer 1-3 Composite for High Resolution Ultrasonic Imaging

A novel process has been developed to construct PZT-polymer 1-3 micro composites for high-resolution ultrasonic imaging for medical diagnosis. The key technology is the lost silicon (Si) mold process, by which PZT micro-rod arrays have been successfully fabricated with the finest rod size being 7 μm, the highest aspect ratio exceeding 15. Such fine-scale high-aspect-ratio PZT structures, which are essential for realizing high imaging performance, have never been realized by any conventional technique.     

Deep Reactive Ion Etching of Lead Zirconate Titanate Using Sulfur Hexafluoride Gas

A deep reactive ion etching (RIE) technique that uses sulfur hexafluoride (SF₆) gas has been developed for lead zirconate titanate (Pb(Zr,Ti)O₃, PZT) three-dimensional microfabrication from PZT ceramic blocks. The etching was performed by using an inductively coupled plasma that was generated in a narrow-gap vacuum chamber. The etch depth was 70 µm with a maximum etch rate of 0.3 µm/min and a selectivity of PZT to the electroplated nickel mask of >35:1. The sidewalls of the PZT structures were tapered, with base angles of ∼75°. Both positive RIE lag and unexpected ultrafine-slit etching phenomena were observed.     

Design and characteristics of large displacement optical fiber switch

Plastic optical fiber (POF) is suitable for indoor local area network (LAN), for example, in-home or office networks, because of its flexibility and its ease of connection due to its relatively large core diameter. A 1/spl times/2 optical switch for indoor LAN using POF and a shape memory alloy (SMA) coil actuator with magnetic latches was successfully fabricated and tested. In this paper, the design concept and the characteristics of this switch are described. To achieve switching by the movement of a POF, large displacement is necessary because the core diameter is large (e.g., 0.486 mm). A SMA coil actuator is used for large displacement and a magnetic latching system is employed for fixing the position of the shifted POF. For this design, the insertion loss is 0.40 to 0.50 dB and crosstalk is more than -50 dB without index-matching oil. Switching speed is less than 0.5 s at a driving current of 80 mA. A cycling test was performed 1.4 million times at room temperature. Another optical fiber switch was fabricated and successfully actuated using plastic clad fiber (PCF). PCF also has a large core diameter (e.g., 0.20 mm) and optical switches using PCF will be useful for short distance networks between buildings.     

Damage and replication checkpoint control in fission yeast is ensured by interactions of Crb2, a protein with BRCT motif, with Cut5 and Chk1

Fission yeast Cut5/Rad4 plays a unique role in the genome maintenance as it is required for replication, replication checkpoint, and normal UV sensitivity. It is unknown, however, how Cut5 protein is linked to other checkpoint proteins, and what part it plays in replication and UV sensitivity. Here we report that Cut5 interacts with a novel checkpoint protein Crb2 and that this interaction is needed for normal genome maintenance. The carboxyl terminus of Crb2 resembles yeast Rad9 and human 53BP1 and BRCA1. Crb2 is required for checkpoint arrests induced by irradiation and polymerase mutations, but not for those induced by inhibited nucleotide supply. Upon UV damage, Crb2 is transiently modified, probably phosphorylated, with a similar timing of phosphorylation in Chk1 kinase, which is reported to restrain Cdc2 activation. Crb2 modification requires other damage-sensing checkpoint proteins but not Chk1, suggesting that Crb2 acts at the upstream of Chk1. The modified Crb2 exists as a slowly sedimenting form, whereas Crb2 in undamaged cells is in a rapidly sedimenting structure. Cut5 and Crb2 interact with Chk1 in a two-hybrid system. Moreover, moderate overexpression of Chk1 suppresses the phenotypes of cut5 and crb2 mutants. Cut5, Crb2, and Chk1 thus may form a checkpoint sensor-transmitter pathway to arrest the cell cycle.     

Feeding mice palm carotene prevents DNA damage in bone marrow and reduction of peripheral leukocyte counts, and enhances survival following X-ray irradiation

This study examined the effects of palm carotene feeding on DNA damage of bone marrow, recovery of peripheral leukocyte counts, and the survival of mice that received whole-body X-ray irradiation. The palm carotene was composed of alpha- and beta-carotene in a ratio of 1:3. Mice were fed either a basal diet or a carotene diet (50 mg carotene/100 g diet) for 2 weeks, then irradiated. The carotene diet was prepared by the dietary protocol that markedly enhanced the accumulation of carotene in tissues (J. Nutr. 125, 3081, 1995). DNA damage in bone marrow was evaluated by micronucleus assay using peripheral blood. When mice received X-ray (1.5 Gy), marked DNA damage in bone marrow and reduction of peripheral leukocyte count were observed. These changes were significantly attenuated in mice fed the carotene diet. In addition, X-ray (6.5 Gy)-induced survival of mice fed the carotene diet was higher than those fed the basal diet. In mice fed the carotene diet, alpha- and beta-carotene were detected in bone marrow and liver, and concentration of vitamin A in liver was about four times higher compared with that in mice fed the basal diet. These findings suggest that feeding mice palm carotene prevents radiation-induced damages by way of its antioxidant activity and/or vitamin A activity.     

Metallic Glass as a Mechanical Material for Microscanners

Microelectromechanical system (MEMS) actuators essentially have movable silicon structures where the mechanical motion can be activated electronically. The microscanner is one of the most successfully commercialized MEMS devices which are widely used for collecting optical information, manipulating light, and displaying images. While silicon is abundant, it is also brittle and stiff and when microprocessed, defects are not uncommon. These defects result in weakness under torsional stress and this has been the key factor limiting the scanning performance of the microscanner. Here a metallic glass (MG)‐based microscanner is reported with MG as the material for the moving torsion bars. The low elastic modulus, high fracture toughness, and high strength of MG offers, for the first time, an ultralarge rotating angle of 146° with power consumption lowered to the microwatt range, and a smaller driving force and better actuation performance, than conventional single crystal silicon and polycrystalline silicon. The high spatial resolution and large scanning field of the MG‐based microscanner are demonstrated in the tomographic imaging of a human finger. This development of an MG‐based MEMS possibly opens a new field of low‐powered MEMS devices with extreme actuation and enhanced sensing.