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1.
The current research work presents a facile and cost–effective co-precipitation method to prepare doped (Co & Fe) CuO and undoped CuO nanostructures without usage of any type of surfactant or capping agents. The structural analysis reveals monoclinic crystal structure of synthesized pure CuO and doped-CuO nanostructures. The effect of different morphologies on the performance of supercapacitors has been found in CV (cyclic voltammetry) and GCD (galvanic charge discharge) investigations. The specific capacitances have been obtained 156 (±5) Fg?1, 168(±5) Fg?1 and 186 (±5) Fg?1 for CuO, Co-doped CuO and Fe-doped CuO electrodes, respectively at scan rate of 5 mVs?1, while it is found to be 114 (±5) Fg?1, 136 (±5) Fg?1 and 170 (±5) Fg?1 for CuO, Co–CuO and Fe–CuO, respectively at 0.5 Ag-1 as calculated from the GCD. The super capacitive performance of the Fe–CuO nanorods is mainly attributed to the synergism that evolves between CuO and Fe metal ion. The Fe-doped CuO with its nanorods like morphology provides superior specific capacitance value and excellent cyclic stability among all studied nanostructured electrodes. Consequently, it motivates to the use of Fe-doped CuO nanostructures as electrode material in the next generation energy storage devices.  相似文献   
2.
Ferrite particles coated with biocompatible phases can be used for hyperthermia treatment of cancer. We have synthesized substituted calcium hexaferrite, which is not stable on its own but is stabilized with small substitution of La. Hexaferrite of chemical composition (CaO)0.75(La203)0.20(Fe2O3)6 was prepared using citrate gel method. Hydroxyapatite was prepared by precipitating it from aqueous solution of Ca(NO3)2 and (NH4)2HPO4 maintaining pH above 11. Four different methods were used for coating of hydroxyapatite on ferrite particles. SEM with EDX and X-ray diffraction analysis shows clear evidence of coating of hydroxyapatite on ferrite particles. These coated ferrite particles exhibited coercive field up to 2 kOe, which could be made useful for hysteresis heating in hyperthermia. Studies by culturing BHK-21 cells and WBC over the samples show evidence of biocompatibility. SEM micrographs and cell counts give clear indication of cell growth on the surface of the sample. Finally coated ferrite particle was implanted in Kasaulli mouse to test its biocompatibility. The magnetic properties and biocompatibility studies show that these hydroxyapatite coated ferrites could be useful for hyperthermia.  相似文献   
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Silver metal has been synthesized in form of a finely divided loose nanopowder, 10–30 nm particle sizes, using a simple polyol process. In hot water, polymer molecules of polyvinyl alcohol (PVA) induce Ag+ → Ag reaction as a weak reducer (suitable to control the final particle size), forming a nanofluid of Ag nanoparticles in situ dispersing in part of PVA molecules. Ag nanoparticles do not aggregate much when casting a viscous Ag–PVA nanofluid (hot) onto a substrate in thin laminates or films. Freestanding Ag–PVA films could be obtained of 1–5 mm thickness after drying at room temperature. Dried sample can be easily peeled from a silicate glass substrate. As small as 5–10 mm Ag–PVA pieces were heated in air in order to recollect Ag nanoparticles by burning off the polymer. At 300–400 °C, Ag–PVA disintegrates and encounters combustion in air, resulting in a pure Ag-powder. As analyzed by X-ray diffraction, a single crystalline phase of an Fm3m cubic crystal structure formed. Lattice parameter a = 0.4071 nm and density ρ = 10.61 g/cm3 compare well the bulk values a = 0.4086 nm and ρ = 10.50 g/cm3.  相似文献   
5.
The transition from lead (Pb) bearing solder to Pb-free solder has arisen in response to government restrictions on the use of lead (Pb) by the European Union. As a result, electronic manufacturers have sought a material comparable to the conventional 63Sn37Pb solder that has been traditionally used to assemble electronic hardware. Based on extensive review of various solder combination, the majority of electronic manufacturers appear to be adopting a tin–silver–copper (SAC) solder as a popular Pb-free solder replacement. Significant investments have been made by many researchers to characterize the material behavior and durability of this solder system. While the exact composition of the SAC solder is still in question, it now appears that the 96.5Sn3.0Ag0.5Cu (SAC305) solder is gaining wider acceptance as the favored Pb-free replacement, for surface mount assemblies that are going to be subjected predominantly to cyclic thermal environments. This paper presents a review of our current understanding of the life expectancy of Pb-free SAC solder interconnects for electronic hardware. To this end, the paper focuses on material characterization of SAC solder, as well as its temperature cycling and vibration fatigue reliability. From this review, SAC solder interconnects are shown to be suitable for providing adequate life expectancies for temperature cycling in electronic hardware. However, it is clear that there are differences between SAC and the conventional Sn37Pb solder, that need to be understood in order to design reliable electronic hardware.  相似文献   
6.
An analytical solution is presented to the problem of steady groundwater flow seeping into a pumped cylindrical hole partially penetrating a homogeneous and anisotropic confined aquifer overlying a gravel substratum. Solutions are obtained for two general cases of the problem: (1) when the level of the pumped hole is below the confining layer; (2) when it is above it. The validity of the proposed theory is tested by comparing analytical predictions obtained for a few flow situations with corresponding results obtained by numerical means. The theory presented here can be utilized to convert the rate of rise of water in a pumped auger hole into directional conductivities of soil, in areas where water is found to be in a confined state overlying a gravel substratum. The study shows that the conductivity values calculated by neglecting the confining pressure of an artesian aquifer with a gravel base [i.e., by applying the existing (Boast and Kirkham in 1971), auger hole seepage theory for a phreatic aquifer with a gravel base to confined situations] may result in serious error; hence, the artesian head of an aquifer must be accounted for while computing the conductivity values. Further, it is observed that the area contributing flow to a pumped auger hole/well with a gravel base is mostly restricted to a short radial distance from the center of the hole, particularly for situations where the gravel substratum is located close to the bottom of the hole. This is in contrast to auger hole flow situations overlying an impervious substratum, where the domain contributing flow is mostly spread out to a considerable distance from the center of the hole.  相似文献   
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Time dispersion (TD) is computed for large neutron detectors using plastic scintillators. It is shown that TD seen by the photomultiplier (PM) tube does not necessarily increase with incident neutron energy, which is a result not fully in agreement with the usual finding  相似文献   
9.
An implementation of the IF section of WCDMA mobile transceivers with a set of two chips fabricated in an inexpensive 0.35-/spl mu/m two-poly three-metal CMOS process is presented. The transmit/receive chip set integrates quadrature modulators and demodulators, wide dynamic range automatic gain control (AGC) amplifiers, with linear-in-decibel gain control, and associated circuitry. This paper describes the problems encountered and the solutions envisaged to meet stringent specifications, with process and temperature variations, thus overcoming the limitations of CMOS devices, while operating at frequencies in the range of 100 MHz-1 GHz. Detailed measurement results corroborating successful application of the new techniques are reported. A receive AGC dynamic range of 73 dB with linearity error of less than /spl plusmn/2 dB and spread of less than 5 dB for a temperature range of -30/spl deg/C to +85/spl deg/C in the gain control characteristic has been measured. The modulator measurement shows a carrier suppression of 35 dB and sideband/third harmonic suppression of over 46 dB. The core die area of each chip is 1.5 mm/sup 2/.  相似文献   
10.
Two techniques for designing function-dependent easily testable programmable logic arrays are presented. The techniques can detect all the multiple stuck-at, crosspoint and bridging faults, as compared with most of the existing techniques where some of the faults, especially bridging faults, remain undetected.<>  相似文献   
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