Replication and bonding techniques for integrated microfluidic systems

From the technical and economic points of view, systems integration, and packaging represent a crucial step in the production of microsystems. Compared to purely silicon- or glass-based systems, the variety of materials and geometries available for purely polymer microfluidic systems is much larger, due to the outstanding material properties. Moreover, polymers may be shaped and joined by comparably simple methods. Examples are polymer microreplication as well as various bonding methods. With them, complete polymer microsystems can be integrated. In addition, a number of established, compatible processes are available for the integration of functional elements that may also be made of other materials.

     

Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication

Hot embossing, a polymer molding process conceived by Forschungszentrum Karlsruhe, is one of the established replication processes for microstructures The process is especially well suited for manufacturing small and medium series of microcomponents (SPIE Conference 1997; Polymer News 25:224–229, 2000; J Micromech Microeng 14:R1–14, 2004; Sensors Actuators 3:130–135, 2000). However, a wider application of the process currently is seriously hampered by the lack of adequate simulation tools for process optimization and part design. This situation is becoming more critical, as the dimension of the microstructures shrink from micron and submicron levels to the nanoscale and as productivity requirements dictate the enlargement of formats to process larger numbers of devices in parallel. Based on the current scientific work (Forschungszentrum Karlsruhe, FZKA-Bericht 7058 2003; DTIP Conference Montreux 2004; Microsystem Tech 10:432–437 2004), a German–Canadian cooperation has been started. The objective of this cooperation is to fill the gap mentioned above by developing reliable computer models and simulation tools for the hot embossing process and to incorporate these models in a user-friendly computer code. The present paper will give an overview of the activities in the project. The activities related to material characterization, especially the development of a viscoelastic material model, the characterization of friction between polymer and mold during demolding, the development of an 8-in. microstructured mold, and the fabrication of nanostructured molds will be discussed.

     

Multi-functional valve components fabricated by combination of LIGA processes and high precision mechanical engineering

 The advantage of thermoplastic molding as a convenient method for fabricating large quantities of microstructures is restricted by the possibilities and the necessary efforts for structuring the required molding tools. In order to increase the complexity of mold inserts without significantly increasing the fabrication expenditure a new process combining LIGA techniques and precision mechanics had been suggested by Research Center Karlsruhe. Recent work on the optimization of this process made it possible to manufacture multi-leveled mold inserts with which different three-dimensional microcomponents have successfully been molded. The two- and three-level structures feature among other details integrated alignment aids which worked very well during the assembly of the valve system the components were designed for. This paper deals with the process optimization, the manufacturing of the mold inserts, the fabrication of the three-dimensional microstructures by hot embossing in PMMA as well as in polymers with high thermal resistance and the application in a microvalve system. Received: 25 August 1997/Accepted: 22 September 1997     

Reactive ion etching for the production of metal microstructures by hot embossing

A reactive ion etching process which has been developed in order to remove the residual polymer layer, that remains at the bottom of microstructures made by hot embossing, is described. The influence of parameters and structures is explained. Received: 4 December 1998/Accepted: 20 January 1999     

Hot embossing - The molding technique for plastic microstructures

 Hot embossing is the technique to fabricate high precision and high quality plastic microstructures. Industrial fabrication of plastics components is normally achieved by injection molding. Hot embossing is actually used only for a few optical applications where high precision and high quality are important. The advantages of hot embossing are low material flow, avoiding internal stress which induces e.g. scattering centers infavorable for optical applications, and low flow rates, so more delicate structures can be fabricated, such as free standing thin columns or narrow oblong walls. The development of modular molding equipment, orientated on industrial standards has opened the door to the fabrication of plastic microcomponents in great numbers (for example LIGA-UV/VIS-spectrometers). Hot embossing has the potential of increasing production rates and therefore decreasing production costs by the enlargement of the molding surface and automatization of the molding process. Received: 25 August 1997/Accepted: 22 September 1997     

Fabrication of LIGA-Acceleration Sensors by Aligned Molding

 A technology for the fabrication of movable LIGA-Microstructures by molding was developed, which enables the cheaper production of e.g. LIGA-Acceleration Sensors [1]. For this purpose an aligned molding process had to be developed. The realized experimental setup consists of two subsystems, the molding machine and the alignment arrangement [2]. After aligning a substrate it is transported into the molding machine. An effective and extremely precise dimension translation system is required. Although during molding temperature changes appear and high forces are applied, the dimension stability during the molding process has to be guaranteed. The presented system and setup deals successfully with these conditions. An alignment quality of ±10 μm is realized. Using the aligned molding technology temperature compensated LIGA-acceleration sensors [1] were fabricated. The proper function of the sensors was demonstrated. Received: 30 October 1995/Accepted: 11 December 1995     

Investigation of polymer inserts as prototyping tooling for micro injection moulding

An increasing number of microfluidic applications linked with a strong demand for low-cost solutions has pushed research activities towards the development of polymer-based microfluidic systems. This requires the use of micro injection moulding technology to accurately replicate polymer micro parts; however, the tooling cost associated with this manufacturing route remains relatively high. The purpose of this paper is to investigate the feasibility of utilising polymer inserts for prototype tooling in micro injection moulding that can reduce product development time and cost associated with the design and testing of microfluidic systems prior to mass fabrication.     

Replication and bonding techniques for integrated microfluidic systems

From the technical and economic points of view, systems integration, and packaging represent a crucial step in the production of microsystems. Compared to purely silicon- or glass-based systems, the variety of materials and geometries available for purely polymer microfluidic systems is much larger, due to the outstanding material properties. Moreover, polymers may be shaped and joined by comparably simple methods. Examples are polymer microreplication as well as various bonding methods. With them, complete polymer microsystems can be integrated. In addition, a number of established, compatible processes are available for the integration of functional elements that may also be made of other materials.     

Large-scale hot embossing

The hot embossing process is a flexible molding technique to produce delicate microstructures with high aspect ratios on thin layers. Large-scale hot embossing is one effective way to meet future requirements and produce high-quality microstructures at low costs. For this, however, principal changes of the molding process and molding tool design will be required. In the present paper, constructive solutions for large-scale hot embossing shall be described. Based on a simulation of the hot embossing process, solutions shall be presented that are aimed at reducing shrinkage of the molded parts and demolding forces and, hence, at avoiding damages of microstructures during demolding.     

Microfabrication of single-use plastic microfluidic devices for high-throughput screening and DNA analysis

 Modern drug discovery and genomic analysis depend on rapid analysis of large numbers of samples in parallel. The applicability of microfluidic devices in this field needs low cost devices, which can be fabricated in mass production. In close collaboration, Greiner Bio-One and Forschungszentrum Karlsruhe have developed a single-use plastic microfluidic capillary electrophoresis (CE) array in the standardized microplate footprint. Feasibility studies have shown that hot embossing with a mechanical micromachined molding tool is the appropriate technology for low cost mass fabrication. A subsequent sealing of the microchannels allows sub-microliter sample volumes in 96-channel multiplexed microstructures. Received: 16 May 2001 / Accepted: 3 July 2001