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将硅钼黄分光光度法用于三元复合驱采出液中硅离子的定量分析,考察了碱(NaOH)、聚合物(HPAM)、表面活性剂十二烷基苯磺酸钠(LAS)对硅离子定量分析的影响。结果表明,水样中含有的LAS(0~2400 mg/L)和NaOH(0~7200 mg/L)对硅离子的定量分析几乎无影响。高浓度NaOH(>7200 mg/L)对测定的影响可以用盐酸消除。在pH值为1.2、高分子量HPAM(M=3500万)加量为0~80 mg/L时,随着HPAM浓度增加,溶液吸光度增大。这一影响不能通过加入1 mL丙酮消除,但可用蒸馏水稀释消除。低分子量(M=300万)、低浓度(0~40mg/L)聚合物几乎不影响硅离子测定。该法可准确、快速地分析三元复合驱采出液中的硅离子含量,标准曲线的线性回归方程为:A=0.0145c,相关系数R~2为0.9996,线性范围0~20 mg/L,测定的准确度大于98%,相对标准偏差1.39%,重现性较好。图1表5参4 相似文献
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Ming-Liang Zhu Hui-Juan Qian Rui-Xia Yuan Dong-Yan Zhao Hai-Chao Huang Huai-Yuan Wang 《石油科学(英文版)》2021,(3):951-961
In this paper,the superhydrophobic poly(vinylidene fluoride)/fluorinated ethylene propylene/SiO2/CNTs-EDTA(PFSC-EDTA)composite coating was successfully fabricat... 相似文献
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A DRIE assisted wet anisotropic bulk micromachining (DAWN) process is demonstrated to fabricate various three-dimensional MEMS devices on a silicon-on-insulator (SOI) wafer. This SOI DAWN process can realize thin film structures, reinforced (thin film) structures, and thick structures with totally different mechanical characteristics. Various passive and active mechanical components, including flexible springs, rigid structures, and actuators, have been fabricated using the SOI DAWN process and have been further integrated to create MEMS devices which are flexible as well as movable in both in-plane and out-of-plane directions. This SOI DAWN process has been successfully applied to produce various multi-DOF devices made of single crystal silicon (SCS). 相似文献
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This study presents a bulk micromachining fabrication platform on the (100) single crystal silicon substrate. The fabrication platform has employed the concept of vertical corner compensation structure and protecting structure to integrate the wet anisotropic etching and DRIE processes. Based on the characteristics of wet anisotropic etching and DRIE, various MEMS components are demonstrated using the bulk micromachining platform. For instance, the free suspended thin film structures and inclined structures formed by the {111} crystal planes are fabricated by the wet etching. On the other hand, the mesas and cavities with arbitrary shapes and the structures with different leve l heights (or depths) are realized by the characteristics of DRIE. Since the aforementioned structures can be fabricated and integrated using the presented fabrication platform, the applications of the bulk micromachining processes will significantly increase.This research is based on the work supported by WALSIN LIHWA Corporation and the National Science Council of Taiwan under grant of NSC-91–2218-E-007–034. The authors would like to thank the Central Regional MEMS Research Center of National Science Council, Semiconductor Research Center of National Chiao Tung University and National Nano Device Laboratory for providing the fabrication facilities. 相似文献
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