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System integration and high power density of monolithic and multichip designs are the driving force for the progress in power electronic systems. The whole system has to be considered and optimized to meet this target and to keep the overall ruggedness, sensitivity toward electromagnetic interference and long term reliability, Silicon utilization system reliability and power units miniaturization are the key factors. In this paper new technologies, advanced devices concepts and future system aspect for system-integration in the automotive and industrial segments are discussed. In both fields of applications these are huge requirements toward system dynamic characteristic, overload capability, ruggedness behavior and reliability. In the automotive segment technologies working at high operating temperatures are required and in the industrial are high blocking voltage capabilities are needed.  相似文献   
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Thus far, matrix converter topology has not reached industrial use. Reasons for this have been complex control schemes, inefficient solutions for overvoltage protection, questionable robustness of the bi-directional switch commutation at disturbed supply voltages, and missing power semiconductor modules. Recent research results concerning these problems have led to innovative solutions and, from a technical point of view, industrial use seems to be reasonable now  相似文献   
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