Microanalysis by laser-induced plasma spectroscopy in the vacuum ultraviolet

A new setup for microanalysis by laser-induced plasma spectroscopy in the VUV range is presented and described in detail. The system features an integrated ablation and detection module with a newly designed VUV echelle system. The echelle permits a full spectral coverage between 150 and 300 nm with a resolving power lambda/Deltalambda between 11,000 and 15,000. At present, the ablation module permits a microanalysis with a crater size of 25 microm and a nominal depth resolution with an ablation rate of 150 nm/pulse. The VUV performance was demonstrated for bulk analysis of steel; detection limits for sulfur, carbon, and phosphorus were in the lower milligram per kilogram range. The VUV scanning and mapping performance for heterogeneous matrixes was illustrated for mineral bottom ash samples from a waste incineration process.     

Extraction of hexavalent chromium from chromated copper arsenate treated wood under alkaline conditions

Information on chromium (Cr) oxidation states is essential for the assessment of environmental and health risks associated with the overall life-cycle of chromated copper arsenate (CCA) treated wood products because of differences in toxicity between trivalent [Cr(III)] and hexavalent [Cr(VI)] chromium compounds. Hypothetical Cr(VI) fixation products were investigated in CCA type C treated sawdust of aspen and red pine during or following preservative fixation by extraction with Cr(VI)-specific extractants. Cr(VI) was found only in alkaline extracts of treated wood. A major source of Cr(VI) was method-induced oxidation of fixed Cr(III) during alkaline extraction, as confirmed by demonstrated oxidation of Cr(III) from CrCl3 treated wood. Oxidation of nontoxic and immobile Cr(III) to toxic and mobile Cr(VI) was facilitated by the presence of wood at pH > 8.5. Thermodynamic equilibrium between Cr(III) and Cr(VI) is affected by pH, temperature, rates of dissolution of CrIII) compounds, and oxygen availability. Results of this study recommend against alkaline extraction protocols for determination of Cr(VI) in treated wood. This Cr oxidation mechanism can act as a previously unrecognized route for generation of hazardous Cr(VI) if CCA treated wood is exposed to alkaline conditions during its production, use, or waste management.     

Perceptualization of biomedical data. An experimental environmentfor visualization and sonification of brain electrical activity

Complex experiments require sophisticated visualization of a large number of parameters. However, physiological characteristics of human perception limit the number of visualized parameters and their dynamics. Multimodal data presentation could increase throughput, introduce new data streams, and improve temporal resolution. The future of biomedical data presentation will probably be marked with multimodal data presentation and integration of multiple diagnostic procedures. Here, the authors present sonification as a second presentation modality. During analysis, multimodal parameters must be set to maximize the distance of changes in the perceptual domain. The authors implemented sonification in their 3D EEG visualization environment to render synesthetic extension of a selected data channel or to introduce new composite parameters. Sonification improved the ability to assess genuine dynamics of brain electrical activity and to perceive inherent spatio-temporal patterns of brain electrical activity     

Operating limits for RF power amplifiers at high junction temperatures

LDMOS RF––power amplifier components usually operate under severe conditions challenging long-term reliability. These components are subjected to high power dissipation and consequently high junction temperatures. Failure mechanisms are highly temperature dependent and driven by coupled electro-thermo-mechanical fields as a function of stress time. In this work we have investigated the reliability of such a component. Power cycling was used to assess its reliability by introduction of temperature gradients and transient at elevated junction temperatures. The experimental lifetime acceleration conditions provided transient thermal constraints to the thermo-mechanical strength of the silicon die. Power dissipation has been adjusted to cover a broad temperature range (T_{j max}: 200–300 °C) in the peak of a single power cycle. Different failure modes have been observed and related to the different temperature ranges. The experimental results have been combined with thermo-mechanical FE-simulations in ANSYS, leading to the validation of simulation models and implementation in a larger simulation network. The power cycling approach as applied in this paper provided a useful addition to the steady state reliability information. In this way, clear information about margins for safe operation under dynamical conditions has been obtained. This information is needed to fully exploit the functional capability of the component and avoid over-specification in the final application. Overall, the LDMOS RF–PA component showed excellent reliability which makes it suitable for application in telecom devices.     

Reliability prediction for TFBGA assemblies

One of the key hot topics in dense large scale integration packaging technologies is to reduce the thermomechanical stress caused by a mismatch of coefficients of thermal expansion among material employed. Nearly all manufacturers of portable electronics products perform several kinds of physical tests in the development cycle to evaluate reliability of the products. In this paper, results obtained by accelerated thermal and power cycling tests by using thin fine pitch gall grid array (TFBGA) packages are reported. Power-cycling stands for a lifetime acceleration method which is close to the real environmental conditions of many electronic products. For this purpose, a set of TFBGA thermal test packages were designed and manufactured for reliability assessment of solder joint interconnections. The assemblies consisted of an array of polysilicon resistors surrounding a sensing diode for accurate temperature measurements. The package uses a qualified bill of materials including a 36-mm/sup 2/ dummy die. Each assembly was designed to perfectly reproduce the thermomechanical behavior of the mass production packages by several semiconductor manufacturers. This package is used in telecom wireless application where it offers high density input/output solution for advanced application-specific integrated circuit (IC) devices a system on chip ICs. Both experiments and simulations were carried out to locate the position of the most critical parts. Complexity of structural package characteristics was examined by using finite-element method modeling methodology. A strain energy based model was employed to locate the most vulnerable parts in the package and predict failure rates.     

Executing DSP applications in a fine-grained dataflow environment

An experimental approach is chosen to investigate the performance of a fine-grained dataflow architecture for numerically intensive digital signal processing (DSP) applications. The focus is on the behavior of pipelined data-parallel algorithms. However, the granularity of the high-level language programming blocks is not explicitly optimized to balance computation and communication; a natural and logical fine-grained decomposition of problems is used instead. The authors interpret their empirical data by means of parameters such as a number of instructions per generic unit of computation, a density of precedence relations, and a serial fraction. The performance and limitations of fine-grained general-purpose dataflow computing are discussed     

Scanning white light interferometry in quality control of single-point tape automated bonding

We report on applying a scanning white light interferometry (SWLI) for quality control of aluminum lead single-point tape automated bonding (spTAB). A spTAB process was used to connect Al leads on a thin polyimide flex to Al bond pads on a flexible Al-polyimide cable. In the experiment three different bonding process parameters, i.e. bond force, ultrasonic power, and ultrasonic treatment time were varied in order to maximize the pull force. A custom built scanning white-light interferometer was used to measure the bond height in order to correlate this parameter with the tensile bond force. This force was obtained in a destructive way by a consecutive pull test. All bonds with a height within (7.22 ± 1.80 μm), possessed a tensile strength exceeding 85 mN. This was verified by a separate validation measurement where the pull force of bonds complying with the height requirement was recorded. Based on the 3D observations the conditions for an acceptable bond quality were revisited and refined.     

Tactical audio and acoustic rendering in biomedical applications

Complexity of biomedical data requires novel sophisticated analysis and presentation methods. Sonification is used as a new information display in augmented reality systems to overcome problems of existing human-computer interfaces (e.g., opaque or heavy head-mounted displays, slow computer graphics, etc.). A novel taxonomy of sonification methods and techniques is introduced. We present our experience with tactical audio and acoustic rendering in biomedical applications. Tactical audio as an audio feedback is used as support for precise manual positioning of a surgical instrument in the operating room. Acoustic rendering is applied as an additional information channel and/or warning signal in biomedical signal analysis and data presentation     

Molecular Sieving on the Surface of a Protein Provides Protection Without Loss of Activity

Tethering polymers to surfaces represents the cornerstone of a wide range of applications, including the stabilization of colloids/biomolecules and the preparation of functional coatings. Unfortunately, despite the prevalence of protein‐tethered polymers in the pharmaceutical sector, the analysis of such polymer monolayers on a molecular level is difficult. In this work, simple ¹H NMR spectroscopy and the catalytic properties of α‐chymotrypsin are used to analyze the conformational/permeability properties of protein‐bound monolayers of poly(oligoethyleneglycol monomethylether methacrylate) (pOEGMA), a biocompatible comb‐polymer of interest in the biomedical field. By analyzing >100 distinct conjugates of α‐chymotrypsin and pOEGMA, a detailed picture of the behavior of pOEGMA on the surface of a protein was obtained. Remarkably, control of polymer conformation and inter‐penetration produced a thus far overlooked molecular sieving effect. The application of this effect for the “smart” PEGylation of proteins is portrayed, from which insight is provided for the design of other therapeutic bioconjugates and functional coatings with selective permeability properties.     

Novel materials for improved quality of RF-PA in base-station applications

New materials, design, and production technology have been introduced into laterally diffused metal oxide semiconductor (LDMOS) radio frequency power amplifier (RF-PA) transistors to provide advanced thermal features and increased thermal conductivity (K/sub th/). Recently, K/sub th/ of WCu flanges has been increased by nearly 25% from near 160W/mK to near 200W/mK. Further improvements in the latest generation of the RF-PA utilize novel flange materials such as Cu-laminate with even higher K/sub th/, by more than 25% compared to WCu. The development of Cu-laminate flange structures, involved optimization between achieving higher K/sub th/ and preserving desired mechanical properties for low stress and long-term reliability. Such optimization provided desired flatness for the RF-PA; yielding in lower interfacial thermal resistance between the RF-PA transistor flange and the next level heat sink. Furthermore, well characterized, highly thermally conductive, and very robust AuSi die attach was employed for efficient and reliable thermal coupling. Constellation of such materials and production technology improved overall quality of the RF-PA, enabling successful implementation in base-stations.