Inorganic-Based Printed Thermoelectric Materials and Devices

One of the simplest ways to generate electric power from waste heat is thermoelectric (TE) energy conversion. So far, most of the research on thermoelectrics has focused on inorganic bulk TE materials and their device applications. However, high production costs per power output and limited shape conformity hinder applications of state-of-the-art thermoelectric devices (TEDs). In recent years, printed thermoelectrics has emerged as an exciting pathway for their potential in the production of low-cost shape-conformable TEDs. Although several inorganic bulk TE materials with high performance are successfully developed, achieving high performance in inorganic-based printed TE materials is still a challenge. Nevertheless, significant progress has been made in printed thermoelectrics in recent years. In this review article, it is started with an introduction signifying the importance of printed thermoelectrics followed by a discussion of theoretical concepts of thermoelectricity, from fundamental transport phenomena to device efficiency. Afterward, the general process of inorganic TE ink formulation is summarized, and the current development of the inorganic and hybrid inks with the mention of their TE properties and their influencing factors is elaborated. In the end, TEDs with different architecture and geometries are highlighted by documenting their performance and fabrication techniques.     

Multi-functional valve components fabricated by combination of LIGA processes and high precision mechanical engineering

 The advantage of thermoplastic molding as a convenient method for fabricating large quantities of microstructures is restricted by the possibilities and the necessary efforts for structuring the required molding tools. In order to increase the complexity of mold inserts without significantly increasing the fabrication expenditure a new process combining LIGA techniques and precision mechanics had been suggested by Research Center Karlsruhe. Recent work on the optimization of this process made it possible to manufacture multi-leveled mold inserts with which different three-dimensional microcomponents have successfully been molded. The two- and three-level structures feature among other details integrated alignment aids which worked very well during the assembly of the valve system the components were designed for. This paper deals with the process optimization, the manufacturing of the mold inserts, the fabrication of the three-dimensional microstructures by hot embossing in PMMA as well as in polymers with high thermal resistance and the application in a microvalve system. Received: 25 August 1997/Accepted: 22 September 1997     

CYTOCENTERING: a novel technique enabling automated cell-by-cell patch clamping with the CYTOPATCH chip

Automats for patch clamping suspended cells in whole-cell configuration must (1) bring isolated cells in contact with patch contacts, (2) form gigaseals, and (3) establish stable intracellular access that allows for high quality recording of ionic currents. Single openings in planar substrates seem to be intriguing simple solutions for these problems, but due to the low rate of formation of whole-cell configurations we discarded this approach. Single openings are not suited for both attracting cells to the opening by suction and forming gigaseals with subsequent membrane rupture. To settle the three tasks with a mechanical microstructure we developed the socalled CYTOCENTERING technique to apply to suspended cells the same operation sequence as in conventional patch clamping. With this method we immobilized selected cells from a flowing suspension on the tip of a patch pipette by suction with a success rate of 97% and formed gigaseals with a success rate of 68%. Subsequent whole-cell recordings and intracellular staining with Lucifer yellow proved the stable access to the cytoplasm. Currently, a chip with an embedded suction opening in glass surrounding the microstructured contact pipette is under development. The processing of this CYTOPATCH chip is compatible to large-volume production. The CYTOPATCH automat will allow for fully automated, parallel, and asynchronous whole-cell recordings.     

Binding of external ligands onto an engineered virus capsid

The development of novel delivery systems for therapeutic substancesincludes targeting of the carriers to a specific site or tissuewithin the body of the recipient. This can be accomplished byappropriate receptor-binding domains and requires linking ofthese domains to the carrier. We have used recombinantly expressedpolyomavirus-like particles as a model system and inserted thesequence of a WW domain into different surface loops of theviral capsid protein VP1. In one variant, the WW domain maintainedits highly selective binding properties of proline-rich ligandsand showed an increased affinity but also an accelerated association/dissociationequilibrium compared to the isolated WW domain, thus allowinga short-term coupling of external ligands onto the surface ofthe virus-like particles.     

In Situ Mine Water Treatment: Field Experiment at the Flooded Königstein Uranium Mine (Germany)

Within the WISMUT environmental remediation programme, the rehabilitation of the former uranium mine at Königstein is a very special case due to its use of underground leaching and its location near the Elbe River. The mine water is acidic, oxidizing, and polluted with uranium and other contaminants, and must be pumped to the surface and treated. In-situ water treatment approaches have been investigated to optimise further flooding and shorten the period of conventional water treatment. In 2010/2011, a field-scale experiment was carried out: about 120 t of alkalinity were successfully injected into the partially flooded mine. Tracer signals and geochemical reactions achieved general expectations. Based on the results, a site-specific technology concept was developed to flood the mine to its natural decant level.     

High aspect ratio multi-level mold inserts fabricated by mechanical micro machining and deep etch X-ray lithography

 Complex microstructures can be fabricated in large quantities by thermoplastic molding processes. The shape of the microstructures is determined mainly by the mold insert. Until now, multi-level mold inserts have been fabricated either by deep etch X-ray lithography and electroforming, Harmening et al. (1992), or by milling of a brass substrate, Schaller et al. (1995). In both cases there are limitations on structuring either by the fabrication effort or by the sizes of the smallest available milling heads. To avoid these limitations on structuring, a new process for manufacturing multi-level mold inserts has been developed at Forschungszentrum Karlsruhe. Milling, drilling, deep etch X-ray lithography and electroforming have been combined to manufacture a mold insert which is characterized by high aspect ratios with small lateral dimensions and various level heights. Samples with two levels and an aspect ratio of 15 have been manufactured. Much higher aspect ratios seem to be achievable. This paper covers the fabrication process, first tests, and experimental results of manufacturing a multi-level mold insert for molding three-dimensional components of a microvalve system. Received: 30 October 1995 / Accepted: 17 January 1996