Molecular structure and granule morphology of native and heat‐moisture‐treated pinhão starch

Pinhão seed is an unconventional source of starch and the pines grow up in native forests of southern Latin America. In this study, pinhão starch was adjusted at 15, 20 and 25% moisture content and heated to 100, 110 and 120 °C for 1 h. A decrease in λ max (starch/iodine complex) was observed as a result of increase in temperature and moisture content of HMT. The ratio of crystalline to amorphous phase in pinhão starch was determined via Fourier transform infra red by taking 1045/1022 band ratio. A decrease in crystallinity occurred as a result of HMT. Polarised light microscopy indicated a loss of birefringence of starch granules under 120 °C at 25% moisture content. Granule size distribution was further confirmed via scanning electron microscopy which showed the HMT effects. These results increased the understanding on molecular and structural properties of HMT pinhão starch and broadened its food and nonfood industrial applications.     

V2O5/RGO/Pt nanocomposite on oxytetracycline degradation and pharmaceutical effluent detoxification

The cover image is based on the Research Article V₂O₅/RGO/Pt nanocomposite on oxytetracycline degradation and pharmaceutical effluent detoxification by Mohan, H et al., DOI: 10.1002/jctb.6238 .

     

Compensation paradox: the influence of monetary rewards on user behaviour

Many e-commerce companies collect users’ personal data for marketing purposes despite privacy concerns. Information-collecting companies often offer a monetary reward to users to alleviate privacy concerns and ease the collection of personal information. This study focused on the negative effects of monetary rewards on both information privacy concerns (IPC) and information disclosure. A survey approach was used to collect data and 370 final responses were analysed using a two-way analysis of variance and a binomial logistic regression model. The results show that monetary rewards increase IPC when an information-collecting company requires sensitive information. Additional results indicate that building trust is a more effective way of collecting personal data. This study identifies how organisations can best execute information-collection activities and contributes additional insights for academia and practitioners.     

A Distribution‐freeCUSUMChart for Monitoring Variability of AutocorrelatedProcesses

We present a distribution‐free tabular cumulative sum chart for monitoring the variability of an autocorrelated process. A quantity known as the asymptotic variance parameter is employed as a measure of the variability, and a distribution‐free tabular cumulative sum chart is applied to variance estimates calculated from batches of nonoverlapping samples. The proposed chart is applicable to a stationary process with a general marginal distribution and a general autocorrelation structure. It also determines control limits analytically without trial‐and‐error simulations. The performance of the proposed chart is tested on stationary processes with both normal and nonnormal marginals with various autocorrelation structures. Copyright © 2014 John Wiley & Sons, Ltd.     

辐射型漏泄同轴电缆的设计

总结了漏泄同轴电缆的理论研究现状。围绕使用频带和耦合损耗这两个重要电气参数，讨论辐射型漏泄同轴电缆的设计方法。基于周期性槽孔结构的空间谐波的分析，讨论了抑制高次谐波以拓展使用频带的方法。利用时域有限差分方法和Matlab软件计算耦合损耗。     

Spectral shape tunable band-rejection filter using a long-period fiber grating with divided coil heaters

We have developed a new type of tunable band rejection filter, which provides high spectral-shaping flexibility in a wide tuning range. The filter consists of a long-period fiber grating (LPFG) with divided coil heaters. Each of the divided coil heaters is controlled individually to adjust a temperature distribution along the LPFG and to modify the spectral shape of the LPFG filter. The tunable band rejection filter is demonstrated to function properly when applied as an erbium-doped fiber amplifier gain-flattening filter.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported