河南省灵宝市董家埝银矿原生晕特征及地质意义

董家埝银矿是豫西小秦岭矿集区南成矿带目前发现的唯一大型矿床。为了矿床深部勘查工作的顺利进行,了解有用元素在垂向上的变化规律,选用原生晕地球化学方法,通过典型矿床剖面的原生晕特征研究,实现对深部矿体变化趋势的判断。经计算,确定As、Sb、Ag、Au、Cu、Pb、Zn、Co和Mo等9种元素可作为指示元素,其中As和Sb为前缘晕指示元素,Ag、Au、Cu、Pb和Zn为近矿晕指示元素,Co和Mo为尾晕指示元素。分带指数和浓集指数2种方法计算得出的元素在分带序列上的位置总体趋势一致。用分带指数法确定的主矿体自上而下的原生晕轴向分带序列为Co-Mo-Cu-Au-Sb-Zn-Pb-Ag-As,出现"反分带"现象。结合原生晕地球化学参数变化特征、矿体剥蚀程度研究和理想模型,预测M1-I主矿体向深部仍有较大的延伸。研究成果可以为区域同类型矿化地质体深部的趋势判断和决策提供参考。     

The effect of charge on the dihydrogen storage capacity of Sc2–C6H6

The effect of charge on the dihydrogen storage capacity of Sc₂–C₆H₆ has been investigated at B3LYP-D3/6-311G(d,p) level. The neutral system Sc₂–C₆H₆ can store 8H₂ with gravimetric density of 8.76 wt %, and one H₂ dissociates and bonds atomically on the scandium atom. The adsorption of 8H₂ on Sc₂–C₆H₆ is energetically favorable below 155 K. The atom-centered density matrix propagation (ADMP) molecular dynamics simulations show that Sc₂–C₆H₆ can adsorb 3H₂ within 1000 fs at 300K. Compared with Sc₂–C₆H₆, the charged systems can adsorb more hydrogen molecules with higher gravimetric density, and all the H₂ are adsorbed in the molecular form. The gravimetric densities of Sc₂–C₆H₆⁺ and Sc₂–C₆H₆²⁺ are 9.75 and 10.71 wt%. Moreover, the maximum adsorption of charged systems are favorable in wider temperature range. Most importantly, the ADMP-MD simulations indicate that Sc₂–C₆H₆²⁺ can adsorb 6 hydrogen molecules within 1000 fs at 300K. It can be found that the gravimetric density (6.72 wt%) of Sc₂–C₆H₆²⁺ still exceeds the target of US Department of Energy (DOE) under ambient conditions.     

An end-to-end denoising autoencoder-based deep neural network approach for fault diagnosis of analog circuit

Analog Integrated Circuits and Signal Processing - Fault diagnosis of analog circuit is critical to improve safety and reliability in electrical systems and reduce losses. Traditional fault...     

Understanding trust in ms-commerce: The roles of reported experience,linguistic style,profile photo,emotional, and cognitive trust

This paper examines what influences trust in mobile social commerce environment. Drawing on trust-based acceptance model (i.e. cognitive and emotional trust) and online review features (i.e. profile photo, linguistic style, and reported experience), we examine how these factors affect trust in mobile social commerce. Hypotheses were tested using survey data. The results of our model showed that there are significant influences of profile photo, reported experience, cognitive, and emotional trust towards trust in ms-commerce. This work contributes to existing literature by examining the roles of previous trust in mobile payments and online reviews on trust in mobile social commerce.     

基于加速度计的坐标系匹配方法研究

为了提高加速度计应用中坐标系的匹配精度,提出了基于加速度计的坐标系匹配方法,介绍了其基本原理,并对加速度计的测角方法进行了深入研究.试验结果表明:该方法测量最大误差≤0.3°,满足实际应用要求,有效地解决了加速度计应用中的坐标系匹配问题.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

基于MPEG-2文件的合并

介绍了具有相同音频、视频编码方式的MPEG - 2节目流如何合并成一个节目流。合并后的文件播放流畅并且时间显示正确 ,它包括PATPMT表的重写 ,系统头部分相关字段的更改 ,PCR值的修改 ,解码时间标签 (DTS)和显示时间标签 (PTS)的重新确定 ,传送速率的修改以及添加相应的空包     

提高深井硬地层钻井速度技术难点及对策

乌龙1井地层为南方海相沉积,地层古老、岩石硬度大、研磨性强、可钻性差、地层倾角大(最大为80°)井斜难以控制、蹩跳钻严重,制约了该地区深井钻井速度。文章介绍了解决提高钻井速度这一瓶颈问题,从深井优快钻井及其配套技术、硬地层钻进的钻头优选、优化钻井参数、引用新技术、新工艺、新工具等方面进行了探索,钻井速度有了大幅度地提高,对类似井具有一定的借鉴作用。