排序方式: 共有62条查询结果,搜索用时 15 毫秒
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以NH3和SiH4为反应源气体,采用射频等离子体增强化学气相沉积(RF-PECVD)法在多晶硅(p-Si)衬底上沉积了一系列SiN薄膜,并利用椭圆偏振测厚仪、超高电阻-微电流计、C-V测试仪对所沉积的薄膜作了相关性能测试.系统分析了沉积温度和射频功率对SiN薄膜的相对介电常数、电学性能及界面特性的影响.分析表明,沉积温度和射频功率主要是通过影响SiN薄膜中的Si/N比影响薄膜的性能,在制备高质量的p-Si TFT栅绝缘层用SiN薄膜方面具有重要的参考价值. 相似文献
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Mn-W co-doped ZnO(ZMWO) thin films with low resistivity and high transparency were successfully prepared on glass substrate by direct current(DC) magnetron sputtering at low temperature.The sputtering power was varied from 65 to 150 W.The crystallinity and resistivity of ZMWO films greatly depend on sputtering power while the optical transmittance and optical band gap are not sensitive to sputtering power.All the deposited films are polycrystalline with a hexagonal structure and have a preferred orientat... 相似文献
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建立了流固耦合传热的数值分析模型,求解得到了流固耦合传热性能如温度、传热系数、摩擦系数、汽相体积分数沿换热元件轴向变化的分布。结果表明:随着质量流量的增加传热性能有被强化的趋势;相变之前,传热性能与热流密度的无关,相变之后,传热性能被强化,但趋势逐渐放缓;热流密度越大,质量流量越小,相变点越靠前。 相似文献
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Transparent conducting zirconium-doped zinc oxide films with high transparency and relatively low re-sistivity have been successfully prepared on water-cooled glass substrate by radio frequency magnetron sputtering at room temperature. The Ar sputtering pressure was varied from 0.5 to 3 Pa. The crystallinity increases and the electri-cal resistivity decreases when the sputtering pressure increases from 0.5 to 2.5 Pa. The cystallinity decreases and the electrical resistivity increases when the sputtering pressure increases from 2.5 to 3 Pa. When the sputtering pressure The deposited films are polycrystalline with a hexagonal structure and a preferred orientation perpendicular to the substrate. 相似文献
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利用直流磁控溅射法在有ZnO∶Zr缓冲层的水冷玻璃衬底上成功制备出了ZnO∶Zr透明导电薄膜,缓冲层的厚度介于35~208nm。利用XRD、SEM、四探针测试仪和紫外-可见分光光度计研究ZnO∶Zr薄膜的结构、形貌、电光性能。结果表明,薄膜的颗粒尺寸和电阻率对缓冲层厚度具有较强的依赖性。当缓冲层厚度从35nm增加到103nm时,薄膜的颗粒尺寸增大,电阻率减小。而当缓冲层厚度从103nm增加到208nm时,薄膜的颗粒尺寸减小,电阻率增大。当缓冲厚度为103nm时,薄膜的电阻率最小为2.96×10^-3Ω.cm,远小于没有缓冲层时的12.9×10^-3Ω.cm。实验结果表明,在沉积薄膜之前先沉积一层适当的缓冲层是提高ZnO∶Zr薄膜质量的一种有效方法。 相似文献
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Highly transparent and conducting Al-Zr co-doped zinc oxide (ZAZO) thin films were successfully prepared on glass substrate by direct current (DC) magnetron sputtering at room temperature.The distance between target and substrate was varied from 45 to 70 mm.All the deposited films are polycrystalline with a hexagonal structure and have a preferred orientation along the c-axis perpendicular to the substrate.The crystallinity increases obviously and the electrical resistivity decreases when the distance betwe... 相似文献
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p-Si TFT栅绝缘层用SiNx薄膜界面特性的研究 总被引:1,自引:1,他引:0
以NH3和SiH4为反应源气体,在低温下采用射频等离子体增强化学气相沉积(RF-PECVD)法在多晶硅(p-Si)衬底上沉积了SiNx薄膜.系统地分析讨论了沉积温度、射频功率、反应源气体流量比对SiNx薄膜界面特性的影响.分析表明,沉积温度和射频功率主要是通过影响SiNx薄膜中的si/N比和H含量影响薄膜的界面特性,而NH3/SiH4流量比则主要通过影响薄膜中的H含量影响薄膜界面特性.实验制备的SiNx薄膜层中的固定电荷密度、可动离子密度、SiNx与p-si之间的界面态密度分别达到了1.7×1012/cm2、1.4×1012/cm2、3.5×1012/(eV·cm2),其界面特性达到了制备高质量p-si TFT栅绝缘层的性能要求. 相似文献
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