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2.
Mg2(Ti1-xSnx)O4 (x?=?0–1) ceramics were prepared through conventional solid-state method. This paper focused on the dependence of microwave dielectric properties on crystal structural characteristics via crystal structure refinement, Raman spectra study and complex chemical bond theory. XRD spectrums delineated the phase information of a spinel structure, and structural characteristic of these compositions were achieved with the help of Rietveld refinements. Raman spectrums were used to depict the correlations between vibrational phonon modes and dielectric properties. The variation of permittivity is ascribed to the Mg2(Ti1-xSnx)O4 average bond covalency. The relationship among the B-site octahedral bond energy, tetrahedral bond energy and temperature coefficient are discussed by defining on the change rate of bond energy and the contribution rate of octahedral bond energy. The quality factor is affected by systematic total lattice energy, and the research of XPS patterns illustrated that oxygen vacancies can be effectively restrained in rich oxygen sintering process. Obviously, the microwave dielectric properties of Mg2(Ti1-xSnx)O4 compounds were obtained (εr= 12.18, Q×f?=?170,130?GHz, τf?=??53.1?ppm/°C, x?=?0.2).  相似文献   
3.
炼油厂全流程优化建模方法研究   总被引:1,自引:0,他引:1  
为了克服使用线性规划和单处理单元非线性规划进行生产优化的内在缺点,在建立原油单元、催化裂化、催化重整和汽油调合等4个重要处理单元详细模型的基础上,将单处理单元非线性过程模型集成到一个全流程优化非线性模型中。优化的目标函数是使炼油厂全厂利润最大。决策变量是那些显著影响全厂效益的变量,约束条件是单个处理单元约束条件的集合。对某炼油厂进行实例研究,结果表明该全流程模型能有效处理全厂优化问题,所得利润在线性规划的基础上提高4.5%。  相似文献   
4.
Whole and sliced fresh mushrooms (Agaricus bisporus) were packaged with PVC wrap or two polyolefins (PD-941 and PD-961) films after coating with CaCl2 and chitosan. Package gas composition, color, weight loss and maturity were measured during storage at 12 °C and 80%RH. For PD-961, the highest in-package concentration occurred during the first day of storage regardless of treatments, while wrap and PD-941 showed varying degrees in-package concentration with different processes and coatings. The whiteness of whole mushrooms varied significantly with the type of coating, but not with the type of films. The extent of darkening was greater in coated whole mushrooms than in sliced ones. Weight loss occurred in all packages and varied from 3 (g/100 g) to about 7 (g/100 g) after 6 days of storage. Due to a lower permeability, PD-961 packages had the lowest weight loss. The type of packaging films significantly affected the maturity index, where PD-961 most effectively lowered maturity index for both whole and sliced mushrooms, thus extending the shelf-life. The type of coating did not appear to affect maturity index except for the wrap package where chitosan coating markedly lowered the maturity index of sliced mushrooms.  相似文献   
5.
介绍现代开关电源行业仿真工作的意义和现状,以及专用仿真软件包SIM etrix/SIMPLIS的优点和不足。通过实例给出SIMPLIS环境中集成电路控制芯片的建模过程,并就其中的关键技术予以简单讨论。  相似文献   
6.
结合工程实例,介绍了我国第一座可拆装高架火炬的基本原理及组成,并对可拆装高架火炬与普通高架火炬在安全、技术、安装、维修、占地面积、投资等方面进行了比较,还分析了高架火炬未来的发展趋势.  相似文献   
7.
Blind estimation of OFDM carrier frequency offset via oversampling   总被引:3,自引:0,他引:3  
Blind deterministic estimation of the orthogonal frequency division multiplexing (OFDM) frequency offset via oversampling is proposed in this paper. This method utilizes the intrinsic phase shift of neighboring sample points incurred by the frequency offset that is common among all subcarriers. The proposed method is data efficient - it requires only a single OFDM symbol to achieve reliable estimation, hence making it more suitable to systems with stringent delay requirement and mobility-induced channel variation. The proposed scheme is devised to perfectly retrieve frequency offset in the absence of noise. Quite remarkably, we show that in the presence of channel noise, this intuitive scheme is indeed the maximum likelihood estimate of the carrier frequency offset. The possible presence of virtual carriers are also accommodated in the system model, and some interesting observations are obtained. The Cramer-Rao lower bound is derived for the oversampling-based signal model, and we show through numerical simulation that the proposed algorithm is efficient. Practical issues such as identifiability, the front-end filter bandwidth, and the possible presence of correlated noises are also carefully addressed.  相似文献   
8.
Data mining extracts implicit, previously unknown, and potentially useful information from databases. Many approaches have been proposed to extract information, and one of the most important ones is finding association rules. Although a large amount of research has been devoted to this subject, none of it finds association rules from directed acyclic graph (DAG) data. Without such a mining method, the hidden knowledge, if any, cannot be discovered from the databases storing DAG data such as family genealogy profiles, product structures, XML documents, task precedence relations, and course structures. In this article, we define a new kind of association rule in DAG databases called the predecessor–successor rule, where a node x is a predecessor of another node y if we can find a path in DAG where x appears before y. The predecessor–successor rules enable us to observe how the characteristics of the predecessors influence the successors. An approach containing four stages is proposed to discover the predecessor–successor rules. © 2006 Wiley Periodicals, Inc. Int J Int Syst 21: 621–637, 2006.  相似文献   
9.
胡桃夹子     
富于节日喜庆气氛的芭蕾舞剧《胡桃夹子》录音、录像繁多。这个伦敦科文特花园歌剧院芭蕾舞团的2000年的现场录像与其它版本比较,  相似文献   
10.
A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of /spl plusmn/0.5 /spl mu/m. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices.  相似文献   
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