500 kV 开关弹簧机构支架螺栓断裂的原因分析及处理

HPL500B2型弹簧机构支架(BA)螺栓断裂可能导致开关分合闸失败,对其原因进行分析,发现BA螺栓由于预紧固力矩过大,接近其扭断力矩,使得作用在BA螺栓上的力偏高,BA螺栓安全系数仅为12%,安全系数较低。列出BA螺栓更换步骤及注意事项,并详细介绍分闸、合闸弹簧调整步骤,为类似事件的处理提供参考。     

餐饮废油生物柴油低温流动性的改进研究

使用气-质联用仪测定餐饮废油生物柴油(WCME)和-10号柴油(-10PD)的组成,使用冷滤点试验器和运动黏度试验器测定WCME的低温流动性,同时使用调合、添加低温流动性改进剂的方法改进WCME的低温流动性。实验结果表明,WCME主要由饱和脂肪酸甲酯和不饱和脂肪酸甲酯组成,质量分数分别为27.63%和71.81%;WCME冷滤点为0℃,运动黏度(40℃)为4.41mm2/s;WCME与-10PD调合后,冷滤点降低,其中B20的冷滤点最低,为-13℃,运动黏度随着WCME的体积分数的减少,逐渐接近-10PD的运动黏度。通过添加低温流动性改进剂,WCME,B10,B20的冷滤点分别从0,-8,-13℃降至-4,-26,-25℃。     

Characteristic of polysaccharides from Flammulina velutipes in vitro digestion under salivary,simulated gastric and small intestinal conditions and fermentation by human gut microbiota

In this study, in vitro digestion and fermentation of Flammulina velutipes -derived polysaccharides (FVP) were investigated. It was found that FVP mainly consisted of 48.45% glucose, 15.40% mannose, 14.60% xylose, 11.80% fucose and 9.90% galactose. The -human saliva, simulated gastric and small intestinal juices conditions did not break down the FVP. Based on in vitro fermentation tests, FVP modulated the composition of gut microbiota by elevating the amounts of Bifidobacteriaceae and Bacteroidaceae and reducing the numbers of genera Lachnospiraceae and Enterococcaceae. Meanwhile, FVP affected the synthesis of short-chain fatty acids derived from gut microbiota.     

Effects of Undercooling and Transformation Time on Microstructure and Strength of Fe–C–Mn–Si Superbainitic Steel

Strength of Materials - A metallographic method, dilatometry, and X-ray diffraction were applied to investigate the effects of undercooling and holding time on bainitic transformation,...     

Spreading and Curing Behaviors of a Thermosetting Droplet-Silicone on a Heated Surface

Thermosetting materials are widely used as encapsulation in the electrical packaging to protect the core electronic components from external force, moisture, dust, and other factors. However, the spreading and curing behaviors of such kind of fluid on a heated surface have been rarely explored. In this study, we experimentally and numerically investigated the spreading and curing behaviors of the silicone(OE6550 A/B, which is widely used in the light-emitting diode packaging) droplet with diameter of ～2.2 mm on a heated surface with temperature ranging from 25 ℃ to 250 ℃. For the experiments, we established a setup with high-speed camera and heating unit to capture the fast spreading process of the silicone droplet on the heated surface. For the numerical simulation, we built a viscosity model of the silicone by using the Kiuna's model and combined the viscosity model with the Volume of Fluid(VOF) model by the User Defined Function(UDF) method. The results show that the surface temperature significantly affected the spreading behaviors of the silicone droplet since it determines the temperature and viscosity distribution inside the droplet. For surface temperature varied from 25 ℃ to 250 ℃, the final contact radius changed from ～2.95 mm to ～1.78 mm and the total spreading time changed from ～511 s to ～0.15 s. By further analyzing the viscosity evolution of the droplet, we found that the decreasing of the total spreading time was caused by the decrease of the viscosity under high surface temperature at initial spreading stage, while the reduction of the final contact radius was caused by the curing of the precursor film. This study supplies a strategy to tuning the spreading and curing behavior of silicone by imposing high surface temperature, which is of great importance to the electronic packaging.