Protein Tyrosine Phosphatase Receptor Type Z in Central Nervous System Disease

Gliomas are among the most common tumors of the central nervous system and include highly malignant subtypes, such as glioblastoma, which are associated with poor prognosis. Effective treatments are therefore urgently needed. Despite the recent advances in neuroimaging technologies, differentiating gliomas from other brain diseases such as multiple sclerosis remains challenging in some patients, and often requires invasive brain biopsy. Protein tyrosine phosphatase receptor type Z (PTPRZ) is a heavily glycosylated membrane protein that is highly expressed in the central nervous system. Several reports analyzing mouse tumor models suggest that PTPRZ may have potential as a therapeutic target for gliomas. A soluble cleaved form of PTPRZ (sPTPRZ) in the cerebrospinal fluid is markedly upregulated in glioma patients, making it another promising diagnostic biomarker. Intriguingly, PTPRZ is also involved in the process of remyelination in multiple sclerosis. Indeed, lowered PTPRZ glycosylation by deletion of the glycosyltransferase gene leads to reduced astrogliosis and enhanced remyelination in mouse models of demyelination. Here, we review the expression, molecular structure, and biological roles of PTPRZ. We also discuss glioma and demyelinating diseases, as well as the pathological role of PTPRZ and its application as a diagnostic marker and therapeutic target.     

Surface characteristics of chemical conversion coating for Mg-Al alloy

The chemical conversion coating was formed on Mg alloy for low cost and harmlessness in environment by using the colloidal silica as the main component. The film formed at 298 K was thick, which was thought to be the combination of Si and O. In salt spray test, the ratio of black rust on the specimen that did not conducted chemical conversion treatment was five times or more than those of the chemical conversion treated specimen. The film of chemical conversion coating produced by alkali treatment process was thinner than the specimen produced in basic chemical conversion treatment solution.     

Bi-Cu film deposition in aqueous solutions

The relatively uniform bismuth-copper film was electrodeposited between −15 and −20 mV in the sulfate electrolyte containing 4 mmol/L bismuth ion and 2 mmol/L copper ion. Only copper was electrodeposited at −5 mV. The dendritic bismuth-copper film was electrodeposited under −20 mV. The cathodic current became constant between −20 and −400 mV. Therefore, bismuth-copper electrodeposition changes from charge transfer controlling to diffusion controlling at −20 mV. On the other hand, the uniform bismuth-copper film was electrodeposited between −5 and −35 mV in the methanesulfonate electrolyte containing 4 mmol/L bismuth ion and 2 mmol/L copper ion. The dendritic bismuth-copper film was electrodeposited under −35 mV. The potential region for good electrodepositon in methanesulfonate electrolyte is wider than that in sulfate electrolyte. Therefore, it is easy to control electrodeposition conditions by using methanesulfonate electrolyte.     

Characterization of the chemical conversion films that form on Mg−Al alloy in colloidal silica solution

Chemical conversion treatment of Mg−Al alloy (AZ91) using colloidal silica as an alternative to chromate conversion was investigated as a function of solution pH, temperature, solution conditions, and treatment time. The solution used for the colloidal silica coating consisted of colloidal silica, titanium sulfate, and cobalt ions to maintain good anti-corrosion and adhesion properties. Adding CoSO₄ to the colloidal silica solution enhanced the adhesion force between the silica film and magnesium substrate. The optimum conditions for the chemical conversion treatment solution were pH 2, 90-sec treatment, and 25°C.     

The effect of polyimide surface chemistry and morphology on critical stress intensity factor

The increasingly severe demands of concurrently increasing die size while reducing the package size have made the mechanical stability of IC packaging technologies a grave concern. The dominant failure is caused at the interface between dissimilar materials. To investigate the effect of polyimide surface morphology and chemistry on the epoxy molding compound adhesion, the polyimide samples were characterized by X-ray photoemission spectroscopy, atomic force microscopy, attenuated total reflection and interfacial adhesion tests. The results of the characterization and an explanation of the primary factors affecting interfacial adhesion are presented in this paper.     

Coal liquefaction mechanism using a tritium tracer method

To determine the behavior of hydrogen in tetralin, the reaction of tetralin with tritiated gaseous hydrogen was studied in a flow reactor at 400–450°C, 2.5–9.8 MPa for various residence times. The amount of hydrogen exchange between tetralin and tritiated hydrogen was estimated from the balance of hydrogen and tritium. Although yields of methylindan and naphthalene, and the hydrogen-exchange ratio (HER) of tetralin increased monotonously with residence time, these values were scarcely influenced by the reaction pressure at every temperature. It was thought that the formation of tetralyl radicals in this system would be the rate-determining step for both the conversions of tetralin into methylindan and naphthalene, and the hydrogen exchange of tetralin. Conversions of tetralin into methylindan and naphthalene, and the hydrogen-exchange reaction using the autoclave were very close to those using the flow reactor.     

Electrochemical studies of zirconium and hafnium in alkali chloride and alkali fluoride-chloride molten salts

The electrochemical reduction of zirconium and hafnium in alkali chloride or fluoride-chloride molten salts on platinum electrodes has been investigated by means of linear and cyclic voltammetry. It has been found that fluoride ions greatly influenced the reduction of zirconium and hafnium in fluoride-chloride melts. It has been proposed that the mechanism for reduction of zirconium and hafnium in baths containing a low concentration of fluoride compounds is different from the mechanism in baths containing a higher fluoride concentration.     

Corneal critical barrier against the penetration of dexamethasone and lomefloxacin hydrochloride: evaluation by the activation energy for drug partition and diffusion in cornea

The cornea is a solid barrier against drug permeation. We searched the critical barrier of corneal drug permeation using a hydrophobic drug, dexamethasone (DM), and a hydrophilic drug, lomefloxacin hydrochloride (LFLX). The activation energies for permeability of DM and LFLX across the intact cornea were 88.0 and 42.1 kJ/mol, respectively. Their activation energies for permeability across the cornea without epithelium decreased to 33.1 and 16.6 kJ/mol, respectively. The results show that epithelium is the critical barrier on the cornea against the permeation of a hydrophobic drug of DM as well as a hydrophilic drug of LFLX. The activation energy of partition for DM (66.8 kJ/mol) was approximately 3-fold larger than that of diffusion (21.2 kJ/mol). The results indicate that the partition for the hydrophobic drug of DM to the corneal epithelium is the primary barrier. Thermodynamic evaluation of activation energy for the drug permeation parameters is a good approch to investigate the mechanism of drug permeability.     

DISSOLUTION THEORY OF GOLD IN ALKALINE THIOUREA SOLUTION(Ⅰ) Anodic Behavior on Gold in Alkaline Thiourea Solution Containing Na_2SO_3

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Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder

In this paper, a new method is proposed for evaluating the high-cycle fatigue strength of BGA (Ball Grid Array) packages with Pb-free solder and Pb–Sn solder due to vibration. An attached weight induced mixed mode stress in the solder ball of a package was used. To consider the effect of the mixed mode stress that occurred in a solder ball and the frequency to fatigue strength of the solder ball, a test was carried out with the three kinds of weights (σ_n/τ_n = 4, 5, and 6) at various frequencies (10–27 Hz). To clarify the effect of frequency, a nonlinear analysis with a viscoplastic model was carried out within the range of 0.001–3450 Hz. From the continuous observation of the cross-section of the package and finite element method (FEM) analysis results, it was revealed that the maximum principal stress is the driving force to package failure. Although an intermetallic compound in both packages and a Pb-rich region in a Pb–Sn solder based package were confirmed by EDX microprobe analysis, they do not contribute to the initiation of a crack in a solder ball. The fatigue strength of the Pb-free solder and Pb solder was evaluated on the basis of the maximum principal stress calculated by FEM and the experimental results.