粉料特性对CBS微晶玻璃结构与性能的影响

利用不同快速球磨时间的CaO-B2O3-SiO2(CBS)玻璃粉料,制备了低温烧结的CBS玻璃陶瓷.利用X线衍射仪(XRD)和电子显微镜(SEM),分析粉料特性与 CBS玻璃陶瓷结构的关系,系统研究了粉料特性对CBS玻璃陶瓷的烧结性能、介电性能(10 GHz)及热学性能的影响.结果表明,减小粉料粒径能在较低的烧成温度下实现烧结,并有效提高致密度,有利于降低介电常数和介电损耗.热膨胀系数显著增大,其原因是随着粉料粒径的减小,生成了大量的具有低介电常数、高膨胀系数的石英相.球磨2 h试样在850 ℃的烧结密度为2.615 g·cm-3,吸水率为0.16%,9.98 GHz下的介电常数和损耗分别为6.16和1.98×10-3.     

球磨时间对硼硅玻璃基复相陶瓷性能的影响

采用经过不同球磨时间制备的硼硅玻璃与氧化铝复合,低温烧结制备了硼硅玻璃/氧化铝系复相陶瓷.利用XRD和SEM,研究了硼硅玻璃粉料球磨时间对流延成型及所制复相陶瓷的烧结性能、介电性能(10MHz)的影响.结果表明:随着球磨时间增加,粉料粒径减小,硼硅玻璃复相陶瓷烧结温度降低,密度增加,介电常数和介质损耗降低.球磨90 m...     

保温时间对钙钡硼硅复相陶瓷性能的影响

通过对钙钡硼硅玻璃与氧化铝的混合物进行烧结,制备了可用于低温共烧陶瓷基板的硼硅酸盐玻璃/α-Al2O3系复相陶瓷。研究了保温时间对所制复相陶瓷的微观结构、烧结性能和介电性能的影响。结果表明:随着保温时间的延长,所制复相陶瓷的体积密度、吸水率和介电常数先增大后减小,而介质损耗则是先减小后增大。于850℃烧结、保温20 min制得的复相陶瓷的性能最佳,其体积密度为3.12 g.cm–3,吸水率为0.11%,10 MHz下的相对介电常数和介质损耗分别为7.88和1.0×10–3。     

Microstructure and microwave dielectric properties of lead borosilicate glass ceramics with Al2O3

The effects of Al₂O₃ addition on both the sintering behavior and microwave dielectric properties of PbO-B₂O₃-SiO₂ glass ceramics were investigated by Fourier transform infrared spectroscope (FTIR), differential thermal analysis (DTA), X-ray diffraction (XRD) and scanning electron microscopy (SEM). The results show that with the increase of Al₂O₃ content the bands assigned to [SiO₄] nearly disappear. Aluminum replaces silicon in the glass network, which is helpful for the formation of boron-oxygen rings. The increase of the transition temperature T _g and softening temperature T _f of PbO-B₂O₃-SiO₂ glass ceramics leads to the increase of liquid phase precipitation temperature and promotes the structure stability in the glasses, and consequently contributes to the decreasing trend of crystallization. Densification and dielectric constants increase with the increase of Al₂O₃ content, but the dielectric loss is worsened. By contrast, the 3% (mass fraction) Al₂O₃-doped glass ceramics sintered at 725 °C have better properties of density ρ=2.72 g/cm³, dielectric constant ɛ _r =6.78, dielectric loss tan δ=2.6×10⁻³ (measured at 9.8 GHz), which suggest that the glass ceramics can be applied in multilayer microwave devices requiring low sintering temperatures.