Systematic characterization of Cl2 reactive ion etchingfor improved ohmics in AlGaN/GaN HEMTs

Pre-metal-deposition reactive ion etching (RIE) was performed on an Al_0.3Ga_0.7N/AlN/GaN heterostructure in order to improve the metal-to-semiconductor contact resistance. An optimum AlGaN thickness for minimizing contact resistance was determined. An initial decrease in contact resistance with etching time was explained in terms of removal of an oxide surface layer and/or by an increase in tunnelling current with the decrease of the AlGaN thickness. The presence of a dissimilar surface layer was confirmed by an initial nonuniform etch depth rate. An increase in contact resistance for deeper etches was experienced. The increase was related to depletion of the two-dimensional (2-D) electron gas (2-DEG) under the ohmics. Etch depths were measured by atomic force microscopy (AFM). The contact resistance decreased from about 0.45 Ωmm for unetched ohmics to a minimum of 0.27 Ωmm for 70 Å etched ohmics. The initial thickness of the AlGaN layer was 250 Å. The decrease in contact resistance, without excessive complications on device processing, supports RIE etching as a viable solution to improve ohmic contact resistance in AlGaN/GaN HEMTs     

High-breakdown-voltage AlInAs/GaInAs junction-modulated HEMT's(JHEMT's) with regrown ohmic contacts by MOCVD

A technology for increasing both the two-terminal gate-drain breakdown and subsequently the three-terminal-off-state breakdown of AlInAs/GaInAs high-electron-mobility transistors (HEMTs) to record values without substantial impact on other parameters is presented. The breakdown in these structures is dependent on the multiplication of electrons injected from the source (channel current) and the gate (gate leakage) into the channel. In addition, holes are generated by high fields at the drain and are injected back into the gate and source electrodes. These phenomena can be suppressed by increasing the gate barrier height and alleviating the fields at the drain. Both have been achieved by incorporating a p⁺-2DEG junction as the gate that modulates the 2DEG gas and by utilizing selective regrowth of the source and drain regions by MOCVD. The 1-μm-gate-length devices fabricated have two-terminal gate-drain and three-terminal-off-state breakdown voltages of 31 V and 28 V, respectively     

High-power polarization-engineered GaN/AlGaN/GaN HEMTs without surface passivation

In this paper, a high-power GaN/AlGaN/GaN high electron mobility transistor (HEMT) has been demonstrated. A thick cap layer has been used to screen surface states and reduce dispersion. A deep gate recess was used to achieve the desired transconductance. A thin SiO/sub 2/ layer was deposited on the drain side of the gate recess in order to reduce gate leakage current and improve breakdown voltage. No surface passivation layer was used. A breakdown voltage of 90 V was achieved. A record output power density of 12 W/mm with an associated power-added efficiency (PAE) of 40.5% was measured at 10 GHz. These results demonstrate the potential of the technique as a controllable and repeatable solution to decrease dispersion and produce power from GaN-based HEMTs without surface passivation.     

Effect of ohmic contacts on buffer leakage of GaN transistors

The effect of ohmic contacts on the buffer leakage of GaN transistors is presented. The buffer leakage for AlGaN/GaN high-electron mobility transistors and GaN MESFETs grown on the same underlying buffer was observed to be different. Controlled experiments show that the increased buffer leakage is due to the nature of the alloyed ohmic contacts and can be minimized if they are screened by the Si doping or by the two-dimensional electron gas.     

High Output Saturation and High-Linearity Uni-Traveling-Carrier Waveguide Photodiodes

Waveguide uni-traveling-carrier photodiodes (UTC-PDs) have been fabricated and tested. Output saturation currents greater than 40 mA at 1 GHz are demonstrated for a 10 mumtimes150mum photodiode (PD). The third-order intermodulation distortion is also measured and exhibits a third-order output intercept point of 43 dBm at 20 mA and 34 dBm at 40 mA for this same PD. UTC-PDs with geometries of 5 mumtimes100 mum and 10 mumtimes100 mum are also compared and it is shown that a wider waveguide PD has improved saturation characteristics due to the lower optical power density which reduces the saturation at the front end of the device     

Photoluminescence and photoluminescence excitation spectra of In0.2Ga0.8N-GaN quantum wells: comparison betweenexperimental and theoretical studies

InGaN-GaN represents an important heterostructure with applications in electronics and optoelectronics. It also offers a system where we can study the effects of interface roughness, alloy clustering, and the piezoelectric effect. In the paper, we examine how these factors influence the photoluminescence and excitation photoluminescence in InGaN-GaN quantum wells. We examine the Stokes shift as a function of the excitation level and doping and relate the values to the piezoelectric effect and disorder in the system. Detailed comparisons are made with experimental results     

Tunable sampled-grating DBR lasers using quantum-well intermixing

Widely tunable lasers are key components for wavelength division multiplexing fiber optic networks. They reduce cost in sparing, enable dynamic networking applications, and present opportunities for future monolithically integrated wavelength division multiplexing components. The sampled-grating distributed Bragg reflector (SGDBR) laser is ideal for these purposes. The authors present a centered quantum-well SGDBR laser which uses quantum-well intermixing in order to improve device characteristics over previous designs. The mode overlap is improved by 50% over the offset quantum-well design, improving the modal gain. Current injection tuning in the intermixed material is demonstrated for the first time; the maximum modal group index change was measured to be 1%.     

Widely tunable negative-chirp SG-DBR laser/EA-modulated transmitter

Ten Gb/s low power penalty (<0.5 dB) error-free transmission was achieved through 75 km using a high-performance sampled-grating (SG) distributed Bragg reflector (DBR) laser/EAM transmitter. Large signal chirp measurements show negative chirp operation across the entire tuning range of the devices. An integration-oriented quantum-well-intermixing (QWI) process was employed for the realization of these devices.     

Geometrical Characteristics and Surface Polarity of Inclined Crystallographic Planes of the Wurtzite and Zincblende Structures

Inclined crystallographic planes of the wurtzite structure were investigated in comparison with the zincblende structure in terms of surface geometry characteristics. The ball–stick model indicates that the semipolar surface possesses a surface polarity resembling the anion polarity, which agrees with the common experimental observations of epitaxial growth preference for the cation-polarity surface over the surface. The wurtzite surface was found to share geometrical similarities with the zincblende {100} surface uniquely among the possible semipolar planes. This finding encourages epitaxial growth on the plane of wurtzite semiconductors, e.g., GaN, with the potential of avoiding atomic step formations typically associated with off-axis crystallographic planes.