遥感卫星随遇接入互联网星座和在轨智能处理

低轨互联网星座是当前全球研究和发展的热点,互联网星座支持随遇接入遥感卫星和信息在轨直接处理的应用前景备受期待,但由于轨道高度不同会产生双向高动态异构星座的接入互联问题。首先,通过设定低轨卫星互联网星座在不同轨道特性、不同卫星数量情况下的随遇接入仿真场景,重点探讨了时空非连续可视性和多普勒频移问题对遥感卫星接入性能的影响;其次,基于遥感卫星随遇接入互联网星座场景的特点,分析了不同时延性在轨处理任务的流程及其星地功能分配;最后,对当前在轨智能处理算法存在的问题和未来研究重点进行阐述,为未来低轨互联网星座及遥感卫星的发展和联合组网应用提供可靠的理论支撑。     

专题:6G的智能通信计算融合技术

内容导读目前,针对潜在6G关键技术的场景与需求研究成为学术界的热点。面向未来更多类型终端的智能互联与新兴服务的需求,人工智能应用于无线通信物理层的信道估计、编译码及接收机设计,解决基于大数据的网络自主优化,基于泛在无线感知和边缘侧的强大算力构成的多接入边缘计算,已成为6G无线技术发展的重要趋势。在未来智能车联网、物联网、有人/无人交互、全息通信等场景下,面向未来的智能通信计算融合需求,存在许多拟待解决的关键科学问题。     

The effect of alkali metal oxide on the properties of borosilicate fireproof glass: Structure,thermal properties,viscosity, chemical stability

The purpose of the current work was to research the effect of alkali metal oxide on the structure, thermal properties, viscosity and chemical stability in the glass system (R₂O–CaO–B₂O₃–SiO₂) systematically. Because the glass would emulsify when Li₂O was added to the glass batch, this article did not discuss Li₂O. The results showed that when the amount of Na₂O was less than 4 mol.%, there was a higher interconnectivity of borate and silicate sub-networks in glass, as more mixed Si–O–B bonds were present in glass. The glass samples exhibited excellent thermal properties and chemical stabilities. As the amount of Na₂O exceeded 4 mol.%, the interconnectivity of borate and silicate sub-networks was weakened. The thermal properties and chemical stabilities of the glass samples were reduced. The connectivity of the silicate sub-network was weakened slightly as the Na/K ratio varied, and the coefficient of thermal expansion (CTE) of the glass samples gradually increased, and the resistance to thermal shock (RTS) value gradually decreased. Moreover, the viscosity of the glass samples decreased with the ratio of Na/Si and Na/K increased.     

Interfacial microstructure and mechanical properties of Ti3SiC2 ceramic and TC11 alloy joint diffusion bonded with a Cu interlayer

Reliable joints of Ti₃SiC₂ ceramic and TC11 alloy were diffusion bonded with a 50 μm thick Cu interlayer. The typical interfacial structure of the diffusion boned joint, which was dependent on the interdiffusion and chemical reactions between Al, Si and Ti atoms from the base materials and Cu interlayer, was TC11/α-Ti + β-Ti + Ti₂Cu + TiCu/Ti₅Si₄ + TiSiCu/Cu(s, s)/Ti₃SiC₂. The influence of bonding temperature and time on the interfacial structure and mechanical properties of Ti₃SiC₂/Cu/TC11 joint was analyzed. With the increase of bonding temperature and time, the joint shear strength was gradually increased due to enhanced atomic diffusion. However, the thickness of Ti₅Si₄ and TiSiCu layers with high microhardness increased for a long holding time, resulting in the reduction of bonding strength. The maximum shear strength of 251 ± 6 MPa was obtained for the joint diffusion bonded at 850 °C for 60 min, and fracture primarily occurred at the diffusion layer adjacent to the Ti₃SiC₂ substrate. This work provided an economical and convenient solution for broadening the engineering application of Ti₃SiC₂ ceramic.     

A blind dual color images watermarking based on quaternion singular value decomposition

Multimedia Tools and Applications - With the rapid development of the Internet, the color digital image copyright protection is facing severe challenges. Simultaneously, the color digital images...