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The microstructural evolution of nanocrystalline Cu-10%Nb(mass fraction) alloy during mechanical alloying (MA) was investigated by using X-ray diffraction, optical microscopy(OM), scanning electron microscopy (SEM) and transmission electron microscopy (TEM) observation. Upon milling of Cu-Nb powders with coarse grains, the grain size is found to decrease gradually with lengthening milling time, and reach the minimum value (about 9 nm) after 100 h milling. The microstrain and the microhardness of the powders increase during the grain refinement. And Cu lattice parameter increases steadily over 100 h milling. The mechanisms of solid solution extension during milling were discussed. The results show that up to 10%Nb can be brought into solid solution by MA. The extension of solid solution is found to relate closely with the formation of nanocrystalline.  相似文献   
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通过硬度、电导率、光学显微镜和透射电镜等测试手段分析Cu-0.7Fe-0.12P合金的性能与组织,研究形变及时效处理对其组织与性能的影响,得出冷变形量与热处理工艺的优化组合,为该合金的实际生产提供参考。合金经900℃固溶并40%冷轧、450℃时效6 h、70%冷轧后,在400、450和500℃分别时效1 h。研究结果表明,在450℃时效合金的硬度(141 HV)和相对电导率(89.9%IACS)均达到了较好的状态;而直接对合金冷轧变形80%并在450℃下时效1 h后,相对电导率为70%IACS,比经双冷轧双时效处理后测得的合金相对电导率小。  相似文献   
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通过显微硬度及相对电导率测试、光学显微镜和扫描电镜观察,研究了Cu-2.3Fe-0.05P-0.2Zn(C194)合金与Cu-2.3Fe-0.6P-0.2Zn合金冷轧态与时效态的组织与性能。结果表明:添加0.6%P元素,铜合金内部形成大量Fe2P相,一部分固溶到基体,一部分以颗粒形式弥散存在于合金内,尺寸可达10μm,后续热处理难以消除;Cu-2.3Fe-0.6P-0.2Zn合金的初始加工态性能优于C194合金,但基体中Fe溶质原子的浓度低,电导率上升速率变低;微米级Fe2P颗粒会激发再结晶,再结晶软化作用使得Cu-2.3Fe-0.6P-0.2Zn合金耐热性能低于C194合金。对于C194合金,P不宜过量。  相似文献   
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采用TEM,SEM,硬度及电导率测试等手段,研究了Cu-2.1Fe合金在不同温度长期时效后析出相形貌和合金性能的变化.结果表明,500℃为合金最佳时效温度,峰时效硬度平台期较长.合金峰时效时γ-Fe粒子平均直径约12 nm,且与基体完全共格.g-Fe粒子长大后会渐渐失去共格效应且方形化,粗化规律符合Lifshitz-Slyozov-Wagner(LSW)规律,粗化激活能为222 kJ/mol.Fe粒子的时效强化效果不显著,最大强度增量约100 MPa.Cu-2.1Fe合金欠时效时遵循的强化机制为共格强化机制,合金过时效后强化机制为Orowan强化机制,理论预测与实验结果符合良好.  相似文献   
5.
The microstructure evolution and high thermal stability of the mechanically-alloyed supersaturated nanocrystalline Cu-10%Nb alloy during subsequent heat treatment were investigated by X-ray diffractometry and transmission electron microscopy (TEM). The results show that no significant change of the microstructure of the solid solution can be detected after annealing at 300-400 ℃. The pronounced phase separation can be detected at 700 ℃. After annealing for 30 min at 900 ℃, almost all the Nb atoms precipitate from the solid solution, and the average Cu grain size is about 37 nm. As the solute atoms hinder the migration of fcc phase, at Cu grain boundaries, no significant grain growth occurs before large amount of Nb atoms precipitates from Cu matrix, and the decrease of internal strain and density of dislocation is small. Furthermore, the nanosized Nb precipitates can also help to reduce the Cu grains growth through precipitating pinning effect. Therefore, the mechanically-alloyed nanocrystalline Cu-Nb alloys have a high thermal stability. And the contaminations brought into the Cu matrix by milling can influence the phase formation and the thermal stability of Cu-Nb alloys during heat treatment.  相似文献   
6.
研究固溶、变形及时效处理对感应熔炼Cu-1.5Ni-0.34Si合金组织与性能的影响.通过硬度、电导率、光学显微镜(OM)和透射电子显微镜(TEM)等测试手段分析合金性能与组织,得出优化的热处理工艺,为该系合金的实际生产提供参考.结果表明,合金经热轧后在700、800和900℃三个温度下分别固溶1h后,晶粒大小分别约为...  相似文献   
7.
采用3种不同的工艺(直接在450℃下进行时效处理;80%冷轧,然后在450℃下进行时效处理;600℃/8 h高温预时效+80%冷轧+780℃/2 min+450℃/16 h终时效)对固溶处理后的Cu-2.0Ni-0.34Si-Mg合金进行形变热处理,研究形变热处理工艺对该合金的组织与硬度及电导率的影响。结果表明:采用第3种工艺对合金进行形变热处理,由于其中的短时高温预处理可以获得溶质原子充分固溶的过饱和固溶体,因此终时效后的合金具有最佳的综合性能,显微硬度为180 HV,相对电导率为49.8%IACS,伸长率为13%。合金的平均晶粒尺寸约为20μm,主要析出强化相为δ-Ni2Si。  相似文献   
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