利用高频结构仿真器分析波导魔T

高频结构仿真器（HFSS）是一种微波器件设计软件，该软件界面友好，通过仿真计算减小了调试工作量，使得微波器件的设计变得简单易行。本文利用HFSS对波导魔T进行了仿真分析，得到了该器件的S参数和动、静态场的分布情况，并对该器件进行了优化设计。     

复杂土坝的渗流安全分析评价

根据福华山土坝的渗流观测资料,建立了测压管水位的回归统计模型,定量分析了各影响量(水位分量、时效分量)对测压管水位的影响效应。在此基础上,结合观测资料,采用有限元法反演了大坝各填筑区的渗透系数,并综合评价了大坝的渗流性态。     

Oxidation of Hastelloy-XR Alloy for Corrosion-Resistant Glass-Coating

The oxidation behavior of Hastelloy-XR alloy was investigated to obtain the optimum surface condition for corrosion-resistant glass-coatings. The surface morphology of oxide scales changed significantly with variation of temperatureand oxygen partial pressure (po2 ). The oxidation kinetics was mainly parabolic independent of oxidation conditions.The oxide scales were consisted of inner Cr2O3 and outer spinel layers. The phase component of spinel layers wereMn1.5Cr1.5O4 and (Mn,Ni)(Cr,Fe)2O4 for the oxygen partial pressures po2<10 kPa and po2>10 kPa, respectively.The optimum oxidation condition to obtain an oxide scale for well-adhered glass-coating to the substrate was 1248 Kand po2 =0.01 kPa for the oxidation time of 43 ks.     

一种高性能的新结构IGBT

提出了一种低功率损耗的新结构IGBT.该新结构的创新点在于其复合耐压层结构,该耐压层包括深扩散形成的n型缓冲层和硼注入形成的透明背发射区两部分.虽然在正常工作条件下,该新结构IGBT工作于穿通状态,但器件仍具有非穿通IGBT(NPT-IGBT)的优良特性.该新结构IGBT具有比NPT-IGBT更薄的芯片厚度,从而可以获得更好的通态压降和关断功耗之间的折衷.实验结果表明:与NPT-IGBT相比较,新结构IGBT的功率损耗降低了40%.     

Effect of Stoichiometry on Properties of Rare-Earth-Based Hydrogen Storage Alloy for Nickel-Metal Hydride Secondary Battery

Effect of stoichiometry on microstructures, electrochemical properties and PCT characteristics of the alloys MI(Ni0.71Co0.15-Al0.06Mn0.08)x (MI=Lanthanum-rich Michmetal, x=4.6~5.2) have been investigated. The lattice constants a, c, and cellvolumes of non-stoichiometric alloys are bigger than those of the stoichiometric alloy. With the increasing stoichiometry x,the value of a decreases, and the value of c and cell volume increases except for those of the stoichiometric alloy; the plateaupressure of PCT curve, discharge capacity and cycling stability all increase. The alloy with x=5.2 shows the highest dischargecapacity and the best cycling stability among the studied alloys.     

工艺因素对金属封装外引线弯曲疲劳的影响

考察了金属封装外壳制造工艺对外引线弯曲疲劳的影响,发现电镀镍是导致外引线弯曲次数明显减少的最主要工艺步骤,且随镀镍层厚度的增加,弯曲次数减少。此外还讨论了外引线的氢含量和晶粒度对引线抗疲劳能力的影响。     

Pruning Redundant Alarm Correlation Patterns

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