Sealing behaviour of glass-based composites for oxygen transport membranes

In this study, seven different filler materials in different proportions were added to a Ba-Ca-Si glass matrix “H” to investigate new sealant with higher thermal expansion coefficient (CTE) value and good sealing performance for application in oxygen transport membrane (OTM). SrTi_0.75Fe_0.25O_3-δ (STF25) was used as an OTM, and the sealing partners were ferritic steel Aluchrom and pre-oxidized Aluchrom. Compatibility tests were carried out to investigate the feasibility of the composites. Higher CTE values were found in dilatometer tests on composite samples by adding 40 wt% Ag (HAg40) and 30 wt% Ni-Cr (HNC30). Gas-tightness measurements of sandwiched samples produced appropriate helium leakage rates in the range of 10^?6 mbar·l·s^?1. Sealing behaviour of sealants HAg40 and HNC30 were investigated by joining STF25 and as-delivered/pre-oxidized Aluchrom together. Scanning electron microscopy (SEM) on cross-sections of the joints revealed a homogeneous microstructure and good adherence of the glass sealants to support metals and STF25.     

一种用于高T;无卤覆铜板的含氮酚醛树脂的制备方法

文章涉及一种新型含氮树脂的制备方法,替代传统的含氮树脂,使用溶剂充分溶解,作为含磷树脂的固化剂,可用于无卤覆铜板的生产,所得覆铜板的性能均一,T;180 ℃以上,耐热性T288 ℃约为10 min。     

Study on residual stress in viscoelastic thin film using curvature measurement method

Using LSM (laser scanning method), the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10% at 100°C and 20% at 150°C for two hours.     

Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration

Managing the emerging internal mechanical stress in chips, particularly if they are 3D stacked, is a key task to maintain performance and reliability of microelectronic products. Hence, a strong need of a physics-based simulation methodology emerges. This physics-based simulation, however, requires material parameters with high accuracy. A full-chip analysis can then be performed, balancing the need for local resolution and computing time. The key for an efficient simulation of a 3D stacked IC is a comprehensive database with material properties for multiple scales of the affected materials. Therefore, effective “composite-type” material data for several regions of interest are needed. Advanced techniques to measure FEA- and design-relevant properties such as adhesion properties and effective CTE values are presented.     

Multipass rolling of aluminium alloys: finite element simulations and microstructural evolution

Abstract

Use of numerical predictive methods such as finite element analysis is becoming progressively more common for modelling industrial hot metal working and forming processes. These tools are used not only to predict the thermomechanical behaviour of metals but increasingly to predict microstructural changes by linking them to physical models of recrystallisation and textural evolution. This paper describes the development and application of a fully integrated model for the prediction of thermomechanical and microstructural behaviour during multipass hot rolling of aluminium alloy AA 3104. Finite element code ABAQUS/standard has been used in the work and the process is modelled assuming plane strain conditions. It is shown that for this alloy the static recrystallisation which occurs during interpass cooling does not significantly influence the thermomechanical response during subsequent rolling passes.     

高体积比SiC_p/6013Al复合材料反应熔渗制备与热学性能

采用反应熔渗法在低压力下制备高体积比SiCp/Al复合材料 ,并研究其热学性能。临界熔渗压力与SiC颗粒尺寸及反应程度有关。Al熔体在无压或低压力下能渗入SiC预成形坯 ,制备出组织均匀的高体积比SiCp/Al复合材料 ,SiC颗粒体积分数约 5 0 %。界面反应对SiCp/Al复合材料的CTE的影响很小 ,但会降低SiC/Al的界面传热系数 ,影响材料的导热性能。降低熔渗温度和缩短保温时间可缓减界面反应程度 ,提高复合材料的热学性能 ,CTE在 10× 10 - 6 /K以下 ,复合材料的导热系数达到 164(W·m- 1 ·K- 1 )。     

铝合金RTM模具制备设计研究

复合材料成型工艺中树脂传递模塑(RTM)成型已在航空航天、汽车等制造领域得到广泛应用。但由于传统钢制模具质量太大,限制了大型复合材料制件采用RTM成型工艺的发展。设计研究了采用铝合金制备RTM成型模具的减轻质量效果,分析了克服铝合金材质热膨胀系数对模具形变影响的解决方案。结果表明,铝合金模具减轻质量效果尤为明显,相较钢模减轻50%;通过减小模具型腔尺寸,提高注胶和脱模温度、设置必要的保护装置等方法,可克服铝合金热膨胀系数大、硬度低等缺陷;并且其成型出的制品表面光洁,内部无分层和脱胶现象,尺寸精度达到设计要求。     

The dielectric,thermal properties and crystallization mechanism of Li–Al – B–Si – O glass – Ceramic systems as a new ULTCC material

Li–Al–B–Si–O (LABS) glass-ceramics with a sintering temperature of 600 °C were studied for ultra-low temperature co-fired ceramics (ULTCC) applications. The crystal phase of LABS glass-ceramics is dendritic β-spodumene. The permittivity and dielectric loss of LABS glass-ceramics are ε_r = 5.8 and tgδ = 1.3 × 10⁻³ at 10 MHz, respectively. The coefficient of thermal expansion (CTE) of LABS glass-ceramics is 3.23 ppm/°C, which is close to that of silicon. The dielectric and thermal properties of LABS glass-ceramics are closely correlated to the degree of its crystallization. The permittivity decreases continually while the dielectric loss decreases first and slightly increases with the increasing of crystallization of β-spodumene. The CTE of LABS glass-ceramics decreases as β-spodumene crystallized from LABS glass. The crystallization kinetic and mechanism of LABS glass-ceramics indicate that the β-spodumene crystallizes in a two-dimensional interfacial growth mechanism due to the migration of Li-ions. The diffusion coefficients derived from energy-dispersive X-ray spectroscopy (EDS) results indicated that both Al and Ag electrodes have good compatibilities with ULTCC tapes, which could reduce the cost of multilayer electro-ceramic devices dramatically by using the ULTCC and base metallization.     

Colorless polyimides derived from 1S,2S,4R,5R-cyclohexanetetracarboxylic dianhydride,self-orientation behavior during solution casting,and their optoelectronic applications

A novel cycloaliphatic monomer for polyimides (PI), 1S,2S,4R,5R-cyclohexanetetracarboxylic dianhydride (H′-PMDA) is proposed in this work. H′-PMDA shows high polymerizability with various diamines in contrast to its isomer, i.e., conventional hydrogenated pyromellitic dianhydride (H-PMDA) and leads to highly flexible and colorless PI films with very high T_g's. In particular, the combinations with rigid structures of diamines give rise to PIs with significantly decreased coefficients of thermal expansion (CTE) owing to high extents of in-plane chain orientation induced by thermal imidization, whereas the H-PMDA-based counterparts do not. The decreased CTE reflects structural rigidity/linearity of the H′-PMDA-based diimide units as supported by liquid crystallinity observed in the corresponding model compound. Solution casting of a chemically imidized PI derived from H′-PMDA and 2,2′-bis(trifluoromethyl)benzidine (TFMB) results in a lower CTE than that of the thermally imidized counterpart, suggesting the presence of a self-orientation phenomenon during solvent evaporation. The mechanism is proposed in this work. H′-PMDA/TFMB and its copolymer systems can be useful as plastic substrates in image display devices and/or novel coating-type optical compensation films.     

Crack-healing behaviour of MoSi2 dispersed Yb2Si2O7 environmental barrier coatings

MoSi₂ doped Yb₂Si₂O₇ composites were designed to extend the lifetime of Yb₂Si₂O₇ environmental barrier coatings (EBCs) via self-healing cracks during high-temperature applications. Yb₂Si₂O₇–Yb₂SiO₅–MoSi₂ composites with different mass fractions were prepared by applying spark plasma sintering. X-ray diffraction results confirmed that the composites consisted of Yb₂Si₂O₇, Yb₂SiO₅, and MoSi₂. The thermal expansion coefficients (CTEs) of the composites increased with an increase in the MoSi₂ content. The average CTE of the 15 wt% MoSi₂ doped Yb₂Si₂O₇ composite was 5.24 × 10^?6 K^?1, indicating that it still meets the CTE requirement of EBC materials. After being pre-cracked by using the Vickers indentation technique, the samples were annealed for 0.5 h at 1100 or 1300 °C to evaluate the crack-healing ability. Microstructural studies showed that cracks in 15 wt% MoSi₂ doped Yb₂Si₂O₇ composites were fully healed during annealing at 1300 °C. Two mechanisms may be responsible for crack healing. First, the cracks were filled with SiO₂ glass formed by MoSi₂ oxidation. Second, the formed SiO₂ continued to react with Yb₂SiO₅ to form Yb₂Si₂O₇, which can cause cracks to heal owing to volumetric expansion. The Yb₂Si₂O₇ formation with smaller volume expansion is more beneficial.