Thermal stability of interfaces between metals and InP-based materials

The thermal stability of interfaces between metals (Ni, Pt, Ti, Mo) and III-V compound semiconductors has been investigated by the application of Rutherford backscattering spectrometry. Metal diffusion and interfacial lattice disorder of the semiconductors were analyzed for various metal/semiconductor samples annealed at temperatures up to 500°C. The interfaces of Ni/GaAs and Ti/GaAs were found to be more stable than those of Ni/In-based semiconductors and Ti/ In-based semiconductors, respectively. Faster diffusion of Pt atoms was ob-served in In-and As-containing materials than in P-containing materials. Mo/ semiconductor interfaces were the most stable.     

Genetic algorithm‐based neural‐network modeling approach applied to AlGaN/GaN devices

An accurate equivalent circuit large‐signal model (ECLSM) for AlGaN‐GaN high electron mobility transistor (HEMT) is presented. The model is derived from a distributed small‐signal model that efficiently describes the physics of the device. A genetic neural‐network‐based model for the gate and drain currents and charges is presented along with its parameters extraction procedure. This model is embedded in the ECLSM, which is then implemented in CAD software and validated by pulsed and continuous large‐signal measurements of on‐wafer 8 × 125‐μm GaN on SiC substrate HEMT. Pulsed IV simulations show that the model can efficiently describe the bias dependency of trapping and self‐heating effects. Single‐ and two‐tone simulation results show that the model can accurately predict the output power and its harmonics and the associated intermodulation distortion (IMD) under different input‐power and bias conditions. © 2012 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2013.     

Analysis of issues in gate recess etching in the InAlAs/InGaAs HEMT manufacturing process

We have developed an InAlAs/InGaAs metamorphic high electron mobility transistor device fabrication process where the gate length can be tuned within the range of 0.13 μm–0.16 μm to suit the intended application. The core processes are a two-step electron-beam lithography process using a three-layer resist and gate recess etching process using citric acid. An electron-beam lithography process was developed to fabricate a T-shaped gate electrode with a fine gate foot and a relatively large gate head. This was realized through the use of three-layered resist and two-step electron beam exposure and development. Citric acid-based gate recess etching is a wet etching, so it is very important to secure etching uniformity and process reproducibility. The device layout was designed by considering the electrochemical reaction involved in recess etching, and a reproducible gate recess etching process was developed by finding optimized etching conditions. Using the developed gate electrode process technology, we were able to successfully manufacture various monolithic microwave integrated circuits, including low noise amplifiers that can be used in the 28 GHz to 94 GHz frequency range.     

Numerical Explanation of Slow Transients in an AlGaN/GaN HEMT

观察了AlGaN/GaN HEMT器件在短期应力后不同栅偏置下的一组漏极电流瞬态,发现瞬态的时间常数随栅偏压变化很小,据此判断这组瞬态由电子陷阱的释放引起.为了验证这个判断,采用数值仿真手段计算了上述瞬态.分别考虑了在器件中不同空间位置的电子陷阱,分析了应力和瞬态中相应的陷阱行为,对比和解释了仿真曲线与测量结果的异同.基于上述讨论,提出测量的瞬态可能是表面深陷阱和GaN层体陷阱的综合作用的结果.     

基于WG-PM与HEMT的高定向光学发射器设计

为了使无线通信系统短距离数据传输速率达到10 Gbit/s,利用光电结合技术以THz波段为载波,建立了太赫兹无线通信系统.为提高无线通信系统的传输距离,设计了带有高增益天线和波导输出光电二极管模块的光学发射器.模块采用载波单向导通光电二极管、宽带高电子迁移率晶体管放大器和平面电路-波导转换衬底等技术.并对适合分析太赫兹...     

高电子迁移率晶体管太赫兹探测器特性

计算了外加太赫兹(THz)辐射下高电子迁移晶体管(HEMT)的导纳和探测响应率与入射THz辐射频率的依赖关系.结果表明,随着栅下沟道长度的增大,导纳和响应率的峰出现红移,同时高度有所下降;随着栅电压的增大,导纳和响应率的峰出现蓝移,并且高度有所上升.这些研究在太赫兹等离子探测器的设计上有着重要的作用.     

High‐efficiency transmission‐line inverse Class F power amplifiers for 2‐GHz WCDMA systems

In this article, a novel load‐network solution to implement the transmission‐line inverse Class F power amplifiers for base station WCDMA applications is presented. The theoretical analysis is based on an analytical derivation of the optimum load‐network parameters to control the second and third harmonics at the device output, including the device output parasitic shunt capacitance and series inductance. The transmission‐line inverse Class F LDMOSFET and GaN HEMT power amplifiers using NXP BLF6G22LS‐75 and CREE CGH27060F devices, respectively, were designed and measured. The high‐performance results with the drain efficiency of 70.2% and power gain of 18.0 dB for a 60‐W LDMOSFET power amplifier and with the drain efficiency of 82.3% and power gain of 14.3 dB for a 50‐W GaN HEMT power amplifier were achieved at an operating frequency of 2.14 GHz. © 2011 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2011.     

一种高效率E-1 / F 类GaN HEMT 射频功率放大器

使用GaN HEMT 功率器件,设计了一款5G 低频段的高效率E-1 / F 类射频功率放大器。为降低晶体管寄生参数及高次谐波对逆E 类(E-1 )功放开关特性和输出性能的不良影响,将具有寄生参数补偿的逆F 类(F-1 )谐波控制网络引入逆E 类功放输出匹配电路中,实现了对二次谐波和三次谐波分别进行开路和短路处理,从而获得逆E 类功放要求的良好开关特性。同时,得益于逆F 类功放优良的谐波控制效果,改善了功放漏极电压和电流波形,大大降低其漏极峰值电压和电流,进而提升了功放的输出性能。实测结果表明,该功放在3. 3 ~ 3. 6 GHz 的300MHz 有效工作带宽内的功率附加效率为59. 1% ~ 71. 4%,最大漏极效率高达75. 6%,输出功率在40. 2 ~ 41. 5dBm之间,增益平坦度在依1dB 以内。最后利用20 MHz 带宽的单载波LTE 信号作为测试信号,基于广义记忆多项式数字预失真器对该功放进行线性化后,功放输出的邻信道功率比改善了近15 dB。     

Efficient three‐dimensional parallel simulations of PHEMTs

An efficient 3D semiconductor device simulator is presented for a memory distributed multiprocessor environment using the drift–diffusion (D–D) approach for carrier transport. The current continuity equation and the Poisson equation, required to be solved iteratively in the D–D approach, are discretized using a finite element method (FEM) on an unstructured tetrahedral mesh. Parallel algorithms are employed to speed up the solution. The simulator has been applied to study a pseudomorphic high electron mobility transistor (PHEMT). We have carried out a careful calibration against experimental I–V characteristics of the 120 nm PHEMT achieving an excellent agreement. A simplification of the device buffer, which effectively reduces the mesh size, is investigated in order to speed up the simulations. The 3D device FEM simulator has achieved almost a linear parallel scalability for up to eight processors. Copyright © 2005 John Wiley & Sons, Ltd.     

最大振荡频率为200 GHz的蓝宝石衬底AlGaN/GaN HEMT

本文报道了fmax为200GHz的基于蓝宝石衬底的AlGaN/GaN 高电子迁移率晶体管（HEMT）。外延材料结构采用了InGaN背势垒层来减小短沟道效应,器件采用了凹栅槽和T型栅结合的工艺,实现了Ka波段AlGaN/GaN HEMT。器件饱和电流达到1.1A/mm,跨导为421mS/mm,截止频率（fT）为30GHz,最大振荡频率（fmax）为105GHz。采用了湿法腐蚀工艺将器件的Si3N4钝化层去除后,器件的Cgs和Cgd减小,器件截止频率提高到50GHz,最大振荡频率提高到200GHz。