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Scanning thermal microscopy (SThM) was used to map thermal conductivity images in an ultrafine-grained copper surface layer produced by surface mechanical attrition treatment (SMAT). It is found that the deformed surface layer shows different thermal conductivities that strongly depend on the grain size of the microstructure: the thermal conductivity of the nanostructured surface layer decreases obviously when compared with that of the coarse-grained matrix of the sample. The role of the grain boundaries in thermal conduction is analyzed in correlation with the heat conduction mechanism in pure metal. A theoretical approach, based on this investigation, was used to calculate the heat flow from the probe tip to the sample and then estimate the thermal conductivities at different scanning positions. Experimental results and theoretical calculation demonstrate that SThM can be used as a tool for the thermal property and microstructural analysis of ultrafine-grained microstructures. 相似文献
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Due to an increasing level of device integration and progressive device miniaturization, the thermal management requires comprehensive microscopic investigations of thermal properties as heat dissipation on the micro- and nanoscale. Today heat management is one of the key limiting factors in a wide range of electronic applications, e.g. in automotive and electro-mobility. In this review, an overview on far-field and near-field thermal microscopy techniques using infrared thermography, laser beam techniques, and scanning probe microscopy is given. The common aim of all these approaches is to get access to temperature distributions, heat transport mechanisms, thermos-elastic quantities, as well as thermoelectric properties of electronic materials on microscopic levels. Examples for devices inspections, for integrated circuit analysis, and for thin film technology applications at micro and nanoscale are presented. 相似文献
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A scanning thermal microscope with a Wollaston probe was used to investigate the spatial distribution and temporal variation of temperature in interconnect structures subjected to thermal cycling. The probe, utilized in passive temperature sensing mode, was calibrated from 20 degrees C to 200 degrees C using a single-layer aluminum microdevice. Spatial measurements were performed on nonpassivated aluminum interconnects sinusoidally heated by a 6 MA/cm(2) current at 200 Hz. The interconnects were determined to have temperatures that decreased with position from a maximum located at the center of both the interconnect length and width. Time-resolved temperature measurements were performed on the same structures sinusoidally heated by a 6 MA/cm(2) current at 2 Hz. Both the peak-cycle temperature and average-cycle temperature were found to decrease with increasing distance from the center of the width of the interconnects. 相似文献
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