Stabilizing temperature-capacitance dependence of (Sr,Pb, Bi)TiO3-Bi4Ti3O12 solutions for energy storage

(1-x)Sr_0.7Pb_0.15Bi_0.1TiO₃-xBi₄Ti₃O₁₂ ((1-x)SPBT-xBIT, x = 0-0.125) bulk ceramics were developed and calcined via the solid-state method, aimed at the application of pulsed power capacitors. The phase structures, temperature stability, hysteresis loop, and discharge properties were systematically investigated. Considering both the temperature stability and dielectric properties, 0.925SPBT-0.075BIT bulk ceramics with a capacitance variation satisfying the X7R specification were developed for pulsed power capacitors. The energy storage density was 0.252 J/cm³, and the ceramics showed high temperature stability at 80 kV/cm. The discharge current waveforms of the 0.925SPBT-0.075BIT ceramics were recorded. A high discharge power density of approximately 1.01 × 10⁸ W/kg with an 8 Ω load resistor and short discharge period of 84 ns were achieved at 50 kV/cm. The good temperature stability properties and high power density show that the 0.925SPBT-0.075BIT ceramics are well suited for pulsed power capacitors with a wide temperature range.     

Low-cycle fatigue properties of eutectic solders at high temperatures

This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8T_m). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys.     

Effect of strain waveform on creep-fatigue life for Sn–8Zn–3Bi solder

This paper describes the creep‐fatigue life of Sn–8Zn–3Bi under push–pull loading. Creep‐fatigue tests were carried out using Sn–8Zn–3Bi specimens in fast–fast, fast–slow, slow–fast, slow–slow and hold–time strain waveforms. Creep‐fatigue lives in the slow–slow and hold‐time waveforms showed a small reduction from the fast–fast lives but those in the slow–fast and fast–slow waveforms showed a significant reduction from the fast–fast lives. Conventional creep‐fatigue life prediction methods were applied to the experimental data and the applicability of the methods was discussed. Creep‐fatigue characteristics of Sn–8Zn–3Bi were compared with those of Sn–3.5Ag and Sn–37Pb.     

Effect of Bi and Sr concentrations on the formation of the 2223 phase in Bi-Pb-Sb-Sr-Ca-Cu-O materials, obtained under different conditions of thermal treatment

The superconducting properties and the phase and chemical composition of Bi _x Pb_0.3Sb_0.1Sr _y Ca₂Cu₃O_z (x=1.5, 1.6, and 1.7;y=1.9, 2.0, and 2.1) materials synthesized by one-step and multistep thermal treatments have been investigated. The multistep annealing between 825–875°C promotes the 2223 phase. The change of Bi concentration has little effect on the 2223 phase formation, regardless of the kind of thermal treatment used, but increasing the Sr concentration (y> 2) strongly inhibits this phase. It has also been established that the loss of Pb after synthesis depends on the initial Bi concentration. The loss of Pb decreases when the initial Bi content is lower.     

单晶钛酸铋纳米片的XPS和Raman特性

以Bi（NO3）3·5H2O和Ti（OC4H9）4为原料，NaOH为矿化剂，采用水热法制备了形貌规则的单晶Bi4Ti3O12纳米片。X射线衍射（XRD）结果表明，所合成的产物为正交相层状钙钛矿结构的Bi4Ti3O12。场发射扫描电子显微镜（FESEM）研究显示：样品是由大量边缘尺寸接近200nm，厚度约为15nm的片状结构组成。利用X射线光电子能谱（XPS）研究产物的化学组分和价态分布。室温拉曼光谱研究表明，Bi4Ti3O12纳米片的声子寿命和热稳定性低于相应的块体材料。     

Magnetic field hysteresis of critical currents in Bi(2223)/Ag tapes and a way to overcome it

Experiments showing hysteresis of critical currents versus the external magnetic field I_c(B_e) were performed with two multifilamentary Bi(2223)/Ag tapes. The I_c(B_e) hysteresis is observable in the transversal as well as in the longitudinal orientation of the long axis of the tape with respect to the magnetic field. Based on the idea that the hysteresis is the effect of trapped flux in a network of well-connected current paths, a way to overcome this effect has been proposed and experimentally verified. The induced frozen-in screening currents are split into several parallel current patterns by cycling the external magnetic field around the adjusted value. Using the proposed method, the ‘neutral’ I_c(B_e) characteristics have been found. Approximate calculations of the penetration depth of the trapped flux show that the network of well-connected current paths could be formed by several disk-shaped grains (≈ Φ8 × 0.4 μ) stacked into more or less axially ordered (quasi cylindrical) colonies of average dimensions estimated to ≈ Φ8 × 4 μm.     

复合轴控制系统应用研究

复合轴控制是提高光电跟踪系统精度和控制带宽的一种有效手段，尤其在光束定向器系统中，不仅要求系统要稳定地跟踪上动态目标，而且必须将光束涣定在目标的某一点上，这对控制系统的要求是非常高的，必须采用双或三复合轴控制方式。     

铜电解精炼过程中砷、锑、铋的危害及脱除方式的进展

在铜电解精炼过程中 ,砷、锑、铋等杂质 ,尤其是锑、铋 ,一直来被人们认为是对阴极铜生产、影响阴极铜质量的最为有害的元素。本文结合贵冶历年的生产实践来讨论砷、锑、铋等杂质在阴极铜生产过程中的危害以及脱除方式的进展。     

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Low-cycle fatigue (LCF) tests on as-cast Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu-1Bi, and Sn-3Ag-0.5Cu-3Bi solders was carried out using a noncontact strain-controlled system at 20°C with a constant frequency of 0.1 Hz. The addition of Cu does not significantly affect the fatigue life of eutectic Sn-Ag solder. However, the fatigue life was significantly reduced with the addition of Bi. The LCF behavior of all solders followed the Coffin-Manson relationship. The fatigue life of the present solders is dominated by the fracture ductility and can be described by the ductility-modified Coffin-Manson’s relationship. Steps at the boundaries of dendrite phases were the initiation sites for microcracks for Sn-3.5Ag, Sn-3Ag-0.5Cu, and Sn-3Ag-0.5Cu-1Bi solders, while for Sn-3Ag-0.5Cu-3Bi solder, cracks initiated along both the dendrite boundaries and subgrain boundaries in the dendrite phases. The linking of these cracks and the propagation of cracks inside the specimen occurred both transgranularly through eutectic phases and intergranularly along dendrite boundaries or subgrain boundaries.