全文获取类型
收费全文 | 2881篇 |
免费 | 151篇 |
国内免费 | 146篇 |
专业分类
电工技术 | 117篇 |
综合类 | 105篇 |
化学工业 | 25篇 |
金属工艺 | 69篇 |
机械仪表 | 203篇 |
建筑科学 | 41篇 |
矿业工程 | 28篇 |
能源动力 | 29篇 |
轻工业 | 10篇 |
水利工程 | 5篇 |
石油天然气 | 1篇 |
武器工业 | 46篇 |
无线电 | 454篇 |
一般工业技术 | 86篇 |
冶金工业 | 9篇 |
原子能技术 | 24篇 |
自动化技术 | 1926篇 |
出版年
2024年 | 4篇 |
2023年 | 10篇 |
2022年 | 8篇 |
2021年 | 29篇 |
2020年 | 22篇 |
2019年 | 14篇 |
2018年 | 18篇 |
2017年 | 23篇 |
2016年 | 36篇 |
2015年 | 58篇 |
2014年 | 159篇 |
2013年 | 126篇 |
2012年 | 203篇 |
2011年 | 240篇 |
2010年 | 189篇 |
2009年 | 162篇 |
2008年 | 284篇 |
2007年 | 387篇 |
2006年 | 274篇 |
2005年 | 353篇 |
2004年 | 213篇 |
2003年 | 154篇 |
2002年 | 83篇 |
2001年 | 35篇 |
2000年 | 31篇 |
1999年 | 15篇 |
1998年 | 12篇 |
1997年 | 7篇 |
1996年 | 12篇 |
1995年 | 4篇 |
1994年 | 1篇 |
1993年 | 4篇 |
1992年 | 1篇 |
1990年 | 1篇 |
1989年 | 1篇 |
1986年 | 1篇 |
1985年 | 2篇 |
1983年 | 1篇 |
1956年 | 1篇 |
排序方式: 共有3178条查询结果,搜索用时 15 毫秒
1.
In a typical embedded CPU, large on-chip storage is critical to meet high performance requirements. However, the fast increasing size of the on-chip storage based on traditional SRAM cells makes the area cost and energy consumption unsustainable for future embedded applications. Replacing SRAM with DRAM on the CPU’s chip is generally considered not worthwhile because DRAM is not compatible with the common CMOS logic and requires additional processing steps beyond what is required for CMOS. However a special DRAM technology, Gain-Cell embedded-DRAM (GC-eDRAM) [1], [2], [3] is logic compatible and retains some of the good properties of DRAM (small and low power). In this paper we evaluate the performance of a novel hybrid cache memory where the data array, generally populated with SRAM cells, is replaced with GC-eDRAM cells while the tag array continues to use SRAM cells. Our evaluation of this cache demonstrates that, compared to the conventional SRAM-based designs, our novel architecture exhibits comparable performance with less energy consumption and smaller silicon area, enabling the sustainable on-chip storage scaling for future embedded CPUs. 相似文献
2.
DSP--数字化时代的基因芯片 总被引:3,自引:0,他引:3
DSP是当今发展最为迅速的和最有发展前景的技术之一。与普通CPU和MCU相比 ,DSP在数字信号处理方面有着无可比拟的优势 ,特别适合网络、通信、控制等需要进行大量数字信号处理的应用场合。今天DSP已经成为通信、计算机、网络、工业控制以及家用电器等电子产品中不可或缺的基础器件 ,DSP在通信、计算机、网络、工业控制以及消费类电子产品等领域有着非常广泛的应用 ,本文阐述了DSP的特点、应用和市场以及DSP技术的发展前景。 相似文献
3.
A constant trend towards more compact mechanical systems with higher power densities and increased thermo-mechanical loads emphasises the importance of the development of new design approaches and novel tribological systems. Ignoring this may cause a significant slow down in technological and industrial development. Tribotronics or active tribology based on adaptive performance is thought of as being critical in the implementation of smart machine concepts. Recognition of the importance of tribotronics, or active control of system loss outputs, such as those through friction and wear will have significant beneficial economic consequences as a result of the associated accelerated rate of technological progress. These smart tribotronic systems can be embedded in a great variety of machines and mechanisms. If this integration is made at the design stage, products that are more flexible, efficient and reliable can be produced. The concept of tribotronics is presented and discussed in this paper. Some illustrative examples that show the feasibility of an “active” approach are given. In addition, various possibilities already reported in literature are discussed. 相似文献
4.
构建S3C4510B嵌入式系统的开发应用平台 总被引:2,自引:0,他引:2
利用三星公司生产的S3CA510B这款32位ARM7TDMI单片机构建一个应用系统,利用开发软件ARM SDT v2.51,在开发应用系统上实现存储器地址重映射、中断控制、串行通信、液晶、键盘接口。在此基础上,在S3CA510B上嵌入操作系统μC/OS-Ⅱ,用于液晶、键盘接口和多任务管理,为32住单片机的进一步开发应用构造了一个平台。 相似文献
5.
提出了溅射-气体-聚集共沉积制备金属/金属(介质)复合团簇镶嵌薄膜的新方法,并利用该方法成功地在方华膜衬底上制备了系列Fe/Ag及CaF2复合团簇镶嵌薄膜样品。透射电镜分析结果表明,样品中Fe(Cu)团簇都较好地镶嵌于Ag(CaF2)基质中,其结构为两种材料的多晶共存形态。进一步分析发现,与块材相比,Fe/Ag样品中Fe团簇晶格常数呈现出不同程度的收缩,而Cu/CaF2样品中Cu团簇晶格常数则呈现出不同程度的膨胀。运用附加压力的模型对该现象进行了解释。 相似文献
6.
High dielectric constant (high-k) polymer composites are of great interest for embedded capacitor applications. Previously,
we demonstrated that epoxy—aluminum composites are promising for embedded capacitor applications, because they have a high
dielectric constant and a low dielectric loss due to the core—shell structure of the self-passivated aluminum particles. In
this work, to further understand the dielectric behavior of aluminum composites, lower-loss polymers such as silicone, polyimide,
polynorbornene, and benzocyclobutene were explored as matrices for the aluminum composites. It is found that the polymer matrices
can significantly change the dielectric properties of the aluminum composites. A polymer matrix with a lower dielectric constant
generally results in a lower dielectric constant of its aluminum composites. In this regard, polymer—aluminum composites have
a similar dielectric characteristic as polymer—ceramic composites. Thermomechanical properties of aluminum composites were
characterized by a thermomechanical analyzer. 相似文献
7.
随着嵌入式系统的发展,模拟信号处理单元与MCU正逐步融为一体,数据采集与处理系统芯片-ADuC845是这一融合的具体体现和产物。现对ADI公司的ADuC845芯片及其特性、应用作详细介绍。 相似文献
8.
针对目前现有动态汽车衡称重误差大等问题,提出了一种新型动态汽车衡称重系统的实现方法,该称重系统在基于Intel x86硬件平台和linux操作系统的基础上设计实现的。同时分析了产生称重误差的根本原因。采用了数字信号处理手段来提高动态汽车衡的称重精度。现场测试数据分析表明,该新型动态汽车衡称重系统技术指标优于国家动态衡标准。 相似文献
9.
ROI-based Watermarking Scheme for JPEG 2000 总被引:1,自引:0,他引:1
Yu-Cheng Fan Arvin Chiang Jan-Hung Shen 《Circuits, Systems, and Signal Processing》2008,27(5):763-774
A new region of interest (ROI)-based watermarking method for JPEG 2000 is presented. The watermark is embedded into the host
image based on the characteristics of the ROI to protect rights to the images. This scheme integrates the watermarking process
with JPEG 2000 compression procedures. Experimental results have demonstrated that the proposed watermark technique successfully
survives JPEG 2000 compression, progressive transmission, and principal attacks. 相似文献
10.
文章讨论了PAGER控制器芯片(ZQD021)的系统设计,该控制器内部集成了FLASH,SRAM,POCSAG协议解码器和嵌入式MCU CORE。重点分析了芯片的可测性设计(DFT),内嵌FLASH设计,低功耗设计,其设计方法和思路对消费类和嵌入式控制芯片的设计有一定的借鉴意义。 相似文献