A novel low power hybrid cache using GC-EDRAM cells

In a typical embedded CPU, large on-chip storage is critical to meet high performance requirements. However, the fast increasing size of the on-chip storage based on traditional SRAM cells makes the area cost and energy consumption unsustainable for future embedded applications. Replacing SRAM with DRAM on the CPU’s chip is generally considered not worthwhile because DRAM is not compatible with the common CMOS logic and requires additional processing steps beyond what is required for CMOS. However a special DRAM technology, Gain-Cell embedded-DRAM (GC-eDRAM)  [1], [2], [3] is logic compatible and retains some of the good properties of DRAM (small and low power). In this paper we evaluate the performance of a novel hybrid cache memory where the data array, generally populated with SRAM cells, is replaced with GC-eDRAM cells while the tag array continues to use SRAM cells. Our evaluation of this cache demonstrates that, compared to the conventional SRAM-based designs, our novel architecture exhibits comparable performance with less energy consumption and smaller silicon area, enabling the sustainable on-chip storage scaling for future embedded CPUs.     

DSP--数字化时代的基因芯片

DSP是当今发展最为迅速的和最有发展前景的技术之一。与普通CPU和MCU相比 ,DSP在数字信号处理方面有着无可比拟的优势 ,特别适合网络、通信、控制等需要进行大量数字信号处理的应用场合。今天DSP已经成为通信、计算机、网络、工业控制以及家用电器等电子产品中不可或缺的基础器件 ,DSP在通信、计算机、网络、工业控制以及消费类电子产品等领域有着非常广泛的应用 ,本文阐述了DSP的特点、应用和市场以及DSP技术的发展前景。     

一种用于SOC设计中的智能I/O处理器的实现

文章介绍了SOC设计流程，智能I／O处理器组成，在开发该处理器对VHDL源代码的优化问题。     

Tribotronics—Towards active tribology

A constant trend towards more compact mechanical systems with higher power densities and increased thermo-mechanical loads emphasises the importance of the development of new design approaches and novel tribological systems. Ignoring this may cause a significant slow down in technological and industrial development. Tribotronics or active tribology based on adaptive performance is thought of as being critical in the implementation of smart machine concepts. Recognition of the importance of tribotronics, or active control of system loss outputs, such as those through friction and wear will have significant beneficial economic consequences as a result of the associated accelerated rate of technological progress. These smart tribotronic systems can be embedded in a great variety of machines and mechanisms. If this integration is made at the design stage, products that are more flexible, efficient and reliable can be produced. The concept of tribotronics is presented and discussed in this paper. Some illustrative examples that show the feasibility of an “active” approach are given. In addition, various possibilities already reported in literature are discussed.     

构建S3C4510B嵌入式系统的开发应用平台

利用三星公司生产的S3CA510B这款32位ARM7TDMI单片机构建一个应用系统，利用开发软件ARM SDT v2．51，在开发应用系统上实现存储器地址重映射、中断控制、串行通信、液晶、键盘接口。在此基础上，在S3CA510B上嵌入操作系统μC／OS-Ⅱ，用于液晶、键盘接口和多任务管理，为32住单片机的进一步开发应用构造了一个平台。     

溅射——气体——聚集共沉积法制备金属／金属（介质）复合团簇镶嵌薄膜

提出了溅射－气体－聚集共沉积制备金属／金属（介质）复合团簇镶嵌薄膜的新方法，并利用该方法成功地在方华膜衬底上制备了系列Ｆｅ／Ａｇ及ＣａＦ２复合团簇镶嵌薄膜样品。透射电镜分析结果表明，样品中Ｆｅ（Ｃｕ）团簇都较好地镶嵌于Ａｇ（ＣａＦ２）基质中，其结构为两种材料的多晶共存形态。进一步分析发现，与块材相比，Ｆｅ／Ａｇ样品中Ｆｅ团簇晶格常数呈现出不同程度的收缩，而Ｃｕ／ＣａＦ２样品中Ｃｕ团簇晶格常数则呈现出不同程度的膨胀。运用附加压力的模型对该现象进行了解释。     

Proactive resource allocation for asynchronous real-time distributed systems in the presence of processor failures

We present two proactive resource allocation algorithms, RBA^*-FT and OBA-FT, for fault-tolerant asynchronous real-time distributed systems. The algorithms consider an application model where task timeliness is specified by Jensen's benefit functions and the anticipated application workload during future time intervals is described by adaptation functions. In addition, we assume that reliability functions of processors are available a priori. Given these models, our objective is to maximize aggregate task benefit and minimize aggregate missed deadline ratio in the presence of processor failures. Since determining the optimal solution is computationally intractable, the algorithms heuristically compute sub-optimal resource allocations, but in polynomial time. Experimental results reveal that RBA^*-FT and OBA-FT outperform their non-fault-tolerant counterparts in the presence of processor failures. Furthermore, RBA^*-FT performs better than OBA-FT, although OBA-FT incurs better worst-case and amortized computational costs. Finally, we observe that both algorithms robustly withstand errors in the estimation of anticipated failures.     

基于HOP的可调光编码／解码器的研究

提出了一种基于全息光处理器的可调光编码/解码器的实现方案。全息光处理器可以在空间进行编/解码，每个通信网络单元可以采用任意速率的数字或模拟的调制信号，它非常适合于多媒体的通信网络环境，通过对全息光处理器的折射率大小和位置的控制，当一个输入光脉冲经过光处理器中具有特定折射率的空间位置后，便可在处理器的输出端口得到合适的输出信号。本文给出了这种基于全息光处理器的可调光编码/解码器的仿真实验，结果是可行的，与以前文献中提出的结构相比，减小了硬件实现的复杂性，降低了成本和功耗，便于集成。     

Effect of the polymer matrices on the dielectric behavior of a percolative high-k polymer composite for embedded capacitor applications

High dielectric constant (high-k) polymer composites are of great interest for embedded capacitor applications. Previously, we demonstrated that epoxy—aluminum composites are promising for embedded capacitor applications, because they have a high dielectric constant and a low dielectric loss due to the core—shell structure of the self-passivated aluminum particles. In this work, to further understand the dielectric behavior of aluminum composites, lower-loss polymers such as silicone, polyimide, polynorbornene, and benzocyclobutene were explored as matrices for the aluminum composites. It is found that the polymer matrices can significantly change the dielectric properties of the aluminum composites. A polymer matrix with a lower dielectric constant generally results in a lower dielectric constant of its aluminum composites. In this regard, polymer—aluminum composites have a similar dielectric characteristic as polymer—ceramic composites. Thermomechanical properties of aluminum composites were characterized by a thermomechanical analyzer.     

铁电存储器FM3808在TMS320VC5402系统中的应用

FM3808是Ramtron公司生产的新型超低功耗非易失铁电存储器，该器件可支持对存储区的高速读写，并可进行近乎无限次的写入。FM3808内部除具有256kB的存储阵列外还集成了实时时钟和系统监控模块，因而功能十分强大。文中介绍了FM3808的性能特点、内部结构和工作原理，分析了TMS320VC5402 DSP的并行引导装载模式。给出了DSP与FM3808组成的并行引导接口方案。