Improved aqueous solubility,bioaccessibility and cellular uptake of quercetin following pH-driven encapsulation in whey protein isolate

The purpose of this study was to increase the water solubility and potential bioavailability of quercetin by encapsulation in whey protein isolate (WPI) based on a green, efficient pH-driven method. According to the results, the water solubility of quercetin increased by 346.9: times after loading into WPI nanoparticles. When the initial quercetin concentration was 0.25 mg mL⁻¹ and WPI was 2% w/v, the encapsulation efficiency reached 94.1%, the Z-average diameter was 36.63 nm, and the zeta potential was −36.4 mV at pH 7.0. The fluorescence spectroscopy assay suggested the molecular complexation of quercetin and WPI at pH 12.0. X-ray diffraction assay indicated the enclosure of amorphous quercetin in WPI. Correspondingly, the bioaccessibility increased from 2.76% to 31.23% and the Caco-2 cell monolayer uptake increased from 0% to 2.12% after nanoencapsulation. This work confirmed that the pH-driven method is an effective approach to prepare WPI–quercetin nanocapsules to improve physical and potentially biological properties of quercetin.     

Eco-friendly tape casting of borosilicate glass/Al2O3 sheets for LTCC applications

This work reports the innovative development of a borosilicate glass/Al₂O₃ tape for LTCC applications using an eco-friendly aqueous tape casting slurry. Polyvinylpyrrolidone (PVP) and polyacrylic acid (PAA) were the respective dispersants, while carboxymethyl cellulose (CMC) and styrene acrylic emulsion (SA) were the respective binders. The results showed that PVP was more suitable than PAA as the dispersant for the aqueous casting slurry, and that 1.5 wt% PVP would achieve well dispersion of CABS glass/Al₂O₃ powder in the aqueous slurry. Moreover, a small amount of 2.0 wt% CMC binder could yield smooth CABS glass/Al₂O₃ tapes crack free. A high-quality CABS glass/Al₂O₃ tape with a smooth surface was made from an aqueous slurry containing 1.5 wt% PVP dispersant, 2.0 wt% CMC binder, and 2.0 wt% PEG-400 plasticizer. The density, tensile strength, and surface roughness of the green tape were 2.05 g/cm³, 0.87 MPa, and 148 nm, respectively. The resulting CABS glass/Al₂O₃ composites sintered at 875 °C exhibited a bulk density of 3.14 g/cm³, a dielectric constant of 8.09, a dielectric loss of 1.0 × 10^?3, a flexural strength of 213 MPa, a thermal expansion coefficient of 5.30 ppm/^°C, and a thermal conductivity of 3.2 W m^?1 K^?1, thus demonstrating its broad prospects in LTCC applications.     

Preparation of α-cordierite through mechanochemical activation of MgO–Al2O3–SiO2 ternary system

Samples of the ternary system MgO–Al₂O₃–SiO₂ with stoichiometric composition in relation to α-cordierite (Mg₂A_l4Si₅O₁₈), consisting of 22.2 mol% MgO, 22.2 mol% Al₂O₃, and 55.6 mol% SiO₂, were activated in a low energy mill with a constant speed of 100 rpm, in an aqueous medium. The precursors used were corundum (Al₂O₃), silica gel HF254 type 60 (SiO₂), and periclase (MgO). The objective of the present study was to evaluate the effect of mechanochemical activation on the solid-state synthesis of α-cordierite, using a low energy ball mill. Another objective was to shed light on the effect of mechanochemical activation on the steps of α-cordierite formation. For this end several grinding conditions were evaluated, varying the time and mass ratio of precursors/grinding elements, as well as calcination at different temperatures between 950 °C and 1350 °C for 2 h. The samples were analyzed for the determination of the formed phases by Infrared (IR) and X-ray Diffraction (XRD). The phases identified in uncalcined samples were brucite (Mg(OH)₂), forsterite (Mg₂SiO₄), enstatite (MgSiO₃), spinel (MgAl₂O₃), amorphous silica (SiO₂), corundum (α-Al₂O₃), and zirconia (monoclinic and tetragonal ZrO₂). The lowest temperature corresponding to the formation of α-cordierite (α-Mg₂Al₄Si₅O₁₈) was 1150 °C and a considerable amount of this phase (16.2%) was observed at this temperature, for the sample with the higher mechanochemical activation. In a solid-state reaction, α-cordierite is normally obtained at around 1400 °C, therefore, the formation of this phase at 1150 °C confirms that the mechanochemical activation method, using a low-cost ball mill, is efficient in reducing the solid-state reaction temperature.     

水泥浆失水制约下套管与井眼间隙的研究

通过对水泥浆失水规律的室内试验分析以厦对注水泥顶替过程中水泥浆失水桥堵套管与井眼间隙问题的研究，建立了顶替过程中滤失层不发生水泥浆失水而桥堵环形空间的临界失水量计算模型，提出了调配水泥浆失水性能和确定合理套管井眼间隙的具体方法，对注水泥现场施工和井身结构设计具有一定的指导意义。     

一种可替代漂珠的低密度材料

漂珠低密度水泥浆由于密度低、强度高、体系稳定而在油田低压易漏层及低压油气层长封固段固井作业中获得了广泛的应用。但近年来,由于漂珠的产量越来越少,油田低成本要求急需开发代替漂珠的新型减轻材料,以满足配制低密度水泥浆的需求。开发了BCL-10S低密度混合减轻材料,其物化性能与漂珠相当,用它作减轻剂配制的低密度水泥浆性能与用漂珠作减轻剂配制的低密度水泥浆性能相媲美,并已经在长庆油田获得了应用。     

乐滩灌区输水隧洞穿合山煤矿采空区处理设计

分析了乐滩灌区工程北干渠溯河隧洞段长约1.06 km穿合山煤矿采空区的地质情况.借鉴高速公路煤矿采空区的成功处理经验,通过科学分析,对采空区变形和区域内覆岩的稳定性做了评价,论述了输水线路穿采空区段采取全充填压力注浆法的工程处理方法.     

Poly(vinyl pyrrolidone)—C70 complexes in aqueous solutions

Aqueous solutions of poly(vinyl pyrrolidone)-fullerene complexes (PVP-C₇₀) have been studied using static and dynamic light scattering methods. Two diffusive processes were detected. The slow diffusion was interpreted as dynamics of large intermolecular PVP-C₇₀ complexes while the fast diffusion was associated with the presence of individual PVP molecules in solution. It was also shown that the molecular weights and dimensions of PVP-C₇₀ complexes are smaller than for PVP-C₆₀ by a factor of 2.5-3. In aqueous solutions of PVP-C₇₀ complex the depolarization and dissymmetry of scattered light were observed in contrast to PVP-C₆₀ solutions. It reveals the existence of anisotropic structures in PVP-C₇₀ solutions. Intermolecular interactions within PVP-C₇₀ complexes are weak and a hydrodynamic field can destroy complexes.     

粉煤灰超细玻珠复配轻集料在固井低密度水泥浆中的作用

阐述了粉煤灰超细玻珠复配轻集料在固井低密度水泥浆中对其流变性能、强度、质量均匀性以及密度的影响和作用机理。表明该复配轻集料可以明显改善水泥浆的流动性、保水性以及水泥与高效外加剂的相容性,水泥石抗压和抗折强度有显著改善,水泥浆具有良好的质量均匀性,用该集料配制的超低密度水泥浆能满足固井要求,并由此提高固井的经济性。     

Characterization and optimization of copper chemical mechanical planarization

The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.