Super-Resolution Reconstruction of Images Based on Microarray Camera

In the field of images and imaging, super-resolution (SR) reconstruction of images is a technique that converts one or more low-resolution (LR) images into a highresolution (HR) image. The classical two types of SR methods are mainly based on applying a single image or multiple images captured by a single camera. Microarray camera has the characteristics of small size, multi views, and the possibility of applying to portable devices. It has become a research hotspot in image processing. In this paper, we propose a SR reconstruction of images based on a microarray camera for sharpening and registration processing of array images. The array images are interpolated to obtain a HR image initially followed by a convolution neural network (CNN) procedure for enhancement. The convolution layers of our convolution neural network are 3×3 or 1×1 layers, of which the 1×1 layers are used to improve the network performance particularly. A bottleneck structure is applied to reduce the parameter numbers of the nonlinear mapping and to improve the nonlinear capability of the whole network. Finally, we use a 3×3 deconvolution layer to significantly reduce the number of parameters compared to the deconvolution layer of FSRCNN-s. The experiments show that the proposed method can not only ameliorate effectively the texture quality of the target image based on the array images information, but also further enhance the quality of the initial high resolution image by the improved CNN.     

Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.     

Electrical and growth characteristics of Au/Al0.15Ga0.85N:Si structures with various Si incorporations

We have investigated the growth characteristics of n-Al_0.15Ga_0.85N:Si/GaN and the electronic properties of Au/n-Al_0.15Ga_0.85N:Si diode structures grown by metal-organic chemical vapor deposition (MOCVD) with various Si incorporations. The Al_0.15Ga_0.85N:Si layers were grown on undoped GaN/sapphire (0001) epitaxial layers in a horizontal MOCVD reactor at the reduced pressure of 300 torr. The mirrorlike surface, free of defects, such as cracks or hillocks, can be seen in the undoped Al_0.15Ga_0.85N epilayer, which was grown without any intentional flow of SiH₄. However, many cracks are observed in the n-Al_0.15Ga_0.85N:Si, which was grown with Si incorporation above 1.0 nmol/min. While Au/n-Al_0.15Ga_0.85N:Si diodes having low incorporation of Si showed retively good rectifying behavior, the samples having high Si incorporation exhibited leaky current-voltage (I-V) behavior. Particularly, the Au/n-Al_0.15Ga_0.85N:Si structure grown with Si incorporation above 1.0 nmol/min cannot be used for electrical rectification. Both added tunneling components and thermionic emission influence the current transport at the Au/n-Al_0.15Ga_0.85N:Si barrier when Si incorporation becomes higher.     

高可靠镀Ni／Au工艺及其在微波PTFE电路上的应用

介绍了高可靠电镀Ｎｉ／Ａｕ工艺在ＰＴＦＥ微波印制电路上的应用，并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ｎｉ／Ａｕ镀层之间附着力的措施。通过实验及应用证明了与直接镀金工艺相比，在软基材ＰＴＦＥ敷铜箔板上镀Ｎｉ／Ａｕ工艺能大大提高微波电路的可焊性，高温稳定性和长期可靠性，并且用其所制作的微波器件的高频性能也优于直接镀金工业。     

氯化铵在含砷金银铅锌矿选别中的应用

某多金属铅锌矿含砷较高．采用常规铅、锌优先浮选方法，铅、锌精矿中砷含量超标。为了解决铅、锌精矿中砷超标的问题，在铅、锌粗、精选作业中加入氯化铵，成功地降低了铅、锌精矿中砷的含量，使铅、锌精矿质量合格．将这一结果应用于生产，取得了良好的效果。     

Kinetics of AuSn4 migration in lead-free solders

The relatively fast diffusion of Au atoms in eutectic PbSn matrix is considered one of the contributing factors to the Au embrittlement problem. In this study, we further investigated the Au embrittlement problem in high-Sn solders. Experimentally, Sn3.5Ag (wt.%) spheres with 500-μm diameter were soldered over the Au/Ni soldering pads. It was found that some of the AuSn₄ needles that formed after reflow inside the solder migrated back to the solder/pad interface during thermal aging. However, the migration kinetics in high-Sn solders was slower compared to that in eutectic PbSn. The difference in migration kinetics of AuSn₄ in eutectic PbSn and SnAg was ascribed to the difference in the magnitudes of the Au flux and the Ni flux. In eutectic PbSn, the Au flux was much greater than that of the Ni flux, and the Au and Ni flux were in the same order of magnitude in eutectic SnAg. The relative magnitude of the Au and Ni flux changed in eutectic PbSn and SnAg because the homologous temperatures of PbSn and SnAg were different.     

SFG and DFG investigation of Au(111), Au(210), polycrystalline Au,Au–Cu and Au–Ag–Cu electrodes in contact with aqueous solutions containing KCN and 4-cyanopyridine

We report on potential-dependent in situ SFG and DFG spectroscopy carried out at Au(111), Au(210), polycrystalline Au, Au–Cu and Au–Ag–Cu electrodes in contact with aqueous solutions containing CN⁻ and 4-cyanopyridine (4CP). Spectroelectrochemical work was complemented by cyclic voltammetry. The chief stress has been placed on systematising and quantifying the interaction between 4CP and CN⁻ and the attending effects on the vibrational and electronic structures of the interface. The voltammetric behaviour of the investigated electrodes, modified by the addition of 4CP to the CN⁻ electrolyte, denote changes in the CN⁻ adsorption characteristics and effects of the adsorbed CN⁻ layer on the electrodic reactivity of 4CP. The differences among the investigated electrodes can be explained in terms of their respective degrees of atomic packing or with alloying effects on the stability of adsorbed CN⁻. The potential-dependent spectra have been analysed quantitatively with a model for the second order non linear susceptibility accounting for vibrational and electronic effects. The spectral changes induced by addition of 4CP denote interaction of the aromatic with the electrode through the CN⁻ monolayer. The non-resonant contribution yields information on the effects of 4CP on the fine structure of the bound electron density of states.     

贵金属Cu、Ag、Au的电子结构和物理性质

由纯金属单原子理论(OA)确定了面心立方结构(FCC)贵金属Cu、Ag、Au的电子结构依次为[Ar](3dn)5.58(3dc)4.21(4sc)0.23(4sf)0.98、[Kr](4dn)4.87(4dc)4.56(5sc)0.66(5sf)0.91、[Xe](5dn)4.20(5dc)4.90(6sc)1.57(6sf)0.33,并确定了Cu、Ag、Au的密排六方结构(HCP)和体心立方结构(BCC)两种初态特征晶体和初态液体的电子结构。根据自然态的电子结构定性解释了熔点、拉伸强度、维氏硬度、体弹性模量、电导和热导率物理性质差异与电子结构的关系,定量计算了晶格常数、结合能、势能曲线及线热膨胀系数随温度的变化。根据非自然态的电子结构,定性解释了晶体结构BCC和HCP的关系。