Thermal and hygroscopic reliability of flip-chip packages with an anisotropic conductive film

Thermal and hygroscopic reliability of anisotropic conductive film (ACF) joints in relation to flip-chip bonding force was evaluated by thermal shock and constant temperature/humidity testing. The failure mode by thermal shock testing varied with increasing bonding force, i.e., (1) formation of a conduction gap between conductive particles and Au bump or Ni/Au plated Cu pad at low bonding force and (2) delamination of adhesive matrix from the plated Cu pad on the flexible substrate at high bonding force. The delamination initiated as a crack under a conductive particle and propagated sideward resulting in a complete delamination of the ACF from the Cu pad. However, delamination was observed between the ACF and Au bump on the chip side after the constant temperature/humidity testing for 500 h. A theoretical calculation was also conducted to predict the connection resistance of the ACF joint before and after reliability tests. The calculation showed the importance of the bonding gap between the electrodes.     

Fracture mechanics approach to forecast delamination lifetime

Interlaminar fracture (delamination) is one of the major concerns in the design of laminated composite structures, adhesive joints, coatings, sealants and other multilayered material systems. Service lifetime of a laminated structure is limited by the time an interlaminar flaw propagates to a size perceived critical to the stiffness and/or the strength of the structure. The time required to cause certain magnitude of delamination, under stresses below the initiation stress, could be forecasted if the constitutive equation for the rate of delamination is known. This paper describes an approach to develop the constitutive equation for delamination under mode I conditions. The approach rests on principles of linear elastic fracture mechanics (LEFM) and uses elevated temperature to accelerate interlaminar fracture at constant loads. The experiments used double cantilever beam test specimens fabricated as a model system from poly(methyl methacrylate) (PMMA) beams and epoxy adhesive whose stiffness was equivalent to that of a typical carbon/epoxy laminated composite. Mechanistic observations indicated that the fracture front displayed similar mechanism at all test conditions. A modified form of Paris power law is suggested to forecast service lifetime in terms of temperature, service load and the initial flaw size.     

Influence of the interfacial resin layer on delamination initiation in broken ply composite laminates

The present study has investigated the influence of a resin layer on the delamination initiation at the interface of broken and continuous plies in the case of GR/E (graphite/epoxy) laminates with broken central plies. A full three-dimensional (3D) finite element (FE) analysis was performed with each layer of the laminate modelled as homogeneous and orthotropic. The interface between the broken and the continuous plies was modelled with a thin resin-rich layer. Eight-noded isoparametric layered elements were used to model the laminate specimen. Also, 3D contact elements were used to prevent inter-penetration of the delaminated faces at the interface. Based on the results of the 3D FE analysis, strain energy release rates were calculated at the delamination front using Irwin's 'crack closure integral'. Using the concepts of linear elastic fracture mechanics (LEFM), the strain energy release rate was used as a parameter for assessing delamination initiation. The effects of various factors such as resin layer stiffness, resin layer thickness, and fibre orientation at the interface on the three components of the strain energy release rates, namely G_I, G_II and G_III, were studied for laminates with various crack sizes of the broken ply, and the influence of the resin layer in the delamination initiation was established. It was observed that delamination initiation is a mixed-mode phenomenon even in the case of uniaxial loading and the dominance of the mode of delamination is governed by the resin layer stiffness, thickness, and lamina orientation at the interface. The present work also concludes that an increase in the resin layer modulus leads to an increase in the probability of mode I delamination while the probability of mode II delamination decreases. A 0/90 interface exhibits a higher chance of delamination in modes I and II, while mode III delamination is maximum for 0/30 and 0/60 fibre orientation interfaces. It was also observed that the larger the crack width, the greater the probability of delamination initiation at the interface.     

A Theoretical Study of Thin Film Delamination Using Clamped Punch-Loaded Blister Test: Energy Release Rate and Closed-Form Solution

Using an exact analytical solution of axisymmetric deformation of a circular membrane centrally connected to a rigid plate under the action of concentrated load at its center, we present an exact formula for the energy release rate applicable to ultrathin film–substrate systems without residual stresses or with small residual stresses. Also, a closed-form solution of axisymmetric deformation of circular membrane under the action of concentrated load at its center is presented.     

The role of water in delamination in electronic packages: degradation of interfacial adhesion

Polymeric electronic packages subjected to standard Joint Electron Device Engineering Council (JEDEC) reliability testing are known to exhibit weakening and failures at the polymeric adhesive interfaces. Coupling agents are typically used as additives in epoxy-based materials to improve package reliability. Coupling agent chemistry and environment conditions, including pH, temperature and applied stress, are known factors that affect the rate of adhesion degradation and jeopardize the long-term reliability of the package. In this study, the subcritical interfacial debonding process is described. The debonding rates of polymers with silane, titanate and zirconate coupling agents were characterized at different temperatures by shear fracture tests and tapered double cantilever beam tests under mechanical loading and simultaneous exposure to controlled acidic environments. An analytical procedure was developed to delineate the material parameters governing adhesion degradation. Elevated temperature and acidity were shown to have a strong effect on package reliability, but mechanical loading was found to have a minimal effect on the rate of adhesion degradation. The effects of the JEDEC testing conditions on interfacial bond degradation are discussed using the chemical kinetic model.     

Effect of thermal treatment of wood lumbers on their adhesive bond strength and durability

Wood used in outdoor applications needs to undergo either chemical or thermal treatment to improve its decay resistance. Thermal treatment permits to avoid the use of toxic chemicals, increases the dimensional stability and gives a dark color to the wood. However, this process deteriorates the mechanical properties of wood, i.e., the wood becomes more fragile and rigid. The chemical transformation of wood that takes place during the heat treatment changes the interaction between the wood surface and the adhesive. In this work, the interfacial bonding strength (the resistance to the shear stress by compression in parallel direction to the glued interface) and cyclic delamination (resistance to delamination during accelerated exposure) for different wood species and adhesives were tested in accordance with the ASTM D2559 standard. Four wood species: scott pine (Pinus sylvestris), aspen (Populus tremuloides), yellow poplar (Liriodendron tulipifera) and jack pine (Pinus banksiana) both treated and non-treated, and two structural adhesives, phenol resorcinol formaldehyde (PRF) and polyurethane (PUR), were used in the testing. Among the studied species, jack pine is found to be the easiest to bond, while aspen is found to be the most difficult. With the wood species and adhesives evaluated in this study, non-treated wood is found to provide a better bonding strength than the treated wood.     

Analysis of thermoelastic interaction of manufacturing stresses along the interface on interlaminar delamination progression in multi-ply composite laminates

This paper deals with the study of interaction of manufacturing thermal residual stresses and mechanical loading in penny-shaped delaminations embedded between dissimilar, anisotropic fiber composite layers by conducting two sets of three-dimensional thermoelastic finite element analyses with and without residual stress effects. Modified crack closure integral (MCCI) techniques based on the concepts of linear elastic fracture mechanics (LEFM) have been used to calculate the distribution of individual modes of strain energy release rates (SERR) to investigate the interlaminar delamination initiation and propagation characteristics. Asymmetric variations of strain energy release rates obtained along the delamination front are caused by the overlapping stress fields due to the coupling effect of thermal and mechanical loadings. It is found that parameters such as ply sequence and orientation, thermoelastic anisotropy and material heterogeneity, and ply properties of the delaminated interface dictate the interlaminar fracture behavior of multi-ply laminated FRP composites.     

Stress Analysis of Tubular Adhesive Joints with Delaminated Adherend

The use of adhesive joints is becoming increasingly important in aerospace, automotive and other industries where the use of traditional fasteners is discouraged. When using composite adherends, the use of adhesively bonded joints is preferable rather than the traditional bolts and other types of fasteners, because they do not require holes, thereby removing the problems of stress concentrations around the holes. However, when using an adhesively bonded joint, there will be concentrations of the distributions of shear and peel stresses within the adhesive layer which should be controlled effectively. Therefore, the investigation of such stress variation has attracted many researchers. The aforementioned stress distributions become more complicated if the composite adherend contains a pre-existing delamination. Delamination is one of the most common failure modes in laminated composite materials; it can occur due to sudden impact by an external object, during the manufacturing process (e.g., during the filament winding process), or as a result of excessive stresses due to an applied load. It is clear that the existence of a delamination in any composite structure causes a reduction in its stiffness and in some critical situations, it may cause complete failure. This paper investigates the effect of delamination on the structural response of an adhesively bonded tubular joint with composite and aluminum adherends. The finite element method, using the commercial package ABAQUS, is used to conduct a parametric investigation. The effects of the delamination's spatial location, length, width, and the applied loading are studied. Results provide interesting insight (not necessarily intuitive) into the effect of an interlayer delamination on the stress distribution within the adhesive.     

Hydroxymethylated Resorcinol (HMR) and Novolak-Based HMR (n-HMR) Primers to Enhance Bond Durability of Eucalyptus globulus Glulams

The effectiveness of the hydroxymethylated resorcinol (HMR) and the novolak-based HMR (n-HMR) primers to enhance bond durability of Eucalyptus globulus glulams was evaluated according to EN 391 (Delamination) and EN 392 (Shear strength) for outdoor load-bearing timber structures (Service Class 3). All glulams prepared under increasingly more stringent conditions with both primers, surpassed the requirements for delamination and shear strength. Specifically, when used with a one-component polyurethane adhesive: lamellas did not need to be planed before bonding; the primer amount could be reduced to 50%; and the adhesive could be applied to only one of the bonding surfaces. Additionally, lamellas primed with the n-HMR were effective for 2 weeks prior to bonding. The novolak-based primer overcomes the main limitations in using the original HMR primer, offering more flexibility for the same efficiency, and consequently, it is a more attractive option for manufacturing Eucalyptus globulus glulams.     

Multiple heat isothermal stress rupture correlations for type 316L(N) stainless steel and their use Part 2 – Applications for nuclear grade type 316L(N) stainless steel base metal and its weld metal

Abstract

The 'reference' multiple heat isothermal stress rupture correlations for stainless steel types 316 and 316L(N) base metals derived in Part 1 are used for establishing those for a specific 316L(N) stainless steel base metal and also its weld, both candidates for the forthcoming prototype fast breeder reactor at Kalpakkam. The phases that form in the weld metal during creep are the same as those in the base metal; however, the uniformly distributed δ ferrite ( ~ 7 ferrite number) in vermicular morphology present in the initial microstructure accelerates their formation and increases their quantities, resulting in poorer stress rupture properties. A simple modification allows for correlating and extrapolating the weld data to long rupture lives using the multiple heat isothermal correlations developed for the base metal.