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1.
It is well-known that with the appearance of three independent papers by Taylor, Polanyi and Orowan in the year 1934, the concept of crystal dislocations was born. Since then, dislocation theory has had many spectacular successes. It is quite appropriate therefore to be aware of the state of development of this exciting subject, sixty years after its discovery. A flavour for the vast subject of the applications of dislocation mechanisms to real materials is presented by choosing three examples, one each, drawn from metallurgy, physics and electronics. The topic of ‘Strength of metals and alloys’ is the first one, as this is also the author’s area of research. The phenomenon of solidification and crystal growth forms the next topic, especially in view of the seminal contributions made by A R Verma and his school from India. Dislocations play a useful role in the strengthening of solids, but how influential are they in affecting the performance of modern semiconductor devices? In the third example, the interesting and painstaking work done to settle this question is reviewed. Can we regard carbon fibre as thetransistor of dislocation theory? How shall we understand the long-established effects such as corrosion-fatigue, superplasticity and shape memory as well as the electrochemical and electro-mechanical properties of dislocations in semiconductor and non-metallic crystals? Answers to these questions belong to the realms of the future developments in dislocations. The talk is concluded with a discussion of these topics.  相似文献   
2.
The dislocation structures of bulk textured and epitaxial thin film YBa2Cu3O7 superconductors are examined. Correlations between increases in flux pinning and dislocation densities are noted. A model for flux pinning by individual dislocations is presented. This gives a treatment of strain induced effects and effects of normal state region interactions. It is shown that the values of pinning predicted are in line with experimental observations.  相似文献   
3.
In this paper we discuss the various models that have been used to predict whether a material will tend to be ductile or brittle. The most widely used is the Pugh ratio, G/K, but we also examine the Cauchy pressure as defined by Pettifor, a combined criterion proposed by Niu, the Rice and Thomson model, the Rice model, and the Zhou-Carlsson-Thomson model. We argue that no simple model that works on the basis of simple relations of bulk polycrystalline properties can represent the failure mode of different materials, particularly where geometric effects occur, such as small sample sizes. Instead the processes of flow and fracture must be considered in detail for each material structure, in particular the effects of crystal structure on these processes.  相似文献   
4.
The determination of grain boundary planes in multicrystalline material has only been restricted to transmission electron microscope investigations (Jang et al., 1992; Elgat et al., 1985) or to metallograpical investigations of the grain boundary (Randle et al., 1993). The first method is expensive, and both are complex and time consuming in grain boundary preparation. This paper proposes the determination of grain boundary planes in semiconductor wafer by a combined application of Electron Back Scatter Diffraction and Infrared Transmission Microscopy. In particular, the new method is demonstrated with directional solidificated multicrystalline silicon.  相似文献   
5.
Strain controlled fatigue experiments are conducted for 304LN at room and elevated temperature of 285 °C in ambient air. Varying cyclic plasticity characterizing parameters such as cyclic hardening/softening and Masing behavior are studied. It is found that hardening along with non-Masing behavior is demonstrated at both temperatures. However the response stresses required to cause deformation are substantially higher at room temperature. Additionally the extent of deviation from masing varied considerably with temperature. Furthermore it is shown that there is a continuous distribution of yield levels at both temperatures. All alterations observed in the cyclic plastic behavior are being accounted by the absence or presence of martensite.  相似文献   
6.
Recent progress in understanding dislocation interactions with grain boundaries and interfaces in metallic systems via static and in situ dynamic experimental approaches is reviewed.  相似文献   
7.
Diffusion characteristics of iron and nickel atoms were investigated using radioactive isotopes method in phase-hardened metastable iron-nickel Fe-31.7%Ni-0.06%C alloy with nanofragmented structure. It has been found that diffusion mobility of nickel and iron atoms in reverted austenite of Fe-31.7%Ni-0.06%C alloy significantly increases as the result of multiple γ-α-γ martensitic transformations. The diffusion coefficients of nickel and iron in the austenite at 400°C corresponded to the stationary diffusion coefficients at the temperatures above 900°C. The revealed diffusion acceleration at low temperatures is caused by high-density dislocations and additional low-angle subboundaries of disoriented nanofragments of reverted austenite and deformation twin subboundaries formed during multiple γ-α-γ cycles.  相似文献   
8.
A series of continuous cooling tests were performed on TiAl alloys using a Gleeble3500 machine to investigate the effect of thermal stresses on the microstructure. The results show that macroscopic thermal stresses promote correlated nucleation of γ lamellae. The trend of the dominance of one twin-group γ variants in local regions is weakened, and the γ/γ interfaces tend to be true twin and pseudotwin boundaries rather than 120° rotational faults under macroscopic thermal stresses. Meanwhile, thermal-induced deformation generated under the effect of both microscopic and macroscopic thermal stresses results in numerous low angle grain boundaries (LAGBs) and dislocations. The LAGBs and dislocations distribute heterogeneously among lamellar colonies and phases. No mechanical twins are observed due to the low strain and low strain rate characteristics of the thermal-induced deformation. These findings could shed light on understanding and preventing the cracking of TiAl components during cooling process.  相似文献   
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