一种新型的室温快速固化胶黏剂的研制

本文开发了一种新型的方舱夹芯板用室温固化高强度环氧结构胶黏剂,验证了其物化特性、相关力学性能和环境适应性。结果表明此胶黏剂具有优良性能,可以满足方舱用大板胶黏剂的使用需求。     

Fabrication strategies and application fields of novel 2D Ti3C2Tx (MXene) composite hydrogels: A mini-review

Ti₃C₂T_x (MXene), a new kind of 2D ceramic nanosheets, is receiving more and more attention in the fields of medicine, biology, energy, electronics, etc. However, the preparation and application of MXene in hydrogel is still in its infancy period. Here, we review the latest progress (after 2018) related to MXene hydrogels in time. Aiming at the key issue of the dispersion stability of MXene in hydrogel systems, the preparation strategy, mechanism, advantages and disadvantages of MXene hydrogels are sorted out in detail, and the potential application prospects of MXene composite hydrogel are introduced. Finally, future viewpoints are put forward for the dispersion stability challenges that need solving in the design of MXene hydrogel.     

DC/DC电源中的电磁干扰及其对策

概述了电磁干扰(EMI)和电磁兼容(EMC)的基本知识，对DC／DC电源中的电磁干扰进行了综合分析，并给出了各自的解决方案。     

Photoelectrochemistry of poly(3-methylthiophene), I: Surface morphology and thickness effect

Photocyclovoltammetric experiments with films of poly(3-methylthiophene) under polychromatic light irradiation show a p-type semiconductor behavior in the reduced state, with a flat band potential of 0.18 V. The photocurrent depends on film thickness and surface morphology. Films with different thickness were characterized by scanning electron microscopy, indicating a globular morphology with globule sizes changing according to the charge density used during polymer deposition. The highest photocurrent is observed for the lowest globule diameter. These films were also irradiated with monochromatic light from the electrolyte side and from the substrate side. A higher photocurrent and a photocurrent spectrum matching the absorption spectrum of the reduced form of the polymer is observed on irradiation from the electrolyte side of a 0.7 μm thick film. In contrast, for irradiation from the electrode side, the photocurrent is lower and the spectrum shows a peak at lower energy. These results were interpreted in terms of a delocalized space charge zone, different kinetics for charge transfer and mass transport across the solvent swollen polymer film and different depth of penetration of the light as a function of wavelength.     

Recent advances in isotropic conductive adhesives for electronics packaging applications

Isotropic conductive adhesives (ICAs) have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-bearing solders. Numerous studies have shown that ICAs possess many advantages over conventional soldering such as environmental friendliness, finer pitch printing, lower temperature processing and more flexible and simpler processing. However, complete replacement of soldering by ICAs is yet not possible owing to several limitations of ICAs which are mainly related to reliability aspects like limited impact resistance, unstable contact resistance, low adhesion and conductivity etc. Continued efforts for last 15 years have resulted in development of ICAs with improved properties. This review article is aimed at providing a better understanding of ICAs, their principles, performance and significant research and development work addressing the technological utility of ICAs.     

The Present Status and Potential of Kraft Lignin-Phenol-Formaldehyde Wood Adhesives

Kraft lignin (KL), a phenolic polymer formed during the kraft pulping process, is presently burned as a low value fuel. For decades, researchers have attempted to use KL as an inexpensive substitute for phenol in phenol-formaldehyde (PF) resins, but no one has produced a commercially satisfactory KL-PF resin. This paper reviews the literature on the present status of KL-PF adhesives and makes recommendations on needed research.

Kraft lignin solutions are complex mixtures which have broad molecular weight distributions, high viscosities, relatively low reactivities, and low solubilities. Attempts to overcome these inherent problems include methylolation of lignin to improve reactivity, the use of co-solvents to improve solubility, and ultrafiltration to yield more homogeneous molecular weight fractions. Future research efforts need to focus on understanding the fundamental chemical and physical properties of kraft lignin and its resins. The search for an economic lignin-based wood adhesive should continue.     

镀铜／镍聚丙烯腈纤维填充复合材料电磁波屏蔽性能的研究

研究了镀铜／镍的聚丙烯腈纤维填充ＡＢＳ树脂制得的复合材料的导电性及电磁波屏蔽性能，复合材料的导电性主要与导电纤维的填加量有关，导电纤维与基体树脂间的相容状况、复合加工时某些工艺条件等对复合材料的导电性也有较大的影响，电磁波屏蔽性能随导电纤维填加量的增加而提高，加入适当的偶联剂有助于改善和复合材料的电磁波屏蔽性能。     

丁腈橡胶/导电粒子复合材料的正温度系数(PTC)特性

将导电粒子碳黑和铜粉分别与丁腈橡胶混合制备导电聚合物复合材料，其中碳黑（Ｎ５５０）／丁腈橡胶复合材料的电阻率随温度的变化呈现较强的正温度系数（ＰＴＣ）效应。讨论了掺入导电粒子浓度、结构和表面性质以及混炼硫化工艺等对该类材料的室温电阻率及ＰＴＣ效应的影响。     

INTERFACE/INTERPHASE ENGINEERING OF POLYMERS FOR ADHESION ENHANCEMENT: PART II. THEORETICAL AND TECHNOLOGICAL ASPECTS OF SURFACE-ENGINEERED INTERPHASE-INTERFACE SYSTEMS FOR ADHESION ENHANCEMENT

Part I of this paper reviewed the theoretical principles of the macromolecular design of polymer interface/interphase systems for obtaining maximum adhesion and fracture performance of adhesively bonded assemblies. In Part II a novel, relatively simple and industry-feasible technology for surface-grafting connector molecules is demonstrated and discussed in detail and supported by a range of experimental examples. It is shown, in agreement with contemporary theory, that the use of chemically attached graft chemicals of controlled spatial geometry and chemical functionality enables a significant increase in the strength and fracture energy of the interphase, to the point of cohesive fracture of the substrate, or that of an adjacent medium such as adhesive, elastomer, or other material. This occurs even after prolonged exposure of investigated systems to adverse environments such as hot water.     

Microcalorimetry for characterization of film formation and cure of coatings and adhesives

A new microcalorimeter with eight parallel channels using robust, low cost sensors for characterization of coatings and adhesives is described and first experiments on coatings and adhesives are presented. The calorimetric sensors are based on thin glass plates (20 mm × 20 mm, thickness 150 μm) with heater and thermocouple sputtered on the surfaces (calorimetric active area of about 9 mm²). The setup allows heating and cooling experiments as well as isothermal measurements in the temperature-modulated mode with up to eight sensors in parallel. The measured quantities are the real (C^′_p) and imaginary part (C^″_p) of the complex heat capacity (), the related absolute value of the heat capacity () and the heat flow . An industrial computer (NI PXI system) with specific software for calibration and data recording controls the electronic components. Sensors can be embedded in a temperature controlled oven (heating and cooling by Peltier elements) or alternatively in a climatic cabinet with controlled temperature and humidity.

The method has been applied successfully to monitoring of film formation of aqueous polymer dispersions (styrene-acrylate copolymer) and curing of coatings.