Polymerization of ionic monomers in polar solvents: kinetics and mechanism of the free radical copolymerization of acrylamide/acrylic acid

A precise data set describing the kinetics of the free radical copolymerization of acrylamide/acrylic acid (AM/AA) in the range of low total monomer concentration as a function of the pH, total monomer concentration, initiator concentration, and comonomer ratio is presented. Strong impact on the reactivity ratios has been identified for the pH and total monomer concentration. Specifically, at constant total monomer concentration of 0.4 mol/l and T=313 K the reactivity ratio of AM increases from 0.54 at pH 1.8 to 3.04 at pH 12. Contrarily, the reactivity ratio of AA decreases from 1.48 to 0.32. The crossover occurs at pH≈4.2. Electrostatic effects due to the variation of the degree of ionization of AA are primarily suggested to influence the kinetics. When the total monomer concentration increases from 0.2 to 0.6 mol/l at constant pH=12, the reactivity ratios of AM and AA decrease from 4.01 to 2.13 and increase from 0.25 to 0.47, respectively. Reduction of electrostatic repulsion between the ionized monomer AA and partially charged growing polymer chain ends due to higher ionic strength at higher total monomer concentration serves as explanation of the effect. The precise data set is the prerequisite for a novel approach to calculate copolymer compositions in case of variable monomer reactivity.     

VAc—BA／MMA三元共聚物的制备及产品的粘接强度和聚合方法的关系

本文介绍了ＶＡｃ／ＢＡ／ＭＭＡ三元共聚的两种方法，并通过实验证实：聚合方法对三元共聚物的粘接强度有明显的影响。     

Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers

Argon plasma-pretreated polyimide (PI, Kapton^® HN) films were subjected to UV-induced surface graft copolymerization with N,N′-(dimethylamino)ethyl methacrylate (DMAEMA) and 2-(trimethylammonium)ethyl methacrylate chloride (TMMAC). The DMAEMA graft-copolymerized PI (DMAEMA-g-PI) surfaces were also quaternized and amino-functionalized with 3-bromopropylamine hydrobromide (the Q-DMAEMA-g-PI surfaces). The surface composition and the degree of quaternization of the graft-modified PI films were determined by X-ray photoelectron spectroscopy. The DMAEMA-g-PI, Q-DMAEMA-g-PI and TMMAC graft-copolymerized PI (TMMAC-g-PI) surfaces can be activated directly by PdCl₂, in the absence of prior sensitization by SnCl₂ (the ‘Sn-free’ activation process), for the subsequent electroless plating of copper. A shorter induction time for the electroless deposition of copper was found for the palladium-activated Q-DMAEMA-g-PI and TMMAC-g-PI surfaces than for the palladium-activated DMAEMA-g-PI surface. The T-peel adhesion strength of the electrolessly deposited copper with the Q-DMAEMA-g-PI surface was enhanced to above 6 N/cm, in comparison to only about 4 N/cm for the DMAEMA-g-PI surface, about 2.5 N/cm for the TMMAC-g-PI surface, or about 0.5 N/cm for the PI surface with argon plasma treatment alone.     

CR／MMA乳液接枝共聚物的研制

用乳液接枝共聚法制备ＣＲ／ＭＭＡ共聚物，讨论ＣＲ乳液、引发剂、接枝温度、ＭＭＡ用量对接枝共聚转化率，接枝ＭＭＡ含量、ＭＭＡ接枝效率和粘接性能的影响，用红外光谱对接枝共聚物进行表征，该共聚物具有较好的粘接性能。     

γ－巯基两基三甲氧基硅烷对SBR的接枝改性研究

本文研究了γ－流基丙基三甲氧基硅烷（ＫＨ５９０）对白炭黑填充的ＳＢＲ胶料的光接枝反应。通过接枝反应，提高了橡胶填料间界面粘合性，也提高了硫化胶的３００％定伸模量，改善了撕裂强度、压缩永久变形及耐磨耗性等、此外，在ＮＢＲ中也取得同样改性效果。尤其是，改善了耐碱性。但经照射后在室内放置会增加凝胶化，影响到加工性能．     

喹喔啉类衍生物与甲基噻吩共聚物的合成及性质

在二价镍配合物催化下,2,5-二溴-3-甲基噻吩格氏试剂与5,8-二溴-萘基喹喔啉和5,8-二溴-菲基喹喔啉共聚,得到相应的喹喔啉类共轭共聚物,收率分别为65%和68%。通过FT IR、1H-NM R对聚合物及中间体的结构进行了表征。聚合物的循环伏安图中,分别在0.66 V(Epa)/0.37 V(Epc)(Copo ly-m er I),0.78 V(Epa)/-0.06V(Epc)和1.26(Epa)/0.46(Epc)(Copo lym erⅡ)处观察到氧化还原峰,表明该类聚合物有电化学活性。在紫外-可见光谱中,分别在263 nm,323 nm处(Copo lym erⅠ)和299 nm,402 nm处(Copo lym erⅡ)出现吸收峰。所得聚合物分别在504 nm和513 nm处出现荧光最大发射峰。     

大单体参与的分散聚合

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聚丙烯接枝改性及其接枝物的应用

对聚丙烯接枝的几种方法、单体和引发剂的选择及接枝物的表征作了简要的介绍；并介绍聚丙烯接枝物的应用情况。     

国内聚羧酸系高性能减水剂的合成及研究状况

简述了聚羧酸类减水剂合成方法、分子结构与性能的关系,讨论了大单体聚乙二醇丙烯酸酯等的制备工艺技术。     

氯化聚乙烯接枝马来酸酐胶粘剂的研究

本文介绍了改性聚丙烯（PP）基泡沫材料用的水溶性胶粘剂的研制。该胶粘剂不影响泡沫材料的阻燃性能和吸声性能，并有较好的热稳定性和储存性以及优化的耐水性。