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1.
Thermosetting materials are widely used as encapsulation in the electrical packaging to protect the core electronic components from external force, moisture, dust, and other factors. However, the spreading and curing behaviors of such kind of fluid on a heated surface have been rarely explored. In this study, we experimentally and numerically investigated the spreading and curing behaviors of the silicone(OE6550 A/B, which is widely used in the light-emitting diode packaging) droplet with diameter of ~2.2 mm on a heated surface with temperature ranging from 25 ℃ to 250 ℃. For the experiments, we established a setup with high-speed camera and heating unit to capture the fast spreading process of the silicone droplet on the heated surface. For the numerical simulation, we built a viscosity model of the silicone by using the Kiuna's model and combined the viscosity model with the Volume of Fluid(VOF) model by the User Defined Function(UDF) method. The results show that the surface temperature significantly affected the spreading behaviors of the silicone droplet since it determines the temperature and viscosity distribution inside the droplet. For surface temperature varied from 25 ℃ to 250 ℃, the final contact radius changed from ~2.95 mm to ~1.78 mm and the total spreading time changed from ~511 s to ~0.15 s. By further analyzing the viscosity evolution of the droplet, we found that the decreasing of the total spreading time was caused by the decrease of the viscosity under high surface temperature at initial spreading stage, while the reduction of the final contact radius was caused by the curing of the precursor film. This study supplies a strategy to tuning the spreading and curing behavior of silicone by imposing high surface temperature, which is of great importance to the electronic packaging.  相似文献   
2.
The development of bio‐based thermosetting resins with good thermal stability can potentially afford sustainable polymers as replacements for petroleum‐based polymers. We report a practical route to a novel catechin‐based phthalonitrile resin precursor (CA‐Ph), which contains free phenolic hydroxyl groups that result in ‘self‐curing’ at elevated temperatures to afford a thermostable polymer. Comparison of the performance of this CA‐Ph resin with that of a conventional petroleum‐based bisphenol A phthalonitrile resin (BPA‐Ph; containing 5 wt% of the curing agent 4,4′‐diaminodiphenylsulfone) revealed that CA‐Ph exhibits a lower melting point and curing temperature. Cured CA‐Ph resin retains 95% of its weight at 520 °C under a nitrogen atmosphere, which compares favorably with results obtained for BPA‐Ph resin that retains 95% of its weight at a lower temperature of 484 °C. Kinetic results indicated that the curing reactions of both CA‐Ph and BPA‐Ph systems follow an autocatalytic mechanism. These results suggest that catechin is a useful bio‐based feedstock for the preparation of self‐curing and thermally stable phthalonitrile resins for advanced technological applications. © 2017 Society of Chemical Industry  相似文献   
3.
《能源学会志》2020,93(4):1449-1459
Oil shortage and awareness of environment pollution leads to the extensive use of biodegradable starch-based materials against synthetic plastics. The accumulated wastes of these plastics takes more time for natural recycling and the process is complex. Therefore the best option of recycling would be to convert these polymers into a source of energy by pyrolysis. So to understand the pyrolytic behaviour, kinetics of such waste plastics is studied by using thermogravimetric analysis at different heating rates of 10 °C, 20 °C, 40 °C, 60 °C, 80 °C and 100 °C in nitrogen atmosphere followed by characterization of the pyrolysis products. The kinetic parameters are obtained for two major stages of decomposition in two different temperature ranges 250–620 °C and 620–855 °C by iso-conversional methods such as Friedman, Coats-Redfern, FWO and Kissinger methods. The regression coefficient data (>0.9) of kinetic plots obtained for different methods best fits to the kinetic equation. Empirical formula of the compound is determined by ultimate analysis is CH2.214S0.0018O0.6910. Proximate analysis gives the idea of volatile component which is74.33%. The range of average value of activation energy is 120.7013 kJ/mol to 140.7707 kJ/mol for the biodegradable plastic plate with different conversion (0.1–0.6) and (0.1–0.3) respectively at two different temperatures. The pyrolysis products obtained using a semi-batch reactor are characterized to know their composition and other properties.  相似文献   
4.
The present work deals with the modelling of damage behaviour for sheet moulding compound (SMC) composite materials using a finite element analysis package. Specifically, a comparison is made between the results obtained experimentally for a three-point bending test, and those obtained from numerical simulation using a material model already implemented. The simulation has been performed for the material models available within the PAM-CRASH software. The simulation results are compared and validated with respect to experimentation.  相似文献   
5.
通过氟塑料-石墨板式换热器在化纤生产中高温强腐蚀换热工况中的实际应用,并与常规换热器的使用情况的对比分析,阐述了这种新型换热设备的特点。  相似文献   
6.
利用废旧塑料生产阻燃建筑装饰材料探讨   总被引:4,自引:0,他引:4  
本文介绍了一种综合利用废旧热塑性塑料和锯末粉通过加入阻燃剂改性 ,生产防火阻燃型建筑装饰材料的方法。所生产的产品 ,其阻燃性能均达到国家标准 (GB5464 - 85)中规定的不燃性材料的要求。  相似文献   
7.
鉴于当今人们对塑料门窗需求量的增大,通过对5个塑料挤出型材车间的设计,将其公用工程设计整理成文,总结出塑料挤出型材车间的采暖通风设计,压缩空气系统设计,制冷系统设计的较详尽的方案,以供有关设计技术人员参考。  相似文献   
8.
射频识别系统一般由三部分组成:电子标签(射频卡)、读取器和天线.正确快速的识别电子标签的标签号码,是门禁系统发挥其功能的先决条件.以无源低频射频卡识别模块SMC51489为例,介绍了对射频卡信息读取的原理和方法,并给出了相应的软件编程.实验证明该模块不仅具有较大的读卡距离,而且工作可靠.  相似文献   
9.
我国聚甲醛工业的供需分析   总被引:3,自引:0,他引:3  
从国内聚甲醛树脂的生产、贸易及消费状况出发 ,分析了国内聚甲醛工业的供需现状并提出短期预测。  相似文献   
10.
绿色包装材料——生物降解塑料   总被引:8,自引:4,他引:4  
对绿色包装材料-生物降解塑料的降解机理、特点,国内外研究现状和进展及存在的问题和发展前景进行了介绍。  相似文献   
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