Essential (Mg,Fe, Zn and Cu) and Non-Essential (Cd and Pb) Elements in Predatory Insects (Vespa crabro and Vespa velutina): A Molecular Perspective

The recent introduction of the Asian yellow-legged hornet, Vespa velutina, into Europe has raised concern regarding the threat to honeybees and the competition with the European hornet, Vespa crabro. The aim of this study was to investigated essential (Mg, Fe, Zn, Cu) and non-essential (Cd and Pb) elements in these two species. Element concentrations were determined in the whole body and separately in the head, thorax and abdomen using atomic absorption spectrometry (AAS). The changes in essential element concentration and speciation during metamorphosis were also studied using size exclusion chromatography followed by AAS and proteomic analysis. In both species, the essential elements were more concentrated in the abdomen due to the presence of fat bodies. Magnesium, Fe and Zn concentrations were significantly higher in V. crabro than in V. velutina and could have been related to the higher aerobic energy demand of the former species required to sustain foraging flight. Low concentrations of Cd and Pb were indicative of low environmental exposure. The concentration and speciation of essential elements, particularly Fe, varied among the developmental stages, indicating a modification of ligand preferences during metamorphosis. Overall, the results in the present study provide a better understanding of the hornet metal metabolism and a foundation for additional studies.     

Ni-Al2O3纳米复合电镀工艺的初步研究

初步研究了复合电镀各工艺条件：电流密度、镀液pH值和温度以及搅拌方式对Al2O3纳米微粒在镍基复合镀层中含量的影响。研究表明：电流密度增大不利于提高镀层中纳米微粒的含量；pH值增大也明显使复合量降低;镀液温度升高，镀层中微粒的复合量随之略有改变；电镀时，加强搅拌或适当改变搅拌方式，可以使复合镀居中的纳米微粒含量提高。还利用扫描电镜及能谱对Ni-Al2O3镀层表面进行了观察与分析。     

浅述设备对PCB微孔电镀镀液更新之影响

分析了设备对PCB电镀过程中孔中镀液更新之影响,为有效地利用设备条件改善孔中镀液的更新提供了一些方法及理论数据。     

工艺因素对金属封装外引线弯曲疲劳的影响

考察了金属封装外壳制造工艺对外引线弯曲疲劳的影响,发现电镀镍是导致外引线弯曲次数明显减少的最主要工艺步骤,且随镀镍层厚度的增加,弯曲次数减少。此外还讨论了外引线的氢含量和晶粒度对引线抗疲劳能力的影响。     

铜线材酸性高速电镀致密光亮锡、锡铜合金

为了寻找低成本、低腐蚀、低污染高速电镀锡、锡铜合金工艺 ,在含光亮剂、柔软剂DL0 1、0 2、0 3的硫酸槽中在不同的电流密度、不同的搅拌速度下 ,在Φ0 .5mm的铜线上电镀Sn和Sn Cu合金镀层。DL0 1、0 2的主要成分是无芳香族的希夫碱 ,DL0 3的主要成分是醇醛缩合物。结果表明 ,在含有DL0 1、0 2、0 3和 35g/LSnSO4 ,137g/LH2 SO4 的镀液中 ,在Jc=10～ 90A/dm2 ,v=16 0～ 314m/min时 ,所得镀层致密、柔软、光亮。在含CuSO4 ·5H2 O 0 .5 ,3.5g/L的硫酸镀槽中 ,在Jc=9,18A/dm2 ,v=16 0m/min时获得了致密、柔软、光亮的Sn (0 .3%～ 0 .6 % )Cu合金镀层。     

Single and matrix HgCdTe photovoltaic detectors

The recent researches and technological developments of middle and long wavelength infrared HgCdTe photovoltaic detectors are presented. Structure, topology, design and performance of HgCdTe photodiodes, silicon readout electronics, Focal Plane Arrays both staring and time delay and integration types, thermal imagers are discussed. Negative differential conductance, bistability and high frequency oscillations under background infrared radiation in HgCdTe photodiodes are reported.     

电镀企业火警和爆鸣事故实例

列举了作者经历的18种火警和爆呜事故，为电镀企业敲响警钟，安全重于泰山。     

Sensitometric characteristics of an all‐solid‐state photoelectrochromic pixel for an electrochromic light‐addressable display

Abstract— An all solid‐state photoelectrochromic element (PECE) was developed on the basis of electrochromic layers of WO₃ and polyaniline with a layer of polymer electrolyte placed on a base of polyamidosulfoacid, in which a thin‐film CdS_xSe_1?x photoresistor was used as an electronic key. The dependence of the sensitometric characteristics of the PECE on the applied voltage was studied.     

高可靠镀Ni／Au工艺及其在微波PTFE电路上的应用

介绍了高可靠电镀Ｎｉ／Ａｕ工艺在ＰＴＦＥ微波印制电路上的应用，并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ｎｉ／Ａｕ镀层之间附着力的措施。通过实验及应用证明了与直接镀金工艺相比，在软基材ＰＴＦＥ敷铜箔板上镀Ｎｉ／Ａｕ工艺能大大提高微波电路的可焊性，高温稳定性和长期可靠性，并且用其所制作的微波器件的高频性能也优于直接镀金工业。     

缓冲剂在电镀工业中的应用

着重叙述了缓冲剂原理及应用。详细阐述了在电镀工艺中如何选用缓冲剂以及将电镀中的缓冲剂与化学中的缓冲剂的应用加以区别。