高分子材料导热性能影响因素研究进展

介绍了高分子材料导热性能影响因素研究进展，重点阐释了聚合物基体的结构特性（链结构、分子间相互作用、取向、结晶度等）、导热填料（种类、含量、形态、尺寸等）以及制备方法等对高分子材料导热性能的影响。     

Phosphorylated chitosan/poly(vinyl alcohol) based proton exchange membranes modified with propylammonium nitrate ionic liquid and silica filler for fuel cell applications

In our previous work, phosphorylated chitosan was modified through polymer blending with poly(vinyl alcohol) (PVA) polymer to produce N-methylene phosphonic chitosan/poly(vinyl alcohol) (NMPC/PVA) composite membranes. The aim of this work is to further investigate the effects of a propylammonium nitrate (PAN) ionic liquid and/or silicon dioxide (SiO₂) filler on the morphology and physical properties of NMPC/PVA composite membranes. The temperature-dependent ionic conductivity of the composite membranes with various ionic liquid and filler compositions was studied by varying the loading of PAN ionic liquid and SiO₂-PAN filler in the range of 5–20 wt%. As the loading of PAN ionic liquid increased in the NMPC/PVA membrane matrix, the ionic conductivity value also increased with the highest value of 0.53 × 10^?3 S cm^?1 at 25 °C and increased to 1.54 × 10^?3 S cm^?1 at 100 °C with 20 wt% PAN. The NMPC/PVA-PAN (20 wt%) composite membrane also exhibited the highest water uptake and ion exchange capacity, with values of 60.5% and 0.60 mequiv g^?1, respectively. In addition, in the single-cell performance test, the NMPC/PVA-PAN (20 wt%) composite membrane displayed a maximum power density, which was increased by approximately 14% compared to the NMPC/PVA composite membrane with 5 wt% SiO₂-PAN. This work demonstrated that modified NMPC/PVA composite membranes with ionic liquid PAN and/or SiO₂ filler showed enhanced performance compared with unmodified NMPC/PVA composite membranes for proton exchange membrane fuel cells.     

Novel electrospun polymer electrolytes incorporated with Keggin‐type hetero polyoxometalate fillers as solvent‐free electrolytes for lithium ion batteries

In this study, solvent‐free nanofibrous electrolytes were fabricated through an electrospinning method. Polyethylene oxide (PEO), lithium perchlorate and ethylene carbonate were used as polymer matrix, salt and plasticizer respectively in the electrolyte structures. Keggin‐type hetero polyoxometalate (Cu‐POM@Ru‐rGO, Ni‐POM@Ru‐rGO and Co‐POM@Ru‐rGO (POM, polyoxometalate; rGO, reduced graphene oxide)) nanoparticles were synthesized and inserted into the PEO‐based nanofibrous electrolytes. TEM and SEM analyses were carried out for further evaluation of the synthesized filler structures and the electrospun nanofibre morphologies. The fractions of free ions and crystalline phases of the as‐spun electrolytes were estimated by obtaining Fourier transform infrared and XRD spectra, respectively. The results showed a significant improvement in the ionic conductivity of the nanofibrous electrolytes by increasing filler concentrations. The highest ionic conductivity of 0.28 mS cm^?1 was obtained by the introduction of 0.49 wt% Co‐POM@Ru‐rGO into the electrospun electrolyte at ambient temperature. Compared with solution‐cast polymeric electrolytes, the electrospun electrolytes present superior ionic conductivity. Moreover, the cycle stability of the as‐spun electrolytes was clearly improved by the addition of fillers. Furthermore, the mechanical strength was enhanced with the insertion of 0.07 wt% fillers to the electrospun electrolytes. The results implied that the prepared nanofibres are good candidates as solvent‐free electrolytes for lithium ion batteries. © 2020 Society of Chemical Industry     

高炮火控系统滤波器的设计

对目前高炮火力控制系统目标滤波与预测进行了分析与研究．在此基础上结合工程实际设计了一种α-β滤波器．该滤波器的原理是把在连续系统中频率域的要求和在离散系统中Z域的要求转换成时域中在典型信号激励下的时间响应的特征值的要求．从而在时间域中以特征值的要求进行综合．再把综合的结果转换回Z域中．最终得到所确定的α-β滤波器．文中给出了α-β滤波器的Z传递函数．分析了α-β滤波器参数的确定．对α-β滤波器的静态误差进行了研究．对设计方案进行了计算机仿真和实际应用．     

聚合物复合材料填充剂的改性

在前人研究的基础之上，归纳总结了聚合物复合材料填充剂的种类，综述了对其进行表面改性的目的、条件、方法、工艺以及对改性结果的表征等。文章还分析了影响填充聚合物复合材料性能的因素，指出了今后发展的方向。     

浅色补强填充剂LEE白滑粉在合成橡胶中的应用

介绍了新型浅色补强填充剂ＬＥＥ白滑粉的组成、物化性质、加工特性、硫化胶性能及应用前景。     

Effects of a Nd—Fe—B magnetic filler on the crystallization of poly(phenylene sulfide)

The crystallization of poly(phenylene sulfide) (PPS) in a polymer–magnetic Nd—Fe—B powder suspension was studied. Isothermal crystallization behavior was analyzed by way of differential scanning calorimetry, and the kinetics were described via the Avrami equation. The Avrami parameters and the crystallization times were strongly affected by both the particle size and the presence of a coupling agent coated on the filler particles. The small Nd—Fe—B particles exhibited long induction and half‐times, whereas the large particles tended to have short crystallization times. Particles ranging from 38 to 150 μ appeared to have similar crystallization times and to have no significant change in the value of Avrami index with melt crystallization temperature. As a result of these analyses, the dynamic mechanical properties were determined to correlate the fundamental polymer crystallization characteristics and the physical properties of the PPS binder. The enhancement of the wetting of the filler to the binder was promoted through the coupling agent, as confirmed by dynamic mechanical testing performed on the samples. The storage modulus typically decreased because of the presence of the uncoated small particles. Conversely, the loss modulus was enhanced because of the presence of the coated small particles in the PPS binder. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1091–1102, 2002     

单壁纳米碳管/纳米铝基复合材料的增强效果

用半连续氢电弧法和活性氢等离子蒸发法分别制备出单壁纳米碳管(SWNTs)和纳米A1粉体，然后用提纯后的SWNTs和纳米A1粉体制备出SWNTs含量(质量分数)分别为0、2．5％、5．0％、7．5％和10.0％的单壁纳米碳管／纳米铝基块体复合材料．SWNTs对高强度纳米A1基体具有显著的增强作用，当SWNTs含量小于5．0％时，材料的硬度随着SWNTs含量的提高线性上升．其中5％SWNTs和纳米A1的复合增强效果最好，其硬度可达2.89GPa，大约是粗晶A1(0．15GPa)的20倍．当SWNTs含量超过5．0％时，增强效果开始缓慢的下降．讨论了单壁纳米碳管增强纳米铝基复合材料的强化机制．     

Filler-induced failure mechanism in plastic-encapsulated microelectronic packages

Based on empirical data, the present work provides a model to prevent filler-induced reliability degradation in plastic-encapsulated LOC (lead-on-chip) packages. According to the model, the maximum size of the silica fillers included in the plastic package body should be smaller than one half of the inter-distance between the device and its overlying lead-frame. In particular, it is shown in the model that the spherical silica particles, which are sometimes trapped in the space between the top surface of the device and the bottom of the lead-frame during the encapsulating process, can induce huge compressive stress on a specific site of the integrated circuit pattern due to the thermal shrinkage of the plastic package body. Further, the present model suggests that tiny fillers squeezed beneath a large trapping filler might directly attack the brittle layer of the device pattern because the compressive force from the large filler particle can develop into huge compressive stress due to the reduced load-carrying area.