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1.
Saw-tooth chip changes from macroscopically continuous ribbon to separated segments with the increase of cutting speed. The aim of this study is to find the correlations between chip morphology and machined surface micro-topography at different chip serration stages encountered in high speed cutting. High strength alloy steel AerMet100 was employed in orthogonal cutting experiments to obtain chips at different serration stages and corresponding machined surfaces. The chips and machined surfaces obtained were then examined with optical microscope (OM), scanning electron microscope (SEM), and white light interferometer (WLI). The result shows that chip serration causes micro-waves on machined surface, which increases machined surface roughness. However, wave amplitudes (surface roughness) at different serration stages are different. The principal factor influencing wave amplitude is the thickness of the sawed segment (tooth) of saw-tooth chip. With cutting parameters in this study, surface roughness contributed by chip serration ranges from 0.39 μm to 1.85 μm. This may bring on serious problems in the case of trying to replace grinding with high-speed cutting in rough machining. Some suggestions have been proposed to control the chip serration-caused surface roughness in high-speed cutting based on the results of the current study. 相似文献
2.
进入21世纪,随着集成电路的发展,SoC(System on Chip)片上系统应运而生。而作为SoC重要组成部分的嵌入式存储器,在SoC中所占的比重正逐步增加,并起着越来越重要的作用,那么嵌入式存储器与独立的存储器芯片在设计上存在着哪些差异?对此本文将以NOR型闪存为例在制造工艺的选取、衍生产品的设计、功耗与噪声、后端功能仿真、测试与修复等方面进行分析和研究。 相似文献
3.
CH371是一种新型USB通用总线接口芯片。利用该芯片可在不了解任何USB协议或固件程序甚至驱动程序的情况下,轻松地将并口或串口产品升级到USB接口。文中介绍了该接口芯片的主要特点和引脚功能,给出了CH371与其它总线进行接口的几种应用电路,同时给出了CH371与MCS-51单片机的接口程序。 相似文献
4.
DR是目前非常先进的X射线成像技术,将其X射线采集板工作温度控制在最佳工作范围可采集更好的图像。本系统采用PC和单独控制双模块分别控制温度,利用半导体传感器DS1620进行四路温度采集,通过单片机和PC串口通信,用PC通过半导体制冷芯片来控制X射线采集板的工作温度,在通信故障时也可以通过单独控制模块来控制采集板的温度。 相似文献
6.
集成光学干涉仪光纤陀螺 总被引:2,自引:0,他引:2
简述了集成光学干涉仪光纤陀螺(FOG)的技术优势、发展概况和采用的技术途径,介绍了适用于不同技术条件要求的三种多功能集成光学芯片结构和相应的信息处理方法。简要地概括了目前国外FOG的发展水平。 相似文献
7.
A new Thermo-viscoplastic Material Model for Finite-Element-Analysis of the Chip Formation Process 总被引:1,自引:0,他引:1
G. Warnecke J.-D. Oh 《CIRP Annals》2002,51(1):79-82
A new material model for describing the thermo-viscoplastic flow behavior of workpiece material in metal cutting is presented. In order to express the complex flow behavior which depends on the local strain, strain rate and temperature, a new methodology for sequential formulation is proposed. The material parameters which are achieved by using the flow stress data available at low strain rates are enhanced by matching the results of the experimental investigations and finite element simulations of the orthogonal cutting process. As a result, a material model which has a wide validity range of strain, strain rate and temperature is established. 相似文献
8.
The forces, chip thickness, and natural tool–chip contact length in machining with a double-rake-angled tool are predicted in Part II of the present study. It is revealed that in comparison with a single-rake-angled tool, a double-rake-angled tool increases the forces, especially the thrust force. However, the increase in chip thickness and tool–chip contact length is not significant under the input conditions specified in the present study. The effect of seven input variables of the proposed model is quantitatively investigated. The predicted variations of forces, chip thickness, and natural tool–chip contact length are in good agreement with theoretical and experimental results obtained by other researchers. The interrelationships among the resultant force, the chip thickness, and the natural tool–chip contact length are established, which provides a new and promising method to estimate the tool–chip contact length by employing the resultant force. It is demonstrated that the model can also be extended to study the problem of machining with a groove-type chip breaker tool. 相似文献
9.
10.
面阵列封装器件在电子产品中的使用率逐年上升,如何实现其高速贴装是影响生产线效率的重要因素。从不同的角度论述了面阵列封装器件实现高速贴装的手段与技术。 相似文献