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排序方式: 共有8022条查询结果,搜索用时 15 毫秒
1.
为解决电镀砂轮磨削加工中容屑空间不足的问题,采用点胶微粘接的方法制备了磨料有序排布的电镀砂轮,分析了磨料粘接效果和镀层力学性能。通过SEM分析了磨料/镀层/导电胶的结合界面,并进行了干磨削试验。研究结果表明,直径约为磨料粒径40%的胶点可粘接住磨料,单个胶点上粘接多颗磨料的占比小于6%;双脉冲电镀工艺制备的镀层显微硬度大于500HV,表层残余应力小于100MPa,磨料/镀层/导电胶之间的界面贴合紧密,无明显缺陷;砂轮在磨削时没有出现磨料脱落现象。 相似文献
2.
This paper introduces the potential feasibility that ELID (electrolytic in-process dressing) grinding replaces superfinishing in bearing manufacturing, but ELID grinding will bring new challenges. Different regions present distinguish surface profile due to the non-uniform contact in ELID groove grinding. However, few reports explaining the non-uniform contact are available. This article explores the mechanisms of the non-uniform contact during ELID groove grinding. Experiments on the non-uniform contact between bearing raceway and grinding wheel have been carried out under different conditions. The results show that non-uniform contact exists in ELID groove grinding process and it exerts influence on the profile of the raceway surface. Non-uniform contact influences the Rsk and Rku value all the time, but it influences the Ra value occasionally. Improvement strategies of eliminating the non-uniform contact are also discussed based on the experimental study. 相似文献
3.
Train driving is a highly visual task. The visual capabilities of the train driver affects driving safety and driving performance. Understanding the effects of train speed and background image complexity on the visual behavior of the high-speed train driver is essential for optimizing performance and safety. This study investigated the role of the apparent image velocity and complexity on the dynamic visual field of drivers. Participants in a repeated-measures experiment drove a train at nine different speeds in a state-of-the-art high-speed train simulator. Eye movement analysis indicated that the effect of image velocity on the dynamic visual field of high-speed train driver was significant while image complexity had no effect on it. The fixation range was increasingly concentrated on the middle of the track as the speed increased, meanwhile there was a logarithmic decline in fixation range for areas surrounding the track. The extent of the visual search field decreased gradually, both vertically and horizontally, as the speed of train increased, and the rate of decrease was more rapid in the vertical direction. A model is proposed that predicts the extent of this tunnel vision phenomenon as a function of the train speed.Relevance to industryThis finding can be used as a basis for the design of high-speed railway system and as a foundation for improving the operational procedures of high-speed train driver for safety. 相似文献
4.
彭威城 《电信工程技术与标准化》2019,32(10)
高铁移动网络覆盖是国内三大通信运营商的一个重点,而高铁隧道内移动网络覆盖更是运营商的一大难点痛点。文章根据我国中部省份某高铁线路覆盖规划实例,采用“设备+POI+泄漏电缆”模式,即三家运营商信号源设备通过同一POI(point of interface,多系统接入平台)接入,信号输出到泄漏电缆进行隧道覆盖,隧道口场坪站安装宽频切换天线对隧道外进行延伸覆盖,通过链路预算合理布置各运营商主设备信号源,从而实现隧道到室外的无缝覆盖。最后,根据已有成熟网络覆盖解决方案,对未来5G高铁隧道移动网络覆盖方案进行了探讨。 相似文献
5.
Saw-tooth chip changes from macroscopically continuous ribbon to separated segments with the increase of cutting speed. The aim of this study is to find the correlations between chip morphology and machined surface micro-topography at different chip serration stages encountered in high speed cutting. High strength alloy steel AerMet100 was employed in orthogonal cutting experiments to obtain chips at different serration stages and corresponding machined surfaces. The chips and machined surfaces obtained were then examined with optical microscope (OM), scanning electron microscope (SEM), and white light interferometer (WLI). The result shows that chip serration causes micro-waves on machined surface, which increases machined surface roughness. However, wave amplitudes (surface roughness) at different serration stages are different. The principal factor influencing wave amplitude is the thickness of the sawed segment (tooth) of saw-tooth chip. With cutting parameters in this study, surface roughness contributed by chip serration ranges from 0.39 μm to 1.85 μm. This may bring on serious problems in the case of trying to replace grinding with high-speed cutting in rough machining. Some suggestions have been proposed to control the chip serration-caused surface roughness in high-speed cutting based on the results of the current study. 相似文献
6.
7.
Anna Hać 《Journal of Network and Systems Management》1994,2(1):49-62
This paper analyzes the performance of a switching architecture. The performance measures include the elapsed time of packet transfer and the waiting time to begin transfer. The architecture is partitioned depending on the type of network used and the expected traffic in the network. Every partition has a switch with a buffer that can absorb surges of bursty traffic within the network partition. The buffer size depends on the type of the network and incoming traffic. The partition size depends on the network bandwidth, network traffic, packet size and buffer size. Examples of different networks are used to show the applications of the model. The results show that the elapsed time of packet switch transfer depends exponentially on the number of partitions in the network. 相似文献
8.
对欧洲的立法者来说,目前最为关注的课题之一便是如何解决数字鸿沟这一困扰欧洲大陆信息与通信技术整体发展水平的矛盾。向人们提供高速因特网接入服务是消除数字鸿沟的有效手段,而无线数字用户线技术以及其成低、通信质量好、覆盖范围大及灵活性等优势成为宽带接入技术中的佼佼者,并获得很多欧洲国家电信运营商的青睐。 相似文献
9.
Toshihiko Hoshide Junpei Fujita 《Journal of Materials Engineering and Performance》2008,17(5):627-632
Strength of ground ceramics may be affected by residual stress as well as surface flaws induced by grinding. Strength prediction
for ground ceramics is convenient for mechanical design of ceramic components. In this article, a numerical procedure based
on fracture mechanics was proposed to estimate strength distribution of ground ceramics by considering grinding-induced residual
stress. Bending strength and residual stress of ground ceramics were measured for three grinding-conditions. By comparison
of simulated results with experimental ones, it was revealed that strength characteristics in experiments were well simulated
by using the proposed procedure. 相似文献
10.
SOI材料的全介质隔离技术与高频互补双极工艺的结合是研制抗辐照能力强、频带宽、速度高的集成运算放大器的理想途径,从实验的角度提出了一种SOI材料全介质隔离与高频互补双极工艺兼容的工艺途径。 相似文献