Reliability studies of MOCVD TiSiN and EnCoRe Ta(N)/Ta

Passivated single damascene copper SiO₂ damascene lines were evaluated in combination with TiSiN and Ta(N)/Ta diffusion barriers. Leakage current, breakdown and time-dependent dielectric breakdown properties were investigated on a wafer level basis for temperatures ranging between room temperature and 150 °C. It is found that the leakage performance of the wafers with a TiSiN barrier is better at room temperature, but at 150 °C the performance levels out with Ta(N)/Ta. Time-dependent dielectric breakdown measurements at 150 °C show that the lifetime of the interconnect is higher with the selected Ta(N)/Ta barrier than for TiSiN.     

ATMOSPHERIC DEPOSITION OF CHEMICAL SPECIES TO POLAR SNOW

Particles and gases can deposit from the atmosphere to polar snow by several mechanisms. Dry deposition can be considered to consist of three steps: aerodynamic transport from the free atmosphere to the viscous sublayer near the surface, boundary layer transport across the sublayer, and interactions with the surface. The particle dry deposition mass flux is dominated by the largest particles present in a size distribution. Wet deposition includes in-cloud and below-cloud scavenging, where the former refers to uptake of particles during nucleation of cloudwater as well as scavenging of particles and gases by existing droplets and ice crystals. Of all the wet deposition mechanisms, nucleation scavenging is often the most important mechanism for particles in the polar regions. Finally, incorporation of particles and gases into fog droplets and subsequent settling of the fog to the snow surface can be an important removal process in regions of frequent fog. For Summit, Greenland, the total deposition of MSA, SO₄^2-, Na⁺, K⁺, and Ca²⁺ during May 24-July 13, 1993 was dominated by wet deposition: this mechanism accounted for an average of 62% of the total deposition for these species. Fog and dry deposition accounted for 21% and 17% of the total, respectively. These results suggest that all three mechanisms may need to be considered when estimating total deposition of certain chemical species to polar snow.     

Skeletal Isomerization and Inter—molecular Hydrogen Transfer Reactions in Catalytic Cracking

Bimolecular hydrogen transfer and skeletal isomerization the important secondary reac-tions among catalytic cracking reactions,which affect product yield distribution and product quality,Catalyst properties and operating parameters have great impact on bimolecular hydrogen transfer and skeletal isomerization reactions .Bimolecular hydrogen transfer activity and skeletal isomrization activity of USY-containing catalysts are higher thn that of ZSM-5-containing catalyst.Coke deposition on the active sites of catalyst may suppress bimolecular hydrogen transfer activity and skeletal isomer-ization activity of catlys in different degrees.Short raction time causes a decrease of hydrogen trans-fer reaction,but and increase of skeletal isomerization reaction compared to cracking reaction in catalytic cracking process.     

碳/碳复合材料CVI工艺中热解碳形成机理的研究

对碳碳复合材料CVI或（CVD）工艺中热碳组织的类型，沉积机理等研究情况进行了简要的综述，并对其进一步研究提出了相应观点。     

化学镀非晶态Ni—B合金的研究

本文通过化学镀方法在铜和钢上沉积非晶态Ni-B合金。着重讨论了还原剂浓度、络合剂浓度对化学镀沉积速率的影响;分析了它的耐蚀原因和其显微硬度随退火温度的变化情况并就其应用和发展略作说明。     

宝浪油田侏罗系三工河组浅水辫状河三角洲沉积模式研究

焉耆盆地侏罗系三工河组广泛发育由辫状河进积到湖泊中形成的辫状河三角洲。这种三角洲特征显著不同于其它三角洲,其主体是辫状分流河道和水下分流河道。宝浪油田含油层段主体为辫状分流河道,以心滩发育为主要特征,是典型的浅水缓坡粗粒辫状河三角洲沉积。     

Modification of platinum surfaces by spontaneous deposition: Methanol oxidation electrocatalysis

The presence of a second metal on platinum surfaces affects the performance of methanol oxidation. However, most of the electrocatalytic reactions are studied by using electrochemically deposited platinum alloys, but in the case of spontaneous deposition the situation is not so clear since the surface distribution, stability and morphology are usually not well documented. The formation of surface decorated samples on mono- and poly-crystalline platinum is followed by electrochemical and spectroscopic techniques and analysis of their performance towards methanol adsorption and oxidation compared with that on pure platinum. Pt/Sn and Pt/Ru are of special interest because of their well-known performance in methanol fuel cells. Methanol oxidation on Pt(111)/Ru, Pt(111)/Sn and Pt(111) shows that ruthenium is the only one able to promote the reaction since the simultaneous dissolution of tin occurs and competes with the process of interest. The in situ infrared spectroscopy is used to compare methanol oxidation on Pt(111)/Ru and Pt(111) in acid media using p-polarized light. The formation of bridge bound carbon monoxide is inhibited in the presence of ruthenium ad-species, whereas on Pt(111) the three adsorption configurations are observed. Linear sweep polarization curves and Tafel slopes (calculated from steady state potentiostatic plots) for methanol oxidation are compared on polycrystalline surfaces modified by tin or ruthenium at different coverages. There is almost no change in the Tafel slopes due to the presence of the foreign metal except for Pt/Ru, where a 0.09 V decade⁻¹ slope was calculated below 0.55 V due to hydroxyl adsorbates on ruthenium islands. The anodic stripping of methanol residues on the three surfaces indicates a lower amount of carbon monoxide-type adsorbates on Pt/Ru, and the simultaneous tin dissolution process leading to residues oxidation on Pt/Sn electrodes.     

Formation and electronic structure of interface

In the present work the formation of the interface between polycrystalline silver and thin films of titanium oxide was studied with photoelectron spectroscopy (XPS, UPS) and time-of-flight secondary ion mass spectrometry (TOF-SIMS). Titanium oxide was deposited stepwise on 100 nm thick silver films by reactive magnetron sputtering allowing to study the evolution of the interface formation process. The process involves two steps: formation of thin layer of silver oxide and subsequent growth of the TiO₂ film. For better understanding of the silver oxidation process, pure silver films were exposed to a low temperature Ar/O plasma for different time intervals providing a possibility to investigate early stages of the oxide film growth.     

Electrochemical C-V Characteristics and Photoluminescence of a-C∶N Films

Amorphous carbon (a-C) films and amorphous carbon films incorporating with the nitrogen (a-C∶N) were deposited on silicon substrates in a radio-frequency driven plasma enhanced chemical vapour deposition system, while the surface electrical properties of films were investigated by electrochemical capacitance-voltage measurements. It was examined the effect of the interface defects on the properties and deduced that the conducting type of a-C∶N films was n-type. Subsequently, a comparative studies of a-C and a-C∶N films were performed by photoluminescence spectra depending on the temperature. With the decrease of the temperature, the main band with peak energy of 2.48 eV in the a-C∶N films was more intense compared with the other three bands caused by amorphous C in the a-C films.     

Effect of type of processing on the microstructural features and mechanical properties of Al-Cu/SiC metal matrix composites

In this study, an aluminum based metallic matrix (Al-2wt.% Cu) was reinforced with SiC particulates using a conventional casting technique and a new disintegrated melt deposition technique. Microstructural characterization studies conducted on the samples taken from disintegrated melt deposition technique revealed a more uniform distribution of SiC particulates and good interfacial integrity between SiC particulates and metallic matrix when compared to the conventionally cast composite samples. Results of ambient temperature mechanical tests demonstrate an increase in 0.2% YS and ultimate tensile strength of samples taken from disintegrated melt deposition technique when compared with the unreinforced and conventionally cast composite samples. The results of microstructural characterization and mechanical testing were finally rationalized in terms of the nature of processing technique employed to reinforce Al-2wt.% Cu metallic matrix with SiC particulates.