Numerical study on methane/air combustion characteristics in a heat-recirculating micro combustor embedded with porous media

Micro-combustor is a portable power device that can provide energy efficiently, heat recirculating is considered to be an important factor affecting the combustion process. For enhancing the heat recirculating and improving the combustion stability, we proposed a heat-recirculating micro-combustor embedded with porous media, and the numerical simulation was carried out by CFD software. In this paper, the effect of porous media materials, thickness and inlet conditions (equivalence ratio, inlet velocity) on the temperature distribution and exhaust species in the micro combustor are investigated. The results showed that compared with the micro combustor without embedded porous media (MCNPM), micro-combustor embedded with porous media (MCEPM) can improve the temperature uniformity distribution in the radial direction and strengthen the preheating capacity. However, it is found that the embedding thickness of porous media should be reasonably arranged. Setting the thickness of porous media to 15 mm, the combustor can obtain excellent comprehensive capacity of steady combustion and heat recirculating. Compared the thermal performance of Al₂O₃, SiC, and ZrO₂ porous media materials, indicating that SiC due to its strong thermal conductivity, its combustion stabilization and heat recirculating capacity are obviously better than that of Al₂O₃ and ZrO₂. With the porous media embedded in the micro combustor, the combustion has a tempering limit of more than 10 m/s, and the flame is blown out of the porous media area over 100 m/s. The reasonable equivalence ratio of CH₄/air combustion should be controlled within the range of 0.1–0.5, and “super-enthalpy combustion” can be realized.     

2020年电子电路技术热点

文章归纳了2020年电子电路产业一些技术热点,主要有5G电路板设计和基材,制造方面半加成法、3D打印、直接金属化孔电镀和垂直互连结构等技术,以及集成电路封装载板技术。     

Material design and development: From classical thermodynamics to CALPHAD and ICME approaches

This paper presents an overview and examples of material design and development using (1) classical thermodynamics; (2) CALPHAD (calculation of phase diagrams) modeling; and (3) Integrated Computational Materials Engineering (ICME) approaches. Although the examples are given in lightweight aluminum and magnesium alloys for structural applications, the fundamental methodology and modeling principles are applicable to all materials and engineering applications. The examples in this paper have demonstrated the effectiveness and limitations of classical thermodynamics in solving specific problems (such as nucleation during solidification and solid-state precipitation in aluminum alloys). Computational thermodynamics and CALPHAD modeling, when combined with critical experimental validation, have been used to guide the selection and design of new magnesium alloys for elevated-temperature applications. The future of material design and development will be based on a holistic ICME approach. However, key challenges exist in many aspects of ICME framework, such as the lack of diffusion/mobility databases for many materials systems, limitation of current microstructural modeling capability and integration tools for simulation codes of different length scales.     

Development of LTCC micro-hotplate with PTC temperature sensor for gas-sensing applications

Low temperature co-fired ceramic (LTCC) micro-hotplates show wide applications in gas sensors and micro-fluidic devices. It is easily structured in three-dimensional structures. This paper presents the low power consumption micro-hotplates which were developed with PTC (positive temperature coefficient) temperature sensor and inter-digitated electrodes. The paper presents two different structures for micro-hotplate with platinum as a heating element. The PTC temperature sensor using two different materials viz. PdAg and platinum paste are developed with micro-hotplates. The simulation has been achieved through COMSOL for LTCC and alumina micro-hotplates. The temperature variation with power consumption has been measured for the developed LTCC micro-hotplates. The change in resistance of PTC temperature sensors was measured with micro-hotplate temperature. The aim of this study was to place a temperature sensor with the gas sensor module to measure and control the temperature of micro-hotplate. A SnO₂ sensing layer is coated on LTCC micro-hotplate using screen printing and characterized for the sensing of carbon monoxide gas (CO). This study will be beneficial for designing hotplates based on LTCC technology with low power consumption and better stability of temperature for gas-sensing applications.     

烧结工艺对液相合成（SrPb）TiO3基陶瓷热敏特性影响的研究

本文在液相合成（ＳｒＰｂ）ＴｉＯ３粉的基础上，研究了升温速率、保温时间、烧结温度及降温方式对（ＳｒＰｂ）ＴｉＯ３基陶瓷的Ｖ型ＰＴＣ热敏特性的影响。实验表明：升温速率对其热敏特性影响不大，保温时间和烧结温度的作用是一致的，具有一最佳范围。而降浊方式对材料的热敏特性影响较大。综合各因素的影响，本配方中，样品的烧结制度定为：以２００℃／ｈ的速率升温，在１２５０℃保温１ｈ，炉冷至９５０℃，保温０．５ｈ，再     

EVA基质PTC特性材料制备与导电机理分析

本文简述了以EVA为基质材料制备有机PTC特性材料的实验,实测了样品有关特性,并用非线性回归方法讨论了其导电机理.这对指导温度传感器的设计有一定帮助.     

PTC热敏电阻的现状与发展趋势(续一)

基于对1995年以来,国内外PTC热敏电阻的研究,介绍了PTC热敏电阻用原料(BaCO3、TiO2、BaTiO3、SrCO3、PbO、Pb3O4、SrTiO3、PbTiO3、Y2O3、Nb2O5、CaCO3、SiO2等);材料(BaTiO3系、V2O3系及高分子);生产技术(瓷粉制造、烧成、芯片制造、质量评定、理化分析、片式PTC生产);重点产品(消磁、马达启动、限流及加热等用)以及基础研究(相变应力模型、表面势垒模型)等方面的现状及今后的发展趋势。     

Free-Edge and Ply Cracking Effect in Angle-Ply Laminated Composites Subjected to In-Plane Loads

This paper presents a semianalytical method for the prediction of interlaminar stresses and displacements near the free edges and ply cracks in general angle-ply laminates subjected to biaxial extensions and/or in plane shear deformation. The method is based on a state space representation of the three-dimensional equations of elasticity. Numerical solutions are obtained by using layer refinement in the through thickness direction and Fourier series expansion in the other directions. By this approach, an angle-ply laminate may be composed of an arbitrary number of monoclinic layers and each layer may have different material property and thickness. This method guarantees continuous fields of all interlaminar stresses across interfaces between material layers. Numerical results are compared with those obtained from other methods. It is found that the theory provides a satisfactory approximation to the stress singularities near the free edges and ply cracks. Numerical solutions for antisymmetric laminates under extension and general laminates under shearing are new in the literature and can be used as benchmarks for validating new models.     

抗氧剂于有机PTC热敏导电材料性能的稳定作用研究

探讨了抗氧剂在聚乙烯 乙烯 醋酸乙烯酯共聚物 炭黑 (PE EVA CB)体系中的作用。结果表明 ,在体系中加入抗氧剂可以提高材料体系的结构稳定性 ,从而可以在一定程度上改善材料的热电稳定性。当在体系中加入 2 .0 %(w)的抗氧剂时可收到良好效果。     

BaTiO_3系PTCR热敏电阻器用烧结助剂的研究

研究了烧结助剂的作用，实验结果表明：如只引入半导化元素，不引入烧结助剂，则室温电阻率ρ２５很大，甚至是绝缘体。由于烧结助剂的加入，既改善了ＰＴＣＲ热敏电阻陶瓷的烧结性，又改善了其ρ２５、耐电压Ｖｂ、ＰＴＣ效应等特性，从而使产品的各种特性易于重复。烧结助剂昔日多用ＡＳＴ，现在常用ＳｉＯ２，其加入量ｘ宜小于２％。ＳｉＯ２的纯度、杂质等化学特性，与粒子形状、粒度分布、晶系等物理特性，对ＰＴＣＲ热敏电阻器的电性能有很大的影响。据此提出了ＢａＴｉＯ３系ＰＴＣＲ热敏电阻器用ＳｉＯ２的技术标准。