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1.
To realize ultimately efficient signal processing, it is necessary to replace electrical signal processing circuits with optical ones. The optical micro-resonator, which localizes light at a certain spot, is an essential component in optical signal processing. Single-crystal calcium fluoride (CaF2) is the most suitable material for a highly efficient optical micro-resonator. The CaF2 resonator can only be manufactured by ultra-precision machining processes, because its crystal anisotropy does not allow the application of chemical etching. However, the optical micro-resonator's performance depends definitely on the surface integrity.This study investigated the relationship between surface quality after ultra-precision machining and crystal anisotropy. Firstly, crack initiation was investigated on the (1 0 0), (1 1 0), and (1 1 1) planes using the micro-Vickers hardness test. Secondly, brittle-ductile transition was investigated by orthogonal cutting tests. Finally, cutting performance of cylindrical turning was evaluated, which could be a suitable method for manufacturing the CaF2 resonator. The most difficult point in cylindrical turning of CaF2 is that the crystalline plane and cutting direction vary continuously. In order to manufacture the CaF2 optical micro-resonator more efficiently, analysis was conducted on crack initiation and surface quality of all crystallographic orientations from the perspective of slip system and cleavage. 相似文献
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在内径120 mm的半圆柱形内循环流化床中,以平均粒径387 nm的Ti O2为原料,考察了单独通入流化气、射流气和同时通入流化气和射流气三种流化方式下超细粉的流化特性以及射流气速对超细粉聚团尺寸的影响。结果表明:同时通入流化气和射流气时,流化气能促进粉体循环,消除环隙死区;高速射流能有效破碎聚团,显著减小聚团尺寸,从而使超细粉在环隙区与导流管之间形成稳定循环,小聚团在环隙区实现平稳流态化。随着射流气速的增大,聚团尺寸减小,粒度分布变窄,在射流气速分别为60,90,120,150 m/s的条件下,聚团平均直径分别为194,158,147,135μm。 相似文献
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Saw-tooth chip changes from macroscopically continuous ribbon to separated segments with the increase of cutting speed. The aim of this study is to find the correlations between chip morphology and machined surface micro-topography at different chip serration stages encountered in high speed cutting. High strength alloy steel AerMet100 was employed in orthogonal cutting experiments to obtain chips at different serration stages and corresponding machined surfaces. The chips and machined surfaces obtained were then examined with optical microscope (OM), scanning electron microscope (SEM), and white light interferometer (WLI). The result shows that chip serration causes micro-waves on machined surface, which increases machined surface roughness. However, wave amplitudes (surface roughness) at different serration stages are different. The principal factor influencing wave amplitude is the thickness of the sawed segment (tooth) of saw-tooth chip. With cutting parameters in this study, surface roughness contributed by chip serration ranges from 0.39 μm to 1.85 μm. This may bring on serious problems in the case of trying to replace grinding with high-speed cutting in rough machining. Some suggestions have been proposed to control the chip serration-caused surface roughness in high-speed cutting based on the results of the current study. 相似文献
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基于传统AI-EBG结构,提出了一种小尺寸的增强型电磁带隙结构,实现了从0.5~9.4 GHz的宽频带-40 dB噪声抑制深度,且下截止频率减少到数百MHz,可有效抑制多层PCB板间地弹噪声。文中同时研究了EBG结构在高速电路应用时的信号完整性问题,使用差分信号方案可改善信号完整性。 相似文献
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宽带DDS跳频源设计 总被引:1,自引:0,他引:1
直接数字合成(DDS)简单可靠、控制方便,具有很高的频率分辨率,高速转换,非常适合快速跳频的要求。在对DDS基本原理进行了简要介绍和分析后,提出宽带跳频源设计方案。 相似文献
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As we approach 100 nm technology the interconnect issues are becoming one of the main concerns in the testing of gigahertz system-on-chips. Voltage distortion (noise) and delay violations (skew) contribute to the signal integrity loss and ultimately functional error, performance degradation and reliability problems. In this paper, we first define a model for integrity faults on the high-speed interconnects. Then, we present a BIST-based test methodology that includes two special cells to detect and measure noise and skew occurring on the interconnects of the gigahertz system-on-chips. Using an inexpensive test architecture the integrity information accumulated by these special cells can be scanned out for final test and reliability analysis. 相似文献
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